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XCZU17EG-2FFVC1760I
IC SOC CORTEX-A53 1760FCBGA
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- 包 FBGA-1760
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規格
| Package | Tray |
| Series | Zynq® UltraScale+™ MPSoC EG |
| ProductStatus | Active |
| Architecture | MCU, FPGA |
| CoreProcessor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| RAMSize | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 533MHz, 600MHz, 1.3GHz |
| PrimaryAttributes | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 1760-BBGA, FCBGA |
概述
Description
The XCZU17EG-2FFVC1760I is a member of the Xilinx Zynq UltraScale+ MPSoC (Multiprocessor System-on-Chip) family. It combines a powerful ARM Cortex-A53 application processor and an ARM Cortex-R5 real-time processor with programmable FPGA logic, enabling high-performance computing and flexible hardware acceleration.
This particular model features 17,000 logic cells and offers a rich set of I/O options, including high-speed transceivers and support for various interfaces such as PCIe, Ethernet, and USB. It is designed for applications requiring intensive data processing, real-time performance, and customizable hardware, making it suitable for use in industries like telecommunications, automotive, and industrial automation.
The XCZU17EG-2FFVC1760I operates at a nominal voltage of 1.0V and comes in a compact FFG1760 package, making it suitable for space-constrained environments. With its advanced capabilities, this SoC is ideal for developing sophisticated embedded systems that leverage both software and hardware efficiencies.
This particular model features 17,000 logic cells and offers a rich set of I/O options, including high-speed transceivers and support for various interfaces such as PCIe, Ethernet, and USB. It is designed for applications requiring intensive data processing, real-time performance, and customizable hardware, making it suitable for use in industries like telecommunications, automotive, and industrial automation.
The XCZU17EG-2FFVC1760I operates at a nominal voltage of 1.0V and comes in a compact FFG1760 package, making it suitable for space-constrained environments. With its advanced capabilities, this SoC is ideal for developing sophisticated embedded systems that leverage both software and hardware efficiencies.
Features
The XCZU17EG-2FFVC1760I is a versatile System-on-Chip (SoC) from Xilinx's Zynq UltraScale+ family, designed for high-performance applications. Key features include:
1. Architecture: Combines a quad-core ARM Cortex-A53 processor with a dual-core ARM Cortex-R5 real-time processing unit, enabling efficient processing for varied tasks.
2. FPGA Fabric: Offers a significant amount of programmable Logic resources, including 17,580 LUTs and 3,828 Kbits of block RAM, allowing custom hardware implementations.
3. DSP: Equipped with high-performance DSP slices, facilitating complex signal processing tasks.
4. I/O Capabilities: Supports various I/O standards and protocols, including high-speed transceivers (up to 16.3 Gbps), making it suitable for communication interfaces.
5. Memory Interfaces: Provides support for DDR4/DDR3 memory interfaces, enhancing the system's memory bandwidth.
6. Power Efficiency: Designed for low power consumption, making it suitable for embedded and portable applications.
The XCZU17EG-2FFVC1760I is ideal for applications like automotive, industrial automation, and telecommunications due to its balance of processing power and flexibility.
1. Architecture: Combines a quad-core ARM Cortex-A53 processor with a dual-core ARM Cortex-R5 real-time processing unit, enabling efficient processing for varied tasks.
2. FPGA Fabric: Offers a significant amount of programmable Logic resources, including 17,580 LUTs and 3,828 Kbits of block RAM, allowing custom hardware implementations.
3. DSP: Equipped with high-performance DSP slices, facilitating complex signal processing tasks.
4. I/O Capabilities: Supports various I/O standards and protocols, including high-speed transceivers (up to 16.3 Gbps), making it suitable for communication interfaces.
5. Memory Interfaces: Provides support for DDR4/DDR3 memory interfaces, enhancing the system's memory bandwidth.
6. Power Efficiency: Designed for low power consumption, making it suitable for embedded and portable applications.
The XCZU17EG-2FFVC1760I is ideal for applications like automotive, industrial automation, and telecommunications due to its balance of processing power and flexibility.
Package
The XCZU17EG-2FFVC1760I is housed in a FFG (Fine Line Ball Grid Array) package, specifically a 1760-ball configuration. This package type is designed for high I/O applications and offers improved thermal performance and reduced inductance for enhanced signal integrity.
Pinout
The XCZU17EG-2FFVC1760I is part of the Xilinx Zynq UltraScale+ MPSoC family and features a pin count of 1760. This device integrates a dual-core ARM Cortex-A53 processor, a dual-core ARM Cortex-R5 real-time processor, and programmable logic (FPGA) along with various interfaces.
The pin functions include power supply pins, ground pins, I/O pins, configuration pins, and various specialized interfaces for high-speed communication like PCIe, USB, and Ethernet. Additionally, it provides support for multiple protocols such as I2C, SPI, and UART. The device is designed for applications in industrial, automotive, and telecommunications sectors, offering flexibility in design and integration for complex systems.
The pin functions include power supply pins, ground pins, I/O pins, configuration pins, and various specialized interfaces for high-speed communication like PCIe, USB, and Ethernet. Additionally, it provides support for multiple protocols such as I2C, SPI, and UART. The device is designed for applications in industrial, automotive, and telecommunications sectors, offering flexibility in design and integration for complex systems.
Manufacturer
The XCZU17EG-2FFVC1760I is manufactured by Xilinx, Inc., a company that specializes in programmable logic devices and solutions. Xilinx is known for its development of FPGAs (Field-Programmable Gate Arrays), SoCs (System on Chips), and other related technologies. Founded in 1984, Xilinx was a pioneer in the FPGA industry and has since expanded its product offerings to include complex programmable logic devices (CPLDs) and software development tools. The company primarily serves various markets, including telecommunications, automotive, aerospace, defense, industrial, and consumer electronics. Xilinx is recognized for its innovation in reconfigurable computing and plays a significant role in advancing technologies such as artificial intelligence, machine learning, and high-speed data processing. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), further broadening its capabilities and market reach.
Application
The XCZU17EG-2FFVC1760I is a versatile FPGA from Xilinx's Zynq UltraScale+ family, ideal for applications such as data processing, machine learning, video processing, and high-performance computing. It is commonly used in telecommunications, industrial automation, automotive systems, and medical devices, leveraging its processing power, programmable logic, and integrated ARM processors for real-time data analysis and control.
Equivalent
The XCZU17EG-2FFVC1760I is part of the Xilinx Zynq UltraScale+ MPSoC family. Equivalent products include the XCZU19EG, XCZU21EG, and XCZU28DR devices, which offer similar processing capabilities but vary in performance, logic capacity, and I/O configurations. When seeking alternatives, consider specific application requirements, such as resource needs and power consumption. Always verify compatibility based on your project specifications.
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