圖片僅供參考
XCKU9P-2FFVE900I
IC FPGA 304 I/O 900FCBGA
- 製造商
- 製造商。 部分 #XCKU9P-2FFVE900I
- 包
- 資料表
- 有現貨的9583
100%原創; 新
24小時準備發貨
365天保修
RFQ&; 獲得更多折扣
規格
| Series | Kintex® UltraScale+™ |
| Part Status | Active |
| DigiKey Programmable | Not Verified |
| Number of Logic Elements/Cells | 599550 |
| Total RAM Bits | 41881600 |
| Number of I/O | 304 |
| Voltage - Supply | 0.825V ~ 0.876V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 900-BBGA, FCBGA |
| Supplier Device Package | 900-FCBGA (31x31) |
| Base Product Number | XCKU9 |
| Number of LABs/CLBs | 34260 |
概述
Description
The XCKU9P-2FFVE900I is a high-performance FPGA (Field-Programmable Gate Array) from Xilinx's Kintex UltraScale+ family. Designed for demanding applications such as data centers, telecommunications, and high-speed computing, it offers enhanced processing capabilities, flexibility, and efficiency.
Key features include:
- Architecture: Utilizes the UltraScale+ architecture for improved power efficiency and performance.
- Logic Resources: Contains around 9 million system logic cells, providing substantial combinatorial and sequential logic capabilities.
- I/O: Supports various high-speed I/O standards, making it suitable for interfacing with multiple external devices.
- Memory: Offers embedded memory resources, including Block RAM and UltraRAM for efficient data storage.
- Applications: Commonly used in applications that require high-speed signal processing, AI inference, and complex algorithm implementations.
Overall, the XCKU9P-2FFVE900I is ideal for engineers looking to create customizable hardware solutions in a compact, energy-efficient package.
Key features include:
- Architecture: Utilizes the UltraScale+ architecture for improved power efficiency and performance.
- Logic Resources: Contains around 9 million system logic cells, providing substantial combinatorial and sequential logic capabilities.
- I/O: Supports various high-speed I/O standards, making it suitable for interfacing with multiple external devices.
- Memory: Offers embedded memory resources, including Block RAM and UltraRAM for efficient data storage.
- Applications: Commonly used in applications that require high-speed signal processing, AI inference, and complex algorithm implementations.
Overall, the XCKU9P-2FFVE900I is ideal for engineers looking to create customizable hardware solutions in a compact, energy-efficient package.
Features
The XCKU9P-2FFVE900I is a member of Xilinx's Kintex UltraScale FPGA family, designed for high-performance applications. Key features include:
1. Logic Cells: Offers approximately 9,100 logic cells, allowing for complex designs and parallel processing.
2. DSP Slices: Equipped with 360 DSP slices for efficient digital signal processing tasks.
3. Memory: Supports up to 4.9 Mb of block RAM and additional UltraRAM for large data storage.
4. I/O Support: Features up to 240 I/O pins with flexible standards, including LVDS and HSTL.
5. High-Speed Transceivers: Includes 16 transceivers capable of up to 12.5 Gbps for high-bandwidth data transfers.
6. Power Efficiency: Designed for lower power consumption, making it suitable for energy-sensitive applications.
7. Advanced Features: Supports PCIe Gen3, configuration over USB, and integrated security features.
Ideal for applications in telecommunications, data centers, and embedded systems, the XCKU9P provides a balance of performance, flexibility, and efficiency.
1. Logic Cells: Offers approximately 9,100 logic cells, allowing for complex designs and parallel processing.
2. DSP Slices: Equipped with 360 DSP slices for efficient digital signal processing tasks.
3. Memory: Supports up to 4.9 Mb of block RAM and additional UltraRAM for large data storage.
4. I/O Support: Features up to 240 I/O pins with flexible standards, including LVDS and HSTL.
5. High-Speed Transceivers: Includes 16 transceivers capable of up to 12.5 Gbps for high-bandwidth data transfers.
6. Power Efficiency: Designed for lower power consumption, making it suitable for energy-sensitive applications.
7. Advanced Features: Supports PCIe Gen3, configuration over USB, and integrated security features.
Ideal for applications in telecommunications, data centers, and embedded systems, the XCKU9P provides a balance of performance, flexibility, and efficiency.
Package
The XCKU9P-2FFVE900I is packaged in a Flip-Chip Ball Grid Array (FCBGA) format, specifically a 900-ball configuration. This type of package is designed for high-density integration and improved thermal performance in high-performance applications.
Pinout
The XCKU9P-2FFVE900I is a member of the Xilinx Kintex UltraScale FPGA family. It features a total of 900 pins. This device is designed for high-performance applications, offering a range of functionalities including configurable logic blocks, digital signal processing (DSP) slices, and high-speed transceivers. The FPGA is particularly suited for applications requiring high throughput and low latency, such as telecommunications, data processing, and embedded systems. The package type (FFVE900) indicates that it is a FFG (Fine Pitch Ball Grid Array) format, which allows for efficient thermal and electrical performance. The "I" at the end denotes the industrial grade, indicating that it can operate in a broader temperature range suitable for industrial environments.
Manufacturer
The XCKU9P-2FFVE900I is manufactured by Xilinx, Inc., a company known for its development of programmable logic devices, including FPGAs (Field-Programmable Gate Arrays), SoCs (System on Chips), and other semiconductor products. Xilinx specializes in high-performance computing and flexible hardware solutions tailored for various applications, such as telecommunications, automotive, aerospace, industrial automation, and data processing. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), further enhancing its capabilities in the semiconductor market. The company is recognized for its innovative technologies and contributions to the fields of digital design and embedded systems.
Application
The XCKU9P-2FFVE900I is a high-performance FPGA from Xilinx's UltraScale+ series, suitable for various application areas, including telecommunications, data centers, high-performance computing, video processing, machine learning, and embedded systems. It excels in tasks requiring parallel processing, real-time data analysis, and custom hardware acceleration, making it ideal for industries like automotive, aerospace, defense, and industrial automation.
Equivalent
The XCKU9P-2FFVE900I is a part of the Xilinx Kintex UltraScale FPGA family. Equivalent products include the XCKU9P-1FFVE900I, which offers a lower performance option, and the XCKU9P-3FFVE900I, providing higher performance. Other alternatives may include similar FPGAs from different vendors, such as Intel's Arria 10 or Lattice Semiconductor's ECP5 series, depending on specific application requirements. Always verify compatibility based on power, I/O, and resource needs.
船舶
運輸管道我們
通過DHL、FedEx、TNT、UPS或您選擇的任何其他貨運代理提供全球運輸服務。
運費參攷(DHL/FedEx):
動態主要裝載: 運費從25美元到45美元(0.5公斤)不等,預計交貨時間為2-5個工作日。
聯邦快遞: 運費從25美元到40美元(0.5公斤)不等,預計交貨時間為3-7個工作日。
不斷電供應系統: 運費從25美元到45美元(0.5公斤)不等,預計交貨時間為3-7個工作日。
三硝基甲苯: 運費從25美元到65美元(0.5公斤)不等,預計交貨時間為3-7個工作日。
增强型短消息: 運費從30美元到50美元(0.5公斤)不等,預計交貨時間為7-15個工作日。
掛號: 運費為2-4美元(0.1公斤),預計交貨時間為5-20個工作日。
支付
Payment Methods
付款條件為100%預付。
現時,我們只接受以下付款方式:
1. 貝寶
2. 信用卡/借記卡
3. 電匯
類似的
-
MX25L3233FZBI-08Q
Macronix
-
MX25L3233FM1I-08Q
Macronix
-
MX25V1635FZNQ03
Macronix
-
MX25R3235FZNIL0
Macronix
-
MX25U51279GXDR00
Macronix
-
MX25U3232FZBI02
Macronix
-
MX25L6433FM2I-08G
Macronix
-
MX25U6435FM2I-10G
Macronix
-
MX25L12833FZNI-10..
Macronix
-
MX25U25645GXDI00
Macronix
-
MX29F040CQI-70G
Macronix
-
MX25L25645GXDI-08..
Macronix