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XC7Z045-1FFG900I
IC SOC CORTEX-A9 667MHZ 900FCBGA
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- 製造商。 部分 #XC7Z045-1FFG900I
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規格
| Package | Tray |
| Series | Zynq®-7000 |
| ProductStatus | Active |
| Architecture | MCU, FPGA |
| CoreProcessor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| RAMSize | 256KB |
| Peripherals | DMA |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 667MHz |
| PrimaryAttributes | Kintex™-7 FPGA, 350K Logic Cells |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 900-BBGA, FCBGA |
概述
Description
The XC7Z045-1FFG900I is a member of the Xilinx Zynq-7000 series, which integrates a dual-core ARM Cortex-A9 processor with Xilinx 7-series FPGA logic. This device features 45,000 logic cells and is designed for high-performance embedded applications, including industrial automation, automotive, and communications.
Key specifications include:
- Architecture: ARM Cortex-A9 dual-core with a clock speed of up to 1 GHz.
- FPGA Fabric: 45K logic cells, supporting advanced DSP, memory, and I/O functionalities.
- Memory Interfaces: Supports DDR3 and LPDDR2 memory, enhancing data throughput and processing capabilities.
- I/O Options: Offers a variety of I/O standards, making it versatile for different application requirements.
The XC7Z045-1FFG900I is suitable for applications that require a combination of processing power and reconfigurable hardware, enabling users to develop customizable solutions efficiently. The integration of software and hardware in a single chip simplifies system design, reduces latency, and enhances overall performance.
Key specifications include:
- Architecture: ARM Cortex-A9 dual-core with a clock speed of up to 1 GHz.
- FPGA Fabric: 45K logic cells, supporting advanced DSP, memory, and I/O functionalities.
- Memory Interfaces: Supports DDR3 and LPDDR2 memory, enhancing data throughput and processing capabilities.
- I/O Options: Offers a variety of I/O standards, making it versatile for different application requirements.
The XC7Z045-1FFG900I is suitable for applications that require a combination of processing power and reconfigurable hardware, enabling users to develop customizable solutions efficiently. The integration of software and hardware in a single chip simplifies system design, reduces latency, and enhances overall performance.
Features
The XC7Z045-1FFG900I is a member of the Xilinx Zynq-7000 series, which combines a dual-core ARM Cortex-A9 processor with Xilinx 7-series FPGA logic. Key features include:
- Processing System (PS): Dual-core ARM Cortex-A9 with up to 1 GHz clock speed, supporting NEON and SIMD for enhanced performance.
- FPGA Fabric: 85,000 logic cells, enabling complex designs with a variety of digital logic functions.
- Memory Interfaces: Support for DDR3 and DDR2 memory, with a maximum bandwidth of 17 Gbps.
- Connectivity: Multiple I/O options, including GPIO, SPI, I2C, UART, and high-speed transceivers.
- Embedded Design: Integrated hardware and software design capabilities, ideal for embedded applications.
- Thermal and Power Efficiency: Industrial-grade with a wide operating temperature range and low power consumption.
This device is suitable for applications in industrial control, automotive, and communication systems, providing a balance of processing power and customizable hardware.
- Processing System (PS): Dual-core ARM Cortex-A9 with up to 1 GHz clock speed, supporting NEON and SIMD for enhanced performance.
- FPGA Fabric: 85,000 logic cells, enabling complex designs with a variety of digital logic functions.
- Memory Interfaces: Support for DDR3 and DDR2 memory, with a maximum bandwidth of 17 Gbps.
- Connectivity: Multiple I/O options, including GPIO, SPI, I2C, UART, and high-speed transceivers.
- Embedded Design: Integrated hardware and software design capabilities, ideal for embedded applications.
- Thermal and Power Efficiency: Industrial-grade with a wide operating temperature range and low power consumption.
This device is suitable for applications in industrial control, automotive, and communication systems, providing a balance of processing power and customizable hardware.
Package
The XC7Z045-1FFG900I is packaged in a FFG (Fine Pitch Ball Grid Array) format, specifically a 900-ball arrangement. This package type is designed for high-density applications and provides efficient thermal management and electrical performance for the Zynq-7000 series of FPGA devices.
Pinout
The XC7Z045-1FFG900I is a member of the Xilinx Zynq-7000 series, specifically designed for embedded systems. It features a total of 900 pins.
The primary functions of the XC7Z045-1FFG900I include:
1. Processing System (PS): It integrates a dual-core ARM Cortex-A9 processor for general-purpose processing.
2. Programmable Logic (PL): It provides a configurable FPGA fabric for custom hardware implementations.
3. I/O Interfaces: The device supports a variety of I/O interfaces, including GPIO, I2C, SPI, UART, and more.
4. Memory Interfaces: It supports high-speed memory interfaces such as DDR3/DDR2.
5. Clock Management: It includes clock management features for efficient clock distribution.
6. Power Management: Designed for low power consumption, suitable for embedded applications.
This versatile architecture allows for efficient processing and custom hardware acceleration, ideal for applications in automotive, industrial, and consumer electronics.
The primary functions of the XC7Z045-1FFG900I include:
1. Processing System (PS): It integrates a dual-core ARM Cortex-A9 processor for general-purpose processing.
2. Programmable Logic (PL): It provides a configurable FPGA fabric for custom hardware implementations.
3. I/O Interfaces: The device supports a variety of I/O interfaces, including GPIO, I2C, SPI, UART, and more.
4. Memory Interfaces: It supports high-speed memory interfaces such as DDR3/DDR2.
5. Clock Management: It includes clock management features for efficient clock distribution.
6. Power Management: Designed for low power consumption, suitable for embedded applications.
This versatile architecture allows for efficient processing and custom hardware acceleration, ideal for applications in automotive, industrial, and consumer electronics.
Manufacturer
The XC7Z045-1FFG900I is manufactured by Xilinx, Inc., which is a leading company in the field of programmable logic devices and FPGAs (Field-Programmable Gate Arrays). Founded in 1984, Xilinx specializes in designing and producing advanced semiconductor products, including FPGAs, SoCs (System on Chips), and CPLDs (Complex Programmable Logic Devices).
The XC7Z045 is part of the Zynq-7000 series, which integrates a dual-core ARM Cortex-A9 processor with Xilinx's 7-series FPGA technology, enabling a unique combination of programmable logic and processing capabilities. Xilinx serves various industries, including automotive, aerospace, telecommunications, and consumer electronics. In 2021, Xilinx was acquired by AMD (Advanced Micro Devices), further enhancing its capabilities and market reach in the semiconductor industry.
The XC7Z045 is part of the Zynq-7000 series, which integrates a dual-core ARM Cortex-A9 processor with Xilinx's 7-series FPGA technology, enabling a unique combination of programmable logic and processing capabilities. Xilinx serves various industries, including automotive, aerospace, telecommunications, and consumer electronics. In 2021, Xilinx was acquired by AMD (Advanced Micro Devices), further enhancing its capabilities and market reach in the semiconductor industry.
Application
The XC7Z045-1FFG900I, part of the Xilinx Zynq-7000 series, is used in various application areas including industrial automation, automotive systems, video processing, communication systems, and medical devices. Its integration of a dual-core ARM Cortex-A9 processor with programmable logic makes it suitable for real-time processing, high-speed data handling, and complex algorithms, enabling functionalities in robotics, IoT devices, and smart grid applications.
Equivalent
The XC7Z045-1FFG900I is a Zynq-7000 series SoC from Xilinx. Equivalent products include:
1. XC7Z045-2FFG900I - Higher speed grade.
2. XC7Z045-1FFG676I - Smaller package (676-ball).
3. XC7Z035-1FFG900I - Lower resource variant.
4. XC7Z100-1FFG900I - Higher resource variant.
These alternatives may vary in speed, package size, or resources, so choose based on specific application requirements.
1. XC7Z045-2FFG900I - Higher speed grade.
2. XC7Z045-1FFG676I - Smaller package (676-ball).
3. XC7Z035-1FFG900I - Lower resource variant.
4. XC7Z100-1FFG900I - Higher resource variant.
These alternatives may vary in speed, package size, or resources, so choose based on specific application requirements.
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