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XC7S75-1FGGA676C
IC FPGA 400 I/O 676FPBGA
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- 製造商。 部分 #XC7S75-1FGGA676C
- 包 676-BGA
- 資料表
- 有現貨的7275
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規格
| Package | Tray |
| Series | Spartan®-7 |
| ProductStatus | Active |
| NumberofLABs/CLBs | 6000 |
| NumberofLogicElements/Cells | 76800 |
| TotalRAMBits | 4331520 |
| NumberofI/O | 400 |
| Voltage-Supply | 0.95V ~ 1.05V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 85°C (TJ) |
| Package/Case | 676-BGA |
概述
Description
The XC7S75-1FGGA676C is a member of Xilinx's 7 series of Field Programmable Gate Arrays (FPGAs), specifically part of the Spartan-7 family. It is designed for low-cost, low-power applications, offering a balance between performance and power efficiency. The device features 75,000 logic cells, making it suitable for a variety of applications, including automotive, consumer electronics, and industrial automation.
Key specifications include a maximum clock speed of 400 MHz, support for various I/O standards, and integrated DSP slices for signal processing tasks. The XC7S75 is packaged in a compact FGGA676 form factor, which supports high-density designs.
The design environment typically involves Xilinx’s Vivado Design Suite, which provides a comprehensive set of tools for synthesis, implementation, and debugging. Overall, the XC7S75-1FGGA676C is ideal for developers seeking a versatile and efficient FPGA solution for a wide range of digital design projects.
Key specifications include a maximum clock speed of 400 MHz, support for various I/O standards, and integrated DSP slices for signal processing tasks. The XC7S75 is packaged in a compact FGGA676 form factor, which supports high-density designs.
The design environment typically involves Xilinx’s Vivado Design Suite, which provides a comprehensive set of tools for synthesis, implementation, and debugging. Overall, the XC7S75-1FGGA676C is ideal for developers seeking a versatile and efficient FPGA solution for a wide range of digital design projects.
Features
The XC7S75-1FGGA676C is a member of the Xilinx Spartan-7 FPGA family, designed for low-power, cost-sensitive applications. Key features include:
1. Logic Cells: 75K logic cells, providing ample resources for various digital designs.
2. I/O Pins: 76 user I/O pins, supporting various single-ended and differential signaling standards.
3. DSP Slices: 30 DSP slices for efficient high-performance signal processing.
4. Block RAM: 4.5Mb of block RAM for data storage and buffering.
5. Configuration: Supports JTAG and SPI for flexible configuration options.
6. Power Efficiency: Operates at a low power supply voltage (typically 1.0V - 1.2V), making it suitable for battery-powered applications.
7. Performance: Capable of operating at clock frequencies up to 300 MHz, depending on design configuration.
8. Embedded Features: Includes a rich set of embedded features for applications in communications, automotive, and industrial fields.
Overall, the XC7S75-1FGGA676C is ideal for applications requiring a balance of performance, power, and cost.
1. Logic Cells: 75K logic cells, providing ample resources for various digital designs.
2. I/O Pins: 76 user I/O pins, supporting various single-ended and differential signaling standards.
3. DSP Slices: 30 DSP slices for efficient high-performance signal processing.
4. Block RAM: 4.5Mb of block RAM for data storage and buffering.
5. Configuration: Supports JTAG and SPI for flexible configuration options.
6. Power Efficiency: Operates at a low power supply voltage (typically 1.0V - 1.2V), making it suitable for battery-powered applications.
7. Performance: Capable of operating at clock frequencies up to 300 MHz, depending on design configuration.
8. Embedded Features: Includes a rich set of embedded features for applications in communications, automotive, and industrial fields.
Overall, the XC7S75-1FGGA676C is ideal for applications requiring a balance of performance, power, and cost.
Package
The XC7S75-1FGGA676C is packaged in a Fine Pitch Ball Grid Array (FBGA) format with 676 balls. This type of package provides a compact design and efficient thermal management for the Xilinx Spartan-7 FPGA.
Pinout
The XC7S75-1FGGA676C is a Field Programmable Gate Array (FPGA) from Xilinx's Spartan-7 family. It features a total pin count of 676.
In terms of functionality, the device supports various I/O configurations and interfaces, including LVTTL, LVCMOS, and SSTL signaling standards. It is designed for applications requiring low power consumption and high performance, suitable for a wide range of applications such as automotive, industrial, and consumer electronics. The FPGA includes programmable logic cells, DSP slices for digital signal processing, and memory blocks for RAM and ROM functions. The XC7S75 can also implement complex algorithms and data processing tasks, making it a versatile solution for custom digital logic designs.
In terms of functionality, the device supports various I/O configurations and interfaces, including LVTTL, LVCMOS, and SSTL signaling standards. It is designed for applications requiring low power consumption and high performance, suitable for a wide range of applications such as automotive, industrial, and consumer electronics. The FPGA includes programmable logic cells, DSP slices for digital signal processing, and memory blocks for RAM and ROM functions. The XC7S75 can also implement complex algorithms and data processing tasks, making it a versatile solution for custom digital logic designs.
Manufacturer
The XC7S75-1FGGA676C is manufactured by Xilinx, Inc., which is now a part of AMD (Advanced Micro Devices) after its acquisition in 2022. Xilinx is known for its specialization in programmable logic devices and is a leading company in the field of field-programmable gate arrays (FPGAs), system-on-chips (SoCs), and adaptive compute acceleration platforms (ACAPs). The XC7S75-1FGGA676C is part of the Spartan-7 series, designed for low-power, cost-effective applications in various industries, including telecommunications, automotive, and consumer electronics. Xilinx's products enable engineers to create customizable hardware solutions for a wide range of applications.
Application
The XC7S75-1FGGA676C, a part of the Xilinx Spartan-7 FPGA family, is used in various application areas including industrial automation, automotive systems, wireless communications, consumer electronics, and IoT devices. Its versatility allows for implementations in real-time processing, signal processing, image processing, and custom hardware acceleration, making it suitable for both low-power and cost-sensitive applications.
Equivalent
The XC7S75-1FGGA676C is a Xilinx Artix-7 FPGA. Equivalent products include:
1. Lattice ECP5 - Similar performance and resources.
2. Altera Cyclone V - Comparable logic density and features.
3. Microsemi SmartFusion2 - Offers similar FPGA capabilities with integrated ARM Cortex-M3.
These alternatives may vary in specific features and performance, so it's important to consider the application requirements.
1. Lattice ECP5 - Similar performance and resources.
2. Altera Cyclone V - Comparable logic density and features.
3. Microsemi SmartFusion2 - Offers similar FPGA capabilities with integrated ARM Cortex-M3.
These alternatives may vary in specific features and performance, so it's important to consider the application requirements.
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