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XCKU095-2FFVC1517I

Name: XCKU095-2FFVC1517I
Rating: 4.7 (12 reviews)

IC FPGA 520 I/O 1517FCBGA

製造商
製造商。部分 #XCKU095-2FFVC1517I
包 1517-BBGA, FCBGA
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規格

Supplier	AMD Xilinx
Package	Bulk
Series	Kintex® UltraScale™
ProductStatus	Active
NumberofLABs/CLBs	67200
NumberofLogicElements/Cells	1176000
TotalRAMBits	60518400
NumberofI/O	520
Voltage-Supply	0.922V ~ 0.979V
MountingType	Surface Mount
OperatingTemperature	-40°C ~ 100°C (TJ)
Package/Case	1517-BBGA, FCBGA

概述

Description

XCKU095-2FFVC1517I is a Kintex UltraScale FPGA from Xilinx. It targets mid-to-high density applications with about 95k logic cells, plus DSP blocks, block RAM, and high-speed SERDES, all on the UltraScale architecture. The -2 speed grade indicates mid-range timing performance. The device is in an FFVC1517 package (Flip-Chip, Fine-pitch BGA) with 1517 balls and is rated for industrial temperature operation (-40°C to 100°C). It provides extensive I/O and transceivers suitable for demanding DSP, networking, and embedded designs. Designed for use with the Xilinx Vivado design suite and IP cores, you’ll need appropriate power/thermal planning for industrial conditions.

Features

Key features of XCKU095-2FFVC1517I (Kintex UltraScale) in a concise form:
- Kintex UltraScale FPGA family with dense logic, DSP, and high-performance fabric.
- Large on-chip resources: substantial LUTs/FFs, numerous DSP48E2 blocks.
- On-chip memory: BRAM and UltraRAM blocks for flexible data storage.
- High-speed serial transceivers: multi-Gbps GTx/GTH-style SERDES for rapid data links.
- Hardened IP options: PCIe hard IP and memory controller interfaces (e.g., DDR3/DDR4) for common interfaces.
- Flexible clocking: robust MMCMs/PLLs and clock routing for tight timing.
- Partial reconfiguration capability for dynamic reprogramming.
- Rich I/O: many I/O banks with various standards and voltage tolerances.
- Security and reliability features: device DNA, basic crypto/security support.
- Package: FFVC1517I (flip-chip, 1517-ball) with industrial temperature range (-40 to 100 C).
Ideal for high-performance, cost-efficient data processing, communications, and embedded applications where density and transceiver performance matter.

Package

Package type: Flip-Chip Ball Grid Array (FCBGA) – 1517-ball, 15×17 mm footprint; Industrial temperature variant (I).

Pinout

- Pin count: 1517 pins (FFVC1517 Flip-Chip BGA)
- Function: XCKU095 Kintex UltraScale+ FPGA (high-performance programmable logic), speed grade -2, industrial temperature range.

Manufacturer

Manufactured by: Xilinx, Inc. (now part of AMD).
What kind of company: A fabless semiconductor company that designs and markets programmable logic devices, primarily FPGAs (and related SoCs/accelerators); manufacturing is outsourced to external foundries.

Application

XCKU095-2FFVC1517I is a Kintex UltraScale FPGA suited for high‑performance, mid/large logic and DSP tasks. Typical applications include:
- High‑speed communications and data‑center acceleration (40/100G Ethernet, protocol processing)
- RF/wireless infrastructure (baseband processing, SDR)
- DSP‑heavy workloads (radar, imaging, video processing)
- Video, broadcast and machine vision
- Instrumentation, test & measurement
- Industrial automation and robotics
- Defense/aerospace rugged applications and IO bridging