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XC7K70T-2FBG484C

Name: XC7K70T-2FBG484C
Rating: 4.7 (12 reviews)

IC FPGA 285 I/O 484FCBGA

製造商
製造商。部分 #XC7K70T-2FBG484C
包 484-BBGA, FCBGA
資料表
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規格

Supplier	AMD Xilinx
Package	Tray
Series	Kintex®-7
ProductStatus	Active
NumberofLABs/CLBs	5125
NumberofLogicElements/Cells	65600
TotalRAMBits	4976640
NumberofI/O	285
Voltage-Supply	0.97V ~ 1.03V
MountingType	Surface Mount
OperatingTemperature	0°C ~ 85°C (TJ)
Package/Case	484-BBGA, FCBGA

概述

Description

XC7K70T-2FBG484C is a Xilinx Kintex-7 FPGA. It sits in the mid‑range Kintex-7 family, built on a 28nm process, offering a large amount of configurable logic, DSP slices, Block RAM, and I/O resources for flexible designs. The device designation breaks down as follows: XC7K70T (Kintex-7, ~70K logic cells), -2 (speed grade), FB (FBGA packaging), G484 (484-ball BGA package), C (commercial temperature range).
Key points:
- Roughly 70k logic cells with DSP, BRAM, and high-density I/O.
- High-speed SERDES/transceivers and clocking resources for bandwidth‑critical designs.
- Suitable for mid‑range applications such as communications, video/graphics processing, data processing, and embedded systems.
- Supported by Xilinx Vivado design suite and common IP cores; flexible reconfigurable logic for custom accelerators and interfaces.
In short, XC7K70T-2FBG484C is a feature-rich, mid‑range FPGA ideal for cost‑effective, high‑bandwidth implementations requiring DSP and flexible I/O.

Features

Key features of XC7K70T-2FBG484C (Kintex-7):
- 28nm Kintex-7 FPGA
- ~70K logic cells
- Speed grade: -2
- Package: FG484 (484-ball FG-BGA)
- PCIe: Hardened PCIe Gen2 x4 endpoint
- High-speed serial transceivers: multi-Gbps SERDES (GTX/GTx)
- DSP: DSP48E1 slices for MAC/FMA
- Block RAM and distributed RAM
- Flexible I/O: multiple banks with LVDS/LVCMOS and other I/O standards
- Clocking: PLLs and clock management resources
- General-purpose hardware features: reconfiguration options, robust fabric interconnect
Note: Exact counts (BRAM, DSP, I/O, transceiver speeds) vary by device revision; consult the datasheet for precise specifications.

Package

FBGA484 (Flip-Chip Ball Grid Array) – a 484-ball BGA package, commercial grade (XC7K70T-2FBG484C).

Pinout

- Pin count: 484 pins (FBG484 BGA package)
- Function: Kintex-7 FPGA device (XC7K70T) – a high-performance, reconfigurable logic FPGA with DSP blocks and SERDES for embedded/digital system designs.

Manufacturer

Manufacturer: Xilinx, Inc. (now part of AMD).
Xilinx is a semiconductor company that designs and sells programmable logic devices, mainly FPGAs and SoCs, plus related software and IP. It is a fabless company that outsources semiconductor fabrication to foundries.

Application

XC7K70T-2FBG484C is a mid-to-high density Kintex-7 FPGA suitable for:
- Networking & communications: SerDes, PCIe, Ethernet, protocol bridges
- Data processing & accelerators: DSP, video/vision, image processing, edge AI
- Industrial & automotive: control systems, sensor fusion, motor drive, vision
- Aerospace/defense & test & measurement: radar, SDR, high-speed data acquisition
- Prototyping & embedded systems: custom accelerators, hardware–software co-design