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XC7A200T-3FBG676E
IC FPGA 400 I/O 676FCBGA
- 製造商
- 製造商。 部分 #XC7A200T-3FBG676E
- 包 676-BBGA, FCBGA
- 資料表
- 有現貨的5661
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規格
| Supplier | AMD Xilinx |
| Package | Tray |
| Series | Artix-7 |
| ProductStatus | Active |
| NumberofLABs/CLBs | 16825 |
| NumberofLogicElements/Cells | 215360 |
| TotalRAMBits | 13455360 |
| NumberofI/O | 400 |
| Voltage-Supply | 0.95V ~ 1.05V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 100°C (TJ) |
| Package/Case | 676-BBGA, FCBGA |
概述
Description
XC7A200T-3FBG676E is a Xilinx Artix-7 FPGA. Key points:
- Architecture: 28nm, mid-density, low-power FPGA for cost-sensitive designs.
- Density/packaging: ~200k logic cells; 676-ball FBG676E package; speed grade -3 (a slower variant than -1/-2).
- Core resources: logic cells with 2x 6-input LUTs and flip-flops per LC plus carry chains; BRAM, DSP slices, and multiple I/O banks.
- I/O: hundreds of pins available through the 676-ball package; supports multiple voltage standards and high-speed SERDES.
- Clocking/config: built-in PLLs, clock routing resources, and various configuration options (e.g., SPI/JTAG).
- Tools: Vivado Design Suite for synthesis, implementation, and bitstream generation.
- Applications: embedded DSP, control, rapid-prototyping, image processing, communications, and other mid-to-high density, low-power designs.
For exact specifications (numbers of BRAM/DSP, I/O count per bank, timing, and configuration options), consult the XC7A200T datasheet and User Guide.
- Architecture: 28nm, mid-density, low-power FPGA for cost-sensitive designs.
- Density/packaging: ~200k logic cells; 676-ball FBG676E package; speed grade -3 (a slower variant than -1/-2).
- Core resources: logic cells with 2x 6-input LUTs and flip-flops per LC plus carry chains; BRAM, DSP slices, and multiple I/O banks.
- I/O: hundreds of pins available through the 676-ball package; supports multiple voltage standards and high-speed SERDES.
- Clocking/config: built-in PLLs, clock routing resources, and various configuration options (e.g., SPI/JTAG).
- Tools: Vivado Design Suite for synthesis, implementation, and bitstream generation.
- Applications: embedded DSP, control, rapid-prototyping, image processing, communications, and other mid-to-high density, low-power designs.
For exact specifications (numbers of BRAM/DSP, I/O count per bank, timing, and configuration options), consult the XC7A200T datasheet and User Guide.
Package
FBGA676 — Fine-pitched Ball Grid Array package with 676 balls; RoHS-compliant (E).
Pinout
- Pin count: 676 pins (FBG676 BGA package)
- Function: Xilinx XC7A200T-3FBG676E is an Artix-7 FPGA – a programmable logic device used to implement digital circuits, featuring LUTs/FFs, DSP blocks, and block RAM for custom hardware designs.
- Function: Xilinx XC7A200T-3FBG676E is an Artix-7 FPGA – a programmable logic device used to implement digital circuits, featuring LUTs/FFs, DSP blocks, and block RAM for custom hardware designs.
Manufacturer
Manufacturer: Xilinx, Inc.
What kind of company: A semiconductor company specializing in programmable logic devices (FPGAs, SoCs, CPLDs). Xilinx is now a subsidiary of AMD.
What kind of company: A semiconductor company specializing in programmable logic devices (FPGAs, SoCs, CPLDs). Xilinx is now a subsidiary of AMD.
Application
XC7A200T-3FBG676E (Artix-7, 676-ball package) is a cost-effective, low-power FPGA for mid-range apps. Typical areas: motor control and drives; industrial automation and machine vision; DSP/audio/video processing; communications and packet processing (SERDES, RF front-ends); automotive electronics; medical devices; aerospace/defense prototyping; test/measurement and edge computing systems.
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