圖片僅供參考

XCV600E-6FG676I

Name: XCV600E-6FG676I
Rating: 4.7 (12 reviews)

IC FPGA 444 I/O 676FCBGA

製造商
製造商。部分 #XCV600E-6FG676I
包 676-BGA
資料表
有現貨的9494

+BOM RFQ

100%原創；新

24小時準備發貨

365天保修

RFQ&；獲得更多折扣

規格

Supplier	AMD Xilinx
Package	Tray
Series	Virtex®-E
ProductStatus	Obsolete
NumberofLABs/CLBs	3456
NumberofLogicElements/Cells	15552
TotalRAMBits	294912
NumberofI/O	444
NumberofGates	985882
Voltage-Supply	1.71V ~ 1.89V
MountingType	Surface Mount
OperatingTemperature	-40°C ~ 100°C (TJ)
Package/Case	676-BGA

概述

Description

XCV600E-6FG676I is a Xilinx Virtex‑E FPGA. The name encodes: Virtex‑E family, device “XC V600E,” speed grade -6, in an FG676 fine‑pitch 676‑pin package, industrial temperature range (I). It’s a large, reconfigurable logic device built around configurable logic blocks (LUTs/flip‑flops) with substantial Block RAM, DSP slices, and multiple I/O banks for high‑performance, parallel digital designs. As an SRAM‑based FPGA, it is programmed from an external PROM/Flash and then used for complex logic, signal processing, communications, or custom accelerators. Programming is done with Xilinx tools (ISE/WebPACK, etc.) and downloaded via JTAG or configuration memory. It represents an older Virtex‑E device but may still appear in legacy systems or preserved designs.

Features

XCV600E-6FG676I is a Virtex-E FPGA. Key features:
- Density: ~600K logic gates (Virtex-E class)
- Package: FG676 (676-pin fine-pitch BGA)
- Speed grade: -6 (fast)
- I/O: up to roughly 240+ general-purpose I/Os
- On-chip resources: block RAM (embedded RAM blocks) and distributed RAM
- DSP/MAC: dedicated multipliers/DSP resources
- Clocking: PLLs and global clock networks
- Serialization/communication: standard FPGA I/O capabilities and high-speed I/O options
- Reprogrammability: in-system programmable with JTAG
- Power/voltage: compatible with typical Virtex-E I/O voltages; RoHS-compliant (I suffix)
Note: exact counts (logic cells, RAM, DSP blocks, I/O) can vary by device revision; consult the datasheet for precise specifications.

Package

FG676 — a 676-ball Flip-Chip Ball Grid Array (FCBGA) package, industrial temperature range (I).

Pinout

- Pin count: 676 pins in the FG676 FineLine BGA package.
- Function: Xilinx Virtex-XCV600E FPGA device (industrial grade), a programmable logic fabric with multiple I/O banks and built-in configuration/JTAG interfaces for implementing custom digital circuits.

Manufacturer

Manufacturer: Xilinx, Inc. (now a division of AMD).
What kind of company: An American multinational semiconductor company that designs and markets programmable logic devices, principally FPGAs and CPLDs, plus related software.

Application

XCV600E-6FG676I is a high-density Virtex-E FPGA in a 676-pin package. Typical applications: telecom/data communications (packet processing, protocol offload); digital signal processing (baseband/RF/modulation and filtering); video/image processing and machine vision; embedded processing and hardware accelerators; aerospace/defense electronics; industrial automation and test/measurement equipment; prototyping and SDR/hardware acceleration.