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XCZU19EG-2FFVC1760E
IC SOC CORTEX-A53 1760FCBGA
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- 製造商。 部分 #XCZU19EG-2FFVC1760E
- 包 FBGA-1760
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規格
| Package | Tray |
| Series | Zynq® UltraScale+™ MPSoC EG |
| ProductStatus | Active |
| Architecture | MCU, FPGA |
| CoreProcessor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| RAMSize | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 533MHz, 600MHz, 1.3GHz |
| PrimaryAttributes | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells |
| OperatingTemperature | 0°C ~ 100°C (TJ) |
| Package/Case | 1760-BBGA, FCBGA |
概述
Description
The XCZU19EG-2FFVC1760E is a high-performance FPGA from Xilinx's Zynq UltraScale+ MPSoC family. It combines a multi-core ARM Cortex-A53 processing system with a programmable logic (PL) section, offering a unique architecture ideal for a wide range of applications, including telecommunications, automotive, and industrial automation.
Key features include 19K logic cells, high-speed transceivers, and multiple I/O options, allowing for flexible interfacing with peripherals. The device supports advanced system integration with features like dynamic power management and hardware security, making it suitable for both high-performance and low-power applications.
This model is packaged in a 1760-ball FFG package and operates over a temperature range suitable for industrial applications. The XCZU19EG also supports various development tools, such as Vitis and Vivado, providing a robust ecosystem for design and implementation. Overall, it is designed for engineers seeking to leverage the benefits of both processing and programmable logic on a single chip.
Key features include 19K logic cells, high-speed transceivers, and multiple I/O options, allowing for flexible interfacing with peripherals. The device supports advanced system integration with features like dynamic power management and hardware security, making it suitable for both high-performance and low-power applications.
This model is packaged in a 1760-ball FFG package and operates over a temperature range suitable for industrial applications. The XCZU19EG also supports various development tools, such as Vitis and Vivado, providing a robust ecosystem for design and implementation. Overall, it is designed for engineers seeking to leverage the benefits of both processing and programmable logic on a single chip.
Features
The XCZU19EG-2FFVC1760E is a member of Xilinx's Zynq UltraScale+ MPSoC family, featuring a powerful combination of processing and programmable fabric. Key features include:
1. Architecture: Dual-core Arm Cortex-A53 and dual-core Arm Cortex-R5 processors for versatile application processing.
2. FPGA Fabric: Over 1,000,000 logic cells with a wide range of configurable logic blocks, DSP slices, and I/O resources.
3. High-Speed Interfaces: Supports various interfaces including PCIe Gen 3, USB 3.0, and Gigabit Ethernet.
4. Memory Support: Integrated memory controllers for DDR4 and LPDDR4, enabling high bandwidth and efficiency.
5. Security: Advanced security features such as secure boot and hardware encryption.
6. Power Management: Dynamic power management capabilities for energy-efficient operation.
7. Connectivity: Multiple high-speed transceivers up to 28 Gbps for robust data communication.
Ideal for applications in automotive, industrial, and communications, the XCZU19EG provides a flexible platform for complex processing tasks and real-time control.
1. Architecture: Dual-core Arm Cortex-A53 and dual-core Arm Cortex-R5 processors for versatile application processing.
2. FPGA Fabric: Over 1,000,000 logic cells with a wide range of configurable logic blocks, DSP slices, and I/O resources.
3. High-Speed Interfaces: Supports various interfaces including PCIe Gen 3, USB 3.0, and Gigabit Ethernet.
4. Memory Support: Integrated memory controllers for DDR4 and LPDDR4, enabling high bandwidth and efficiency.
5. Security: Advanced security features such as secure boot and hardware encryption.
6. Power Management: Dynamic power management capabilities for energy-efficient operation.
7. Connectivity: Multiple high-speed transceivers up to 28 Gbps for robust data communication.
Ideal for applications in automotive, industrial, and communications, the XCZU19EG provides a flexible platform for complex processing tasks and real-time control.
Package
The XCZU19EG-2FFVC1760E is packaged in a FFG (Fine-Pitch Flip-Chip Ball Grid Array) format with 1760 balls, designed for high-performance applications and efficient thermal management.
Pinout
The XCZU19EG-2FFVC1760E is a part of the Xilinx Zynq UltraScale+ MPSoC family. It features a pin count of 1760 pins in a Fine Pitch Ball Grid Array (FBGA) package.
This device integrates a quad-core ARM Cortex-A53 processor, a dual-core ARM Cortex-R5 processor, programmable logic (FPGA), and a variety of peripherals. The pin functions include I/O ports for digital signals, power supply pins, ground pins, and dedicated pins for configuration, clocking, and various communication interfaces such as I2C, SPI, UART, and PCIe. Additionally, it supports high-speed transceivers for data communication.
The XCZU19EG is designed for high-performance applications in areas like telecommunications, automotive, and industrial control, providing a blend of software programmability and hardware flexibility.
This device integrates a quad-core ARM Cortex-A53 processor, a dual-core ARM Cortex-R5 processor, programmable logic (FPGA), and a variety of peripherals. The pin functions include I/O ports for digital signals, power supply pins, ground pins, and dedicated pins for configuration, clocking, and various communication interfaces such as I2C, SPI, UART, and PCIe. Additionally, it supports high-speed transceivers for data communication.
The XCZU19EG is designed for high-performance applications in areas like telecommunications, automotive, and industrial control, providing a blend of software programmability and hardware flexibility.
Manufacturer
The manufacturer of the XCZU19EG-2FFVC1760E is Xilinx, Inc., which is a subsidiary of AMD (Advanced Micro Devices, Inc.). Xilinx is a leading company in the field of programmable logic devices, specializing in field-programmable gate arrays (FPGAs), system-on-a-chip (SoC) solutions, and adaptive computing technologies. Founded in 1984, Xilinx pioneered the FPGA market and is known for its innovative products that enable digital design and rapid prototyping in various applications, including telecommunications, automotive, aerospace, and data centers. The XCZU19EG-2FFVC1760E is part of the Zynq UltraScale+ family, which integrates programmable logic with a powerful ARM-based processing system, making it suitable for high-performance and complex computing tasks.
Application
The XCZU19EG-2FFVC1760E is a versatile FPGA from Xilinx's Zynq UltraScale+ family, commonly used in applications such as high-performance computing, automotive systems, industrial automation, telecommunications, and AI/ML inference. Its capabilities support real-time processing, video and image processing, and data aggregation in edge devices, enabling efficient, adaptable solutions in complex embedded systems.
Equivalent
The XCZU19EG-2FFVC1760E is a Zynq UltraScale+ FPGA from Xilinx. Equivalent products include the XCZU19EG-2FFVC1760E's variants with different package options or speed grades, as well as other Zynq UltraScale+ models like XCZU17 or XCZU21, depending on your performance and I/O requirements. Additionally, consider alternatives from other manufacturers such as Intel's Stratix 10 or Lattice Semiconductor's ECP5 series, although they may not have direct feature parity. Always verify the specifications for compatibility with your application.
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