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XCZU15EG-L1FFVB1156I
IC SOC CORTEX-A53 1156FCBGA
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規格
| Package | Tray |
| Series | Zynq® UltraScale+™ MPSoC EG |
| ProductStatus | Active |
| Architecture | MCU, FPGA |
| CoreProcessor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| RAMSize | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 500MHz, 600MHz, 1.2GHz |
| PrimaryAttributes | Zynq®UltraScale+™ FPGA, 747K+ Logic Cells |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 1156-BBGA, FCBGA |
概述
Description
The XCZU15EG-L1FFVB1156I is a high-performance System-on-Chip (SoC) from Xilinx's Zynq UltraScale+ MPSoC family. It integrates a quad-core ARM Cortex-A53 processor with a dual-core ARM Cortex-R5 real-time processor and programmable logic, allowing for flexible and efficient processing capabilities.
Key features include:
1. Processing Power: The ARM Cortex-A53 cores are designed for high-performance applications, while the Cortex-R5 cores excel in real-time processing tasks.
2. FPGA Fabric: It includes a significant amount of programmable logic, enabling custom hardware acceleration and parallel processing for specific applications.
3. Connectivity: The SoC supports various communication interfaces, including PCIe, Ethernet, and USB, making it suitable for a wide range of applications.
4. Applications: Commonly used in embedded systems, industrial automation, automotive, and data acquisition applications due to its versatility and performance.
This device is ideal for developers looking to leverage both processing and hardware customization in a single platform.
Key features include:
1. Processing Power: The ARM Cortex-A53 cores are designed for high-performance applications, while the Cortex-R5 cores excel in real-time processing tasks.
2. FPGA Fabric: It includes a significant amount of programmable logic, enabling custom hardware acceleration and parallel processing for specific applications.
3. Connectivity: The SoC supports various communication interfaces, including PCIe, Ethernet, and USB, making it suitable for a wide range of applications.
4. Applications: Commonly used in embedded systems, industrial automation, automotive, and data acquisition applications due to its versatility and performance.
This device is ideal for developers looking to leverage both processing and hardware customization in a single platform.
Features
The XCZU15EG-L1FFVB1156I is a SoC (System on Chip) from Xilinx's Zynq UltraScale+ family. Key features include:
1. Architecture: Combines a quad-core ARM Cortex-A53 processor with a dual-core ARM Cortex-R5 real-time processor and programmable logic (FPGA).
2. Performance: Offers high-performance processing capabilities with a maximum clock frequency of up to 1.5 GHz.
3. Logic Cells: Contains over 15,000 logic cells, enabling complex designs.
4. Memory: Supports up to 4MB of on-chip SRAM and integrates various memory interfaces, including DDR4 and LPDDR4.
5. I/O Options: Features a range of I/O standards and interfaces, including USB, PCIe, and Ethernet.
6. Power Efficiency: Designed for low power consumption while delivering high performance, suitable for embedded applications.
7. Development Tools: Compatible with Xilinx Vivado Design Suite and Vitis for streamlined development.
This SoC is ideal for applications in automotive, industrial, and communication sectors.
1. Architecture: Combines a quad-core ARM Cortex-A53 processor with a dual-core ARM Cortex-R5 real-time processor and programmable logic (FPGA).
2. Performance: Offers high-performance processing capabilities with a maximum clock frequency of up to 1.5 GHz.
3. Logic Cells: Contains over 15,000 logic cells, enabling complex designs.
4. Memory: Supports up to 4MB of on-chip SRAM and integrates various memory interfaces, including DDR4 and LPDDR4.
5. I/O Options: Features a range of I/O standards and interfaces, including USB, PCIe, and Ethernet.
6. Power Efficiency: Designed for low power consumption while delivering high performance, suitable for embedded applications.
7. Development Tools: Compatible with Xilinx Vivado Design Suite and Vitis for streamlined development.
This SoC is ideal for applications in automotive, industrial, and communication sectors.
Package
The XCZU15EG-L1FFVB1156I is packaged in a FFG (Fine Pitch Ball Grid Array) package type. This specific package has 1156 balls and is designed for high-performance applications, offering efficient thermal and electrical characteristics.
Pinout
The XCZU15EG-L1FFVB1156I is a member of the Xilinx Zynq UltraScale+ MPSoC family. It features a total pin count of 1156.
This device integrates a powerful combination of Processing System (PS) and Programmable Logic (PL), making it suitable for a variety of applications including embedded processing, signal processing, and high-performance computing. The device includes ARM Cortex-A53 and Cortex-R5 cores, along with a range of interfaces for connectivity, such as PCIe, USB, and Ethernet.
Additionally, it supports various I/O configurations, including high-speed transceivers, GPIOs, and memory interfaces, enabling it to connect with a diverse array of peripherals and systems. The Zynq UltraScale+ architecture allows for significant flexibility and scalability in design, catering to both consumer and industrial applications.
This device integrates a powerful combination of Processing System (PS) and Programmable Logic (PL), making it suitable for a variety of applications including embedded processing, signal processing, and high-performance computing. The device includes ARM Cortex-A53 and Cortex-R5 cores, along with a range of interfaces for connectivity, such as PCIe, USB, and Ethernet.
Additionally, it supports various I/O configurations, including high-speed transceivers, GPIOs, and memory interfaces, enabling it to connect with a diverse array of peripherals and systems. The Zynq UltraScale+ architecture allows for significant flexibility and scalability in design, catering to both consumer and industrial applications.
Manufacturer
The XCZU15EG-L1FFVB1156I is manufactured by Xilinx, Inc., which is a leading company in the field of programmable logic devices and FPGAs (Field Programmable Gate Arrays). Xilinx specializes in advanced semiconductor technology, offering products that support a wide range of applications, including telecommunications, automotive, aerospace, and industrial automation.
The XCZU15EG is part of the Zynq UltraScale+ family, which integrates a processing system with programmable logic, allowing for high performance and flexibility in system design. Xilinx is known for its innovation in reconfigurable computing and has a strong focus on enabling engineers to create complex, customizable solutions. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), further expanding its capabilities and resources in the semiconductor market.
The XCZU15EG is part of the Zynq UltraScale+ family, which integrates a processing system with programmable logic, allowing for high performance and flexibility in system design. Xilinx is known for its innovation in reconfigurable computing and has a strong focus on enabling engineers to create complex, customizable solutions. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), further expanding its capabilities and resources in the semiconductor market.
Application
The XCZU15EG-L1FFVB1156I is a versatile System on Chip (SoC) from Xilinx's Zynq UltraScale+ series, suitable for various applications, including industrial automation, robotics, automotive, telecommunications, medical imaging, and machine learning. Its combination of programmable logic and ARM processing capabilities enables performance optimization in real-time data processing, high-speed communication, and complex algorithm execution across diverse sectors.
Equivalent
The XCZU15EG-L1FFVB1156I chip is part of Xilinx's Zynq UltraScale+ MPSoC family. Equivalent products include the XCZU9EG, XCZU13EG, and other Zynq UltraScale+ models with similar specifications but varying resources, performance, and power characteristics. For specific applications, check the individual datasheets for exact feature comparisons.
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