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XCZU19EG-2FFVC1760I
IC SOC CORTEX-A53 1760FCBGA
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- 包 FBGA-1760
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規格
| Package | Tray |
| Series | Zynq® UltraScale+™ MPSoC EG |
| ProductStatus | Active |
| Architecture | MCU, FPGA |
| CoreProcessor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| RAMSize | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 533MHz, 600MHz, 1.3GHz |
| PrimaryAttributes | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 1760-BBGA, FCBGA |
概述
Description
The XCZU19EG-2FFVC1760I is a versatile System on Chip (SoC) from Xilinx's Zynq UltraScale+ family, designed for high-performance applications in embedded systems, telecommunications, and industrial automation. It features a dual-core ARM Cortex-A53 processor and a real-time ARM Cortex-R5 processor, enabling both high-level processing and real-time control.
This SoC integrates FPGA fabric, providing customizable hardware logic, which allows for parallel processing and optimized performance for specific applications. The XCZU19EG offers significant resources, including up to 19K logic cells, multiple DSP slices for signal processing, and extensive I/O capabilities.
Additionally, it supports various connectivity options, such as PCIe, Ethernet, and serial transceivers, making it suitable for data-intensive applications. The device operates within a wide temperature range, ensuring reliability in different environmental conditions. Overall, the XCZU19EG-2FFVC1760I is ideal for applications requiring high computational power, flexibility, and real-time processing capabilities.
This SoC integrates FPGA fabric, providing customizable hardware logic, which allows for parallel processing and optimized performance for specific applications. The XCZU19EG offers significant resources, including up to 19K logic cells, multiple DSP slices for signal processing, and extensive I/O capabilities.
Additionally, it supports various connectivity options, such as PCIe, Ethernet, and serial transceivers, making it suitable for data-intensive applications. The device operates within a wide temperature range, ensuring reliability in different environmental conditions. Overall, the XCZU19EG-2FFVC1760I is ideal for applications requiring high computational power, flexibility, and real-time processing capabilities.
Features
The XCZU19EG-2FFVC1760I is a member of the Xilinx Zynq UltraScale+ MPSoC family, designed for high-performance, embedded applications. Key features include:
1. Architecture: Combines a powerful ARM Cortex-A53 quad-core processor with an ARM Cortex-R5 dual-core real-time processor for versatile computing capabilities.
2. FPGA Fabric: Integrates a large number of programmable logic resources, including 19,200 LUTs and 39,000 flip-flops, enabling custom hardware acceleration.
3. DSP Slices: Features 1,240 DSP slices for efficient signal processing tasks.
4. Memory Interfaces: Supports various memory interfaces, including DDR4, with up to 2,133 MT/s data rates.
5. Connectivity: Offers multiple high-speed I/O options, including PCIe, USB, and Ethernet, facilitating extensive connectivity.
6. Power Efficiency: Designed for low power consumption with dynamic voltage and frequency scaling.
7. Development Support: Compatible with Xilinx's Vivado Design Suite and SDK for streamlined development.
This device targets applications in automotive, industrial, and telecommunications sectors, providing flexibility and high performance.
1. Architecture: Combines a powerful ARM Cortex-A53 quad-core processor with an ARM Cortex-R5 dual-core real-time processor for versatile computing capabilities.
2. FPGA Fabric: Integrates a large number of programmable logic resources, including 19,200 LUTs and 39,000 flip-flops, enabling custom hardware acceleration.
3. DSP Slices: Features 1,240 DSP slices for efficient signal processing tasks.
4. Memory Interfaces: Supports various memory interfaces, including DDR4, with up to 2,133 MT/s data rates.
5. Connectivity: Offers multiple high-speed I/O options, including PCIe, USB, and Ethernet, facilitating extensive connectivity.
6. Power Efficiency: Designed for low power consumption with dynamic voltage and frequency scaling.
7. Development Support: Compatible with Xilinx's Vivado Design Suite and SDK for streamlined development.
This device targets applications in automotive, industrial, and telecommunications sectors, providing flexibility and high performance.
Package
The XCZU19EG-2FFVC1760I is packaged in a FFG (Fine Fine Pitch Ball Grid Array) package with 1760 balls, designed for high-performance applications in the Zynq UltraScale+ MPSoC family.
Pinout
The XCZU19EG-2FFVC1760I is a part of Xilinx's Zynq UltraScale+ MPSoC family. It features a pin count of 1760 pins.
The device integrates a multiprocessor system-on-chip architecture that includes a dual-core ARM Cortex-A53 processor, a dual-core ARM Cortex-R5 real-time processor, and programmable logic (FPGA). The pins serve various functions, including I/O, power, ground, and dedicated interfaces for communication protocols such as PCIe, USB, Ethernet, and more. The flexibility of the FPGA fabric allows for custom logic design, while the ARM cores handle processing tasks.
This combination makes the XCZU19EG-2FFVC1760I suitable for applications in areas such as automotive, industrial, and communications, where high performance and versatility are required.
The device integrates a multiprocessor system-on-chip architecture that includes a dual-core ARM Cortex-A53 processor, a dual-core ARM Cortex-R5 real-time processor, and programmable logic (FPGA). The pins serve various functions, including I/O, power, ground, and dedicated interfaces for communication protocols such as PCIe, USB, Ethernet, and more. The flexibility of the FPGA fabric allows for custom logic design, while the ARM cores handle processing tasks.
This combination makes the XCZU19EG-2FFVC1760I suitable for applications in areas such as automotive, industrial, and communications, where high performance and versatility are required.
Manufacturer
The XCZU19EG-2FFVC1760I is manufactured by Xilinx, which is now a part of AMD (Advanced Micro Devices). Xilinx is a leading company in the semiconductor industry, known for its development of field-programmable gate arrays (FPGAs), integrated circuits, and software design tools. The XCZU19EG-2FFVC1760I is part of Xilinx’s Zynq UltraScale+ MPSoC family, which combines programmable logic with processing capabilities, making it suitable for a variety of applications, including telecommunications, automotive, and industrial automation. This product line is designed for high-performance computing and offers flexibility in hardware design, addressing the growing need for adaptable and efficient solutions in modern electronic systems.
Application
The XCZU19EG-2FFVC1760I is a versatile FPGA from Xilinx's Zynq UltraScale+ series, commonly used in applications such as high-performance computing, data processing, automotive systems, industrial automation, telecommunications, and machine learning. Its capability for real-time processing, integration of ARM processors, and support for various interfaces make it suitable for edge computing, video processing, and AI workloads in demanding environments.
Equivalent
The XCZU19EG-2FFVC1760I is part of Xilinx's Zynq UltraScale+ MPSoC series. Equivalent products include the XCZU19EG-2FFVC1760E and XCZU19EG-1FFVC1760I, which differ in speed grades and package types. Other similar options are XCZU17EG and XCZU21EG variants, depending on the specific requirements such as performance, resources, and power consumption. Always check compatibility for specific applications.
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