AS4C16M32MD1-5BCN

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AS4C16M32MD1-5BCN

IC DRAM 512MBIT PARALLEL 90FBGA

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  • 製造商。 部分 #AS4C16M32MD1-5BCN
  • 包 90-VFBGA
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規格

Supplier Alliance Memory, Inc.
Package Tray
ProductStatus Active
MemoryType Volatile
MemoryFormat DRAM
Technology SDRAM - Mobile LPDDR
MemorySize 512Mb (16M x 32)
MemoryInterface Parallel
ClockFrequency 200 MHz
WriteCycleTime-WordPage 15ns
AccessTime 5 ns
Voltage-Supply 1.7V ~ 1.95V
OperatingTemperature -25°C ~ 85°C (TJ)
MountingType Surface Mount
Package/Case 90-VFBGA

概述

Description

AS4C16M32MD1-5BCN is a memory IC from Alliance Memory, part of the AS4C family. The “16M32M” in the part name generally indicates a 16M-word by 32-bit data- width organization (i.e., a 512 Mbit total capacity) with a wide data bus, suitable for system memory buffers, graphics/frame buffers, or embedded applications. The device is designed for standard memory-interface operation, with a defined voltage range (typical low-voltage options) and timing parameters specified in the datasheet. The “D1” suffix denotes a device revision, while “5BCN” encodes package type, temperature rating, and related mechanical details.
Key notes:
- Expect a 32-bit data path and multi-bank organization
- Look for timing specs (tRC, tMRD, etc.), refresh/burst behavior, and voltage (Vcc) in the datasheet
- Package options and temperature range are determined by the “5BCN” code
For exact electrical specs, timing, and packaging, refer to the official Alliance Memory datasheet for AS4C16M32MD1-5BCN.

Package

TSOP-II package (54-pin).

Pinout

Pin count: 84 pins (FBGA package; exact pinout depends on the specific package).
Function: AS4C16M32MD1-5BCN is a 512-Mbit synchronous DRAM (SDRAM) device with a standard SDRAM interface (address lines A0…Ak, bank lines BA, control signals CS, CK, CKE, RAS, CAS, WE, DQ[15:0], and data-mask lines DM/DMQ as applicable). It supports a wide data path and banked memory via the usual SDRAM control signals. For the precise pinout and package, refer to the datasheet.

Manufacturer

- Manufacturer: Alliance Memory, Inc.
- Company type: A fabless semiconductor company that designs and markets memory ICs (e.g., SRAM/DRAM) and outsources fabrication to foundries.

Application

AS4C16M32MD1-5BCN is a high-speed SRAM used as general-purpose memory in embedded systems. Common applications include:
- Microcontroller/FPGA-based designs needing fast random access
- Frame buffers and data buffers for video/image processing
- Caches and scratchpad memory in SoCs
- Networking/telecom equipment for packet buffering
- Automotive electronics (instrument clusters, infotainment)
- Consumer electronics (set-top boxes, TVs, cameras)
- Industrial and medical devices requiring reliable RAM

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