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XCKU035-2FBVA676I
IC FPGA 312 I/O 676FCBGA
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規格
| Series | Kintex® UltraScale™ |
| Part Status | Active |
| DigiKey Programmable | Not Verified |
| Total RAM Bits | 19456000 |
| Number of I/O | 312 |
| Voltage - Supply | 0.922V ~ 0.979V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 676-BBGA, FCBGA |
| Supplier Device Package | 676-FCBGA (27x27) |
| Base Product Number | XCKU035 |
| Number of Logic Elements/Cells | 444343 |
| Number of LABs/CLBs | 25391 |
概述
Description
The XCKU035-2FBVA676I is a member of the Xilinx Kintex UltraScale FPGA family, designed for high-performance and low-power applications. It features 35,000 logic cells, offering a balance of performance and efficiency ideal for complex processing tasks in various industries, including telecommunications, automotive, and data centers.
Key specifications include a maximum clock frequency of up to 500 MHz and support for multiple high-speed serial interfaces. The device also incorporates a rich set of digital signal processing capabilities, making it suitable for applications like real-time data processing and machine learning.
The package type, FBVA676, indicates a ball grid array (BGA) format, facilitating efficient thermal management and signal integrity. The XCKU035-2FBVA676I supports various power and configuration options, including partial reconfiguration, allowing users to adapt the system dynamically.
Overall, the XCKU035 is designed for versatility and scalability, making it an attractive choice for engineers looking to implement advanced FPGA solutions in demanding environments.
Key specifications include a maximum clock frequency of up to 500 MHz and support for multiple high-speed serial interfaces. The device also incorporates a rich set of digital signal processing capabilities, making it suitable for applications like real-time data processing and machine learning.
The package type, FBVA676, indicates a ball grid array (BGA) format, facilitating efficient thermal management and signal integrity. The XCKU035-2FBVA676I supports various power and configuration options, including partial reconfiguration, allowing users to adapt the system dynamically.
Overall, the XCKU035 is designed for versatility and scalability, making it an attractive choice for engineers looking to implement advanced FPGA solutions in demanding environments.
Features
The XCKU035-2FBVA676I is a member of the Xilinx Kintex UltraScale family of FPGAs. Key features include:
1. Logic Cells: Approximately 35,000 logic cells, providing a balance of performance and power efficiency.
2. DSP Resources: Contains 220 DSP slices for high-performance digital signal processing.
3. Memory: Supports integrated memory options, including block RAM and UltraRAM.
4. I/O: Offers up to 676 I/O pins with support for various I/O standards.
5. Embedded Processing: Compatible with ARM Cortex-A53 and other soft processor cores.
6. High-Speed Transceivers: Features up to 32 transceivers with data rates up to 12.5 Gbps.
7. Power Efficiency: Designed for low power consumption, making it suitable for a range of applications.
8. Flexible Architecture: Configurable to support different applications, including communication, automotive, and data center.
This FPGA is ideal for applications requiring high data throughput and complex computations while maintaining power efficiency.
1. Logic Cells: Approximately 35,000 logic cells, providing a balance of performance and power efficiency.
2. DSP Resources: Contains 220 DSP slices for high-performance digital signal processing.
3. Memory: Supports integrated memory options, including block RAM and UltraRAM.
4. I/O: Offers up to 676 I/O pins with support for various I/O standards.
5. Embedded Processing: Compatible with ARM Cortex-A53 and other soft processor cores.
6. High-Speed Transceivers: Features up to 32 transceivers with data rates up to 12.5 Gbps.
7. Power Efficiency: Designed for low power consumption, making it suitable for a range of applications.
8. Flexible Architecture: Configurable to support different applications, including communication, automotive, and data center.
This FPGA is ideal for applications requiring high data throughput and complex computations while maintaining power efficiency.
Package
The XCKU035-2FBVA676I is packaged in a 676-ball FBGAA (Fine Ball Grid Array) package. This package type is designed for high-density applications, providing efficient thermal performance and electrical connections.
Pinout
The XCKU035-2FBVA676I is a member of the Xilinx Kintex UltraScale FPGA family. It features a total of 676 pins. This FPGA is designed for high-performance applications, offering various I/O capabilities, including differential pairs, single-ended I/O, and support for multiple standards such as LVDS and SSTL.
The pins serve several functions, including power supply (VCC and GND), configuration, user I/O, and dedicated high-speed transceiver connections. Specifically, it provides a combination of general-purpose I/O (GPIO), clock management, and high-speed serial interfaces, which are crucial for data processing and communication tasks in complex designs. The exact pinout and functionalities can be found in the Xilinx datasheet for detailed specifications.
The pins serve several functions, including power supply (VCC and GND), configuration, user I/O, and dedicated high-speed transceiver connections. Specifically, it provides a combination of general-purpose I/O (GPIO), clock management, and high-speed serial interfaces, which are crucial for data processing and communication tasks in complex designs. The exact pinout and functionalities can be found in the Xilinx datasheet for detailed specifications.
Manufacturer
The XCKU035-2FBVA676I is manufactured by Xilinx, Inc., which is a leading company in the semiconductor industry, specifically known for its field-programmable gate arrays (FPGAs), programmable System-on-Chips (SoCs), and adaptive computing solutions. Xilinx designs and develops advanced programmable logic devices that are used in a variety of applications, including telecommunications, automotive, industrial, aerospace, and consumer electronics. The company is recognized for pioneering the FPGA technology, allowing for flexible and dynamic hardware configurations that can be customized for specific tasks or workloads. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), further expanding its capabilities in high-performance computing and adaptive systems.
Application
The XCKU035-2FBVA676I is a high-performance FPGA from Xilinx's Kintex UltraScale series, suitable for applications such as telecommunications, data center acceleration, embedded computing, automotive systems, video processing, and industrial automation. Its flexibility and processing power make it ideal for real-time analytics, machine learning, and high-speed data transmission tasks.
Equivalent
The XCKU035-2FBVA676I chip is part of the Xilinx Kintex UltraScale family. Equivalent products include:
1. XCKU035-2FBVA676C - Similar performance with a different speed grade.
2. XCKU040-2FBVA676I - A higher capacity variant with potentially more logic resources.
3. XCKU060-1FBVA676I - Another higher capacity option with a different speed grade.
For exact replacements, consult the manufacturer's specifications for compatibility.
1. XCKU035-2FBVA676C - Similar performance with a different speed grade.
2. XCKU040-2FBVA676I - A higher capacity variant with potentially more logic resources.
3. XCKU060-1FBVA676I - Another higher capacity option with a different speed grade.
For exact replacements, consult the manufacturer's specifications for compatibility.
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