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XCKU040-3FBVA900E
IC FPGA 468 I/O 900FCBGA
- 製造商
- 製造商。 部分 #XCKU040-3FBVA900E
- 包 BBGA-900
- 資料表
- 有現貨的5200
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規格
| Package | Tray |
| Series | Kintex® UltraScale™ |
| ProductStatus | Active |
| NumberofLABs/CLBs | 30300 |
| NumberofLogicElements/Cells | 530250 |
| TotalRAMBits | 21606000 |
| NumberofI/O | 468 |
| Voltage-Supply | 0.970V ~ 1.030V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 100°C (TJ) |
| Package/Case | 900-BBGA, FCBGA |
概述
Description
The XCKU040-3FBVA900E is a member of the Xilinx Kintex UltraScale FPGA family, designed for high-performance applications in various industries such as telecommunications, aerospace, and automotive. It features a 20nm process technology, offering a balance of power efficiency and performance. The device is equipped with 40,000 logic cells, high-speed transceivers, and a rich set of I/O options, making it suitable for complex digital signal processing, data analytics, and machine learning tasks.
The FPGA provides a flexible architecture with programmable logic, allowing users to tailor designs for specific applications. It supports various protocols and interfaces, including PCIe, Ethernet, and DDR memory. Additionally, the XCKU040-3FBVA900E offers advanced features like integrated DSP slices and block RAM, enhancing its capability for high-throughput and low-latency applications. This device is ideal for engineers looking for a robust solution to meet demanding computational and data management requirements in a compact form factor.
The FPGA provides a flexible architecture with programmable logic, allowing users to tailor designs for specific applications. It supports various protocols and interfaces, including PCIe, Ethernet, and DDR memory. Additionally, the XCKU040-3FBVA900E offers advanced features like integrated DSP slices and block RAM, enhancing its capability for high-throughput and low-latency applications. This device is ideal for engineers looking for a robust solution to meet demanding computational and data management requirements in a compact form factor.
Features
The Xilinx Kintex UltraScale XCKU040-3FBVA900E is a high-performance FPGA designed for a range of applications including data processing, communications, and signal processing. Key features include:
- Logic Cells: Approximately 43,000 logic cells, allowing for complex design implementations.
- DSP Slices: 220 DSP slices, providing efficient capabilities for digital signal processing.
- Block RAM: 4.9 Mb of block RAM for high-speed data storage.
- High-Speed Transceivers: Up to 32 high-speed transceivers supporting data rates up to 28.05 Gbps.
- I/O Support: Flexible I/O standards including LVDS, SSTL, and HSTL, with over 400 user I/O pins.
- Power Efficiency: Optimized for low power consumption while delivering high performance.
- Advanced Features: Integrated PCIe Gen 3 support and multiple clock management options.
- Package: Available in a 900-ball FFBGA package, suited for high-density applications.
These features make the XCKU040 ideal for applications in telecommunications, automotive, and aerospace industries.
- Logic Cells: Approximately 43,000 logic cells, allowing for complex design implementations.
- DSP Slices: 220 DSP slices, providing efficient capabilities for digital signal processing.
- Block RAM: 4.9 Mb of block RAM for high-speed data storage.
- High-Speed Transceivers: Up to 32 high-speed transceivers supporting data rates up to 28.05 Gbps.
- I/O Support: Flexible I/O standards including LVDS, SSTL, and HSTL, with over 400 user I/O pins.
- Power Efficiency: Optimized for low power consumption while delivering high performance.
- Advanced Features: Integrated PCIe Gen 3 support and multiple clock management options.
- Package: Available in a 900-ball FFBGA package, suited for high-density applications.
These features make the XCKU040 ideal for applications in telecommunications, automotive, and aerospace industries.
Package
The XCKU040-3FBVA900E is packaged in a FBGAs (Field-Programmable Gate Arrays) form factor, specifically a 900-ball BGA (Ball Grid Array) package. This packaging type provides efficient thermal management and compact design for high-density applications.
Pinout
The XCKU040-3FBVA900E is a member of the Xilinx Kintex UltraScale FPGA family. It has a total of 900 pins. This FPGA is designed for high-performance applications and features a variety of functionalities, including digital signal processing, high-speed serial transceivers, and extensive logic resources. The pin count encompasses various I/O pins, power supply pins, and dedicated configuration pins, allowing for flexible interfacing and communication with other devices. The XCKU040-3FBVA900E is suitable for applications in telecommunications, data centers, and advanced embedded systems.
Manufacturer
The XCKU040-3FBVA900E is manufactured by Xilinx, Inc., which is a semiconductor company known for designing and producing FPGAs (Field-Programmable Gate Arrays), SoCs (System on Chips), and CPLDs (Complex Programmable Logic Devices). Founded in 1984 and headquartered in San Jose, California, Xilinx specializes in programmable logic devices that are used in a variety of applications, including telecommunications, automotive, aerospace, and industrial systems. The company is recognized for its innovation in reconfigurable computing and has been a leader in the FPGA market. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), expanding its portfolio in the high-performance computing and adaptive computing sectors.
Application
The XCKU040-3FBVA900E is a high-performance FPGA from Xilinx, widely used in various application areas including telecommunications, data centers, high-performance computing, industrial automation, automotive systems, and machine learning. Its capabilities support advanced algorithms, real-time data processing, and complex signal processing tasks, making it ideal for applications requiring high throughput and low latency.
Equivalent
The XCKU040-3FBVA900E is part of the Xilinx Kintex UltraScale FPGA family. Equivalent products include:
1. XCKU040-3FBVA676E
2. XCKU040-3FFVA1156E
3. XCKU040-3FBVA676E
These variants differ in package, speed grade, and I/O capabilities. Always verify specific requirements, such as power consumption and pin configurations, when considering alternatives.
1. XCKU040-3FBVA676E
2. XCKU040-3FFVA1156E
3. XCKU040-3FBVA676E
These variants differ in package, speed grade, and I/O capabilities. Always verify specific requirements, such as power consumption and pin configurations, when considering alternatives.
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