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XC7Z045-L2FFG676I
IC SOC CORTEX-A9 800MHZ 676FCBGA
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規格
| Series | Zynq®-7000 |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| RAM Size | 256KB |
| Peripherals | DMA |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 800MHz |
| Primary Attributes | Kintex™-7 FPGA, 350K Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 676-BBGA, FCBGA |
| Supplier Device Package | 676-FCBGA (27x27) |
| Base Product Number | XC7Z045 |
概述
Description
The XC7Z045-L2FFG676I is a member of the Xilinx Zynq-7000 series, which integrates a dual-core ARM Cortex-A9 processor with Xilinx 7-series FPGA logic. This device is designed for applications requiring high performance, flexibility, and low power consumption.
Key features include:
- Processing System: Dual ARM Cortex-A9 cores running up to 1 GHz, capable of running complex operating systems and applications.
- Programmable Logic: Up to 85,000 logic cells, enabling custom hardware acceleration for specific tasks.
- Memory Interfaces: Support for DDR3, DDR2, and LPDDR2 memory, ensuring high bandwidth for data-intensive applications.
- Connectivity: Multiple I/O options, including high-speed transceivers, GPIO, and peripherals for diverse applications.
This chip is suited for applications in areas like industrial automation, automotive, telecommunications, and more, where combining software and hardware processing is advantageous. The XC7Z045-L2FFG676I is housed in a 676-ball FFG package, facilitating integration into compact designs.
Key features include:
- Processing System: Dual ARM Cortex-A9 cores running up to 1 GHz, capable of running complex operating systems and applications.
- Programmable Logic: Up to 85,000 logic cells, enabling custom hardware acceleration for specific tasks.
- Memory Interfaces: Support for DDR3, DDR2, and LPDDR2 memory, ensuring high bandwidth for data-intensive applications.
- Connectivity: Multiple I/O options, including high-speed transceivers, GPIO, and peripherals for diverse applications.
This chip is suited for applications in areas like industrial automation, automotive, telecommunications, and more, where combining software and hardware processing is advantageous. The XC7Z045-L2FFG676I is housed in a 676-ball FFG package, facilitating integration into compact designs.
Features
The XC7Z045-L2FFG676I is a member of the Xilinx Zynq-7000 SoC (System on Chip) family, combining a dual-core ARM Cortex-A9 processor with programmable logic. Key features include:
1. Processing System: Dual ARM Cortex-A9 processors operating up to 1 GHz.
2. FPGA Fabric: 45,000 logic cells, allowing for extensive programmable logic capabilities.
3. Memory: Support for DDR3/DDR2/LPDDR2 memory interfaces, with up to 1 GB of external memory.
4. I/O: 54 user-configurable I/O pins, supporting various I/O standards.
5. Connectivity: Integrated peripherals including USB, Ethernet, and UART.
6. Performance: High-performance processing capabilities suitable for complex applications.
7. Power Management: Optimized for low power consumption.
8. Design Flexibility: Suitable for applications in industrial, automotive, and consumer markets.
This integration of ARM and FPGA capabilities makes it suitable for a wide range of applications, from embedded processing to real-time data processing tasks.
1. Processing System: Dual ARM Cortex-A9 processors operating up to 1 GHz.
2. FPGA Fabric: 45,000 logic cells, allowing for extensive programmable logic capabilities.
3. Memory: Support for DDR3/DDR2/LPDDR2 memory interfaces, with up to 1 GB of external memory.
4. I/O: 54 user-configurable I/O pins, supporting various I/O standards.
5. Connectivity: Integrated peripherals including USB, Ethernet, and UART.
6. Performance: High-performance processing capabilities suitable for complex applications.
7. Power Management: Optimized for low power consumption.
8. Design Flexibility: Suitable for applications in industrial, automotive, and consumer markets.
This integration of ARM and FPGA capabilities makes it suitable for a wide range of applications, from embedded processing to real-time data processing tasks.
Package
The XC7Z045-L2FFG676I is packaged in a FFG (Fine Pitch Ball Grid Array) type package with 676 balls. This package type is designed for high-density interconnections and optimized thermal performance, making it suitable for various applications in the Zynq-7000 series of FPGAs.
Pinout
The XC7Z045-L2FFG676I is a member of the Xilinx Zynq-7000 series, specifically designed for applications requiring both programmable logic and processing system capabilities. It features a pin count of 676 in a FFG676 package.
The device integrates a dual-core ARM Cortex-A9 processor and a 28nm Artix-7 FPGA fabric, enabling a wide range of applications from embedded systems to complex data processing.
Key functionalities include high-speed I/O interfaces, such as USB, Ethernet, and various GPIOs, alongside dedicated programmable logic resources. The Zynq architecture allows developers to implement custom hardware accelerators while running a full operating system on the ARM cores, providing flexibility and performance for diverse applications.
Overall, the XC7Z045-L2FFG676I is well-suited for applications in automotive, industrial, and consumer electronics.
The device integrates a dual-core ARM Cortex-A9 processor and a 28nm Artix-7 FPGA fabric, enabling a wide range of applications from embedded systems to complex data processing.
Key functionalities include high-speed I/O interfaces, such as USB, Ethernet, and various GPIOs, alongside dedicated programmable logic resources. The Zynq architecture allows developers to implement custom hardware accelerators while running a full operating system on the ARM cores, providing flexibility and performance for diverse applications.
Overall, the XC7Z045-L2FFG676I is well-suited for applications in automotive, industrial, and consumer electronics.
Manufacturer
The XC7Z045-L2FFG676I is manufactured by Xilinx, Inc., a prominent technology company known for its development of programmable logic devices and systems. Xilinx specializes in field-programmable gate arrays (FPGAs), system-on-chips (SoCs), and adaptive computing solutions. Founded in 1984, Xilinx pioneered the FPGA market and continues to be a leader in providing innovative solutions for a wide range of applications, including telecommunications, automotive, industrial, and consumer electronics. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), further expanding its capabilities and market reach. The XC7Z045-L2FFG676I is part of the Zynq-7000 series, which combines ARM processing with FPGA fabric, making it suitable for embedded systems and high-performance computing tasks.
Application
The XC7Z045-L2FFG676I is a Zynq-7000 SoC from Xilinx, commonly used in applications such as industrial automation, automotive systems, robotics, medical imaging, and telecommunications. Its combination of FPGA and ARM Cortex-A9 processing power enables real-time data processing, signal processing, and control tasks, making it ideal for embedded systems, IoT devices, and data acquisition systems.
Equivalent
The XC7Z045-L2FFG676I is a Zynq-7000 SoC from Xilinx. Equivalent products include the XC7Z045-2FFG676C, which has similar specifications but different speed grades and temperature ranges. For similar functionality, consider alternatives like the Intel Cyclone V SoC or Lattice ECP5, but compatibility may vary. Always verify specific requirements and configurations for your application.
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