圖片僅供參考
XCZU15EG-2FFVC900I
IC SOC CORTEX-A53 900FCBGA
- 製造商
- 製造商。 部分 #XCZU15EG-2FFVC900I
- 包 FBGA-900
- 資料表
- 有現貨的2036
100%原創; 新
24小時準備發貨
365天保修
RFQ&; 獲得更多折扣
規格
| Package | Tray |
| Series | Zynq® UltraScale+™ MPSoC EG |
| ProductStatus | Active |
| Architecture | MCU, FPGA |
| CoreProcessor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| RAMSize | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 533MHz, 600MHz, 1.3GHz |
| PrimaryAttributes | Zynq®UltraScale+™ FPGA, 747K+ Logic Cells |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 900-BBGA, FCBGA |
概述
Description
The XCZU15EG-2FFVC900I is a member of Xilinx's Zynq UltraScale+ MPSoC family, designed for high-performance applications. It combines a processing system (PS) with programmable logic (PL), integrating a dual-core ARM Cortex-A53 processor, a dual-core ARM Cortex-R5 real-time processor, and a high-performance FPGA fabric. This SoC is ideal for applications requiring both software programmability and hardware acceleration, such as in telecommunications, automotive, industrial automation, and machine learning.
With 15K logic cells, a large number of DSP slices, and multiple I/O options, the XCZU15EG enables complex designs while maintaining efficient power consumption. It features advanced connectivity options, including PCIe, Ethernet, and USB, as well as support for various memory interfaces like DDR4. The device operates at a maximum frequency of 1.5 GHz, ensuring robust performance for demanding tasks. Its flexible architecture allows developers to tailor solutions for diverse applications, making it a popular choice in embedded systems and high-throughput processing environments.
With 15K logic cells, a large number of DSP slices, and multiple I/O options, the XCZU15EG enables complex designs while maintaining efficient power consumption. It features advanced connectivity options, including PCIe, Ethernet, and USB, as well as support for various memory interfaces like DDR4. The device operates at a maximum frequency of 1.5 GHz, ensuring robust performance for demanding tasks. Its flexible architecture allows developers to tailor solutions for diverse applications, making it a popular choice in embedded systems and high-throughput processing environments.
Features
The XCZU15EG-2FFVC900I is a high-performance SoC (System on Chip) from Xilinx's Zynq UltraScale+ family. It integrates a powerful ARM Cortex-A53 quad-core processor and a dual-core ARM Cortex-R5 processor, along with programmable logic fabric based on FPGA architecture. Key features include:
1. FPGA Logic Resources: Up to 15,000 logic cells for customizable hardware acceleration.
2. Memory: Supports up to 8 MB of embedded memory, with options for DDR4/LPDDR4 memory interfaces.
3. I/O Capabilities: Multiple high-speed I/O options, including PCIe Gen 3, USB 3.0, and Gigabit Ethernet.
4. DSP Slices: Around 60 DSP slices for high-performance signal processing.
5. Integrated Security: Features like secure boot and hardware encryption.
6. Thermal Performance: Designed for reliable operation in various environments, with a typical junction temperature range.
Overall, the XCZU15EG-2FFVC900I is suited for applications in automotive, industrial, and communications sectors, providing a blend of processing power and flexibility.
1. FPGA Logic Resources: Up to 15,000 logic cells for customizable hardware acceleration.
2. Memory: Supports up to 8 MB of embedded memory, with options for DDR4/LPDDR4 memory interfaces.
3. I/O Capabilities: Multiple high-speed I/O options, including PCIe Gen 3, USB 3.0, and Gigabit Ethernet.
4. DSP Slices: Around 60 DSP slices for high-performance signal processing.
5. Integrated Security: Features like secure boot and hardware encryption.
6. Thermal Performance: Designed for reliable operation in various environments, with a typical junction temperature range.
Overall, the XCZU15EG-2FFVC900I is suited for applications in automotive, industrial, and communications sectors, providing a blend of processing power and flexibility.
Package
The XCZU15EG-2FFVC900I is packaged in a FFG (Fine Fine Pitch Ball Grid Array) format, specifically a 900-ball configuration. This type of package is designed for high-density applications, providing efficient thermal performance and electrical connectivity.
Pinout
The XCZU15EG-2FFVC900I is a Xilinx Zynq UltraScale+ MPSoC, featuring a total of 900 I/O pins. Its primary functions include processing through a combination of programmable logic (FPGA) and ARM Cortex-A53 and Cortex-R5 processors, enabling a wide range of applications from embedded systems to high-performance computing.
The pin configuration includes various I/O standards and interfaces such as LVDS, LVCMOS, and high-speed transceivers, supporting connectivity for peripherals, memory, and other integrated circuits. The device also includes dedicated pins for power, ground, and configuration, as well as support for features like JTAG and clocks.
This combination of features makes the XCZU15EG ideal for complex designs requiring flexibility and high performance in areas such as telecommunications, automotive, and industrial applications.
The pin configuration includes various I/O standards and interfaces such as LVDS, LVCMOS, and high-speed transceivers, supporting connectivity for peripherals, memory, and other integrated circuits. The device also includes dedicated pins for power, ground, and configuration, as well as support for features like JTAG and clocks.
This combination of features makes the XCZU15EG ideal for complex designs requiring flexibility and high performance in areas such as telecommunications, automotive, and industrial applications.
Manufacturer
The manufacturer of the XCZU15EG-2FFVC900I is Xilinx, Inc., which is now part of AMD (Advanced Micro Devices, Inc.). Xilinx is a leading company in the field of programmable logic devices, particularly known for its development of field-programmable gate arrays (FPGAs), system-on-chips (SoCs), and adaptive computing solutions.
Founded in 1984, Xilinx pioneered the FPGA technology, enabling engineers to create customizable hardware solutions for a wide range of applications, including telecommunications, automotive, aerospace, and data centers. The company focuses on providing high-performance, flexible hardware that can be configured for specific tasks, making it a key player in the semiconductor industry. After AMD acquired Xilinx in 2022, the combined entity aims to enhance its capabilities in adaptive and intelligent computing solutions.
Founded in 1984, Xilinx pioneered the FPGA technology, enabling engineers to create customizable hardware solutions for a wide range of applications, including telecommunications, automotive, aerospace, and data centers. The company focuses on providing high-performance, flexible hardware that can be configured for specific tasks, making it a key player in the semiconductor industry. After AMD acquired Xilinx in 2022, the combined entity aims to enhance its capabilities in adaptive and intelligent computing solutions.
Application
The XCZU15EG-2FFVC900I is a versatile SoC (System on Chip) from Xilinx's Zynq UltraScale+ family, suitable for applications in embedded vision, industrial automation, automotive systems, medical imaging, telecommunications, and data centers. Its capabilities in high-performance computing, real-time processing, and extensive I/O support make it ideal for applications requiring complex algorithms and fast data handling, such as AI inference, machine learning, and edge computing.
Equivalent
The XCZU15EG-2FFVC900I is a Zynq UltraScale+ MPSoC from Xilinx. Equivalent products include the XCZU13EG, XCZU19EG, and other Zynq UltraScale+ devices within the same family, depending on specific requirements like performance, I/O count, and features. For applications requiring similar capabilities, consider other Zynq or FPGA products from Xilinx or competing vendors like Intel (Altera) or Lattice Semiconductor, but ensure compatibility with the design requirements.
船舶
運輸管道我們
通過DHL、FedEx、TNT、UPS或您選擇的任何其他貨運代理提供全球運輸服務。
運費參攷(DHL/FedEx):
動態主要裝載: 運費從25美元到45美元(0.5公斤)不等,預計交貨時間為2-5個工作日。
聯邦快遞: 運費從25美元到40美元(0.5公斤)不等,預計交貨時間為3-7個工作日。
不斷電供應系統: 運費從25美元到45美元(0.5公斤)不等,預計交貨時間為3-7個工作日。
三硝基甲苯: 運費從25美元到65美元(0.5公斤)不等,預計交貨時間為3-7個工作日。
增强型短消息: 運費從30美元到50美元(0.5公斤)不等,預計交貨時間為7-15個工作日。
掛號: 運費為2-4美元(0.1公斤),預計交貨時間為5-20個工作日。
支付
Payment Methods
付款條件為100%預付。
現時,我們只接受以下付款方式:
1. 貝寶
2. 信用卡/借記卡
3. 電匯
類似的
-
MX25L3233FZBI-08Q
Macronix
-
MX25L3233FM1I-08Q
Macronix
-
MX25V1635FZNI
Macronix
-
MX25V1635FZNQ03
Macronix
-
MX29F400CBTI-70G
Macronix
-
MX25V5126FM1I
Macronix
-
MX30LF2G28AD-TI
Macronix
-
MX25R6435FBDIL0
Macronix
-
MX25L25673GMI-10G
Macronix
-
MX25L2006EM1I-12G
Macronix
-
MX25V1635FM2I
Macronix
-
MX25U3232FZBI02
Macronix