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XC7A100T-L1CSG324I
IC FPGA 210 I/O 324CSBGA
- 製造商
- 製造商。 部分 #XC7A100T-L1CSG324I
- 包 324-LFBGA, CSPBGA
- 資料表
- 有現貨的3251
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規格
| Supplier | AMD Xilinx |
| Package | Tray |
| Series | Artix-7 |
| ProductStatus | Active |
| NumberofLABs/CLBs | 7925 |
| NumberofLogicElements/Cells | 101440 |
| TotalRAMBits | 4976640 |
| NumberofI/O | 210 |
| Voltage-Supply | 0.95V ~ 1.05V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 324-LFBGA, CSPBGA |
概述
Description
XC7A100T-L1CSG324I is an Artix-7 FPGA from Xilinx (AMD). It targets low-cost, low-power, mid-density digital designs. The “100T” denotes about 100k logic cells (roughly that density), while “-1” is the speed grade (fastest among this device family). The “L1CSG324I” gives package and environment: 324-ball BGA (324 pins) in a L1CSG324I option with industrial temperature (-40°C to 100°C). Key building blocks include LUT-based logic, flip-flops, Block RAM, DSP slices, and clock-management resources across several I/O banks. It’s designed for general-purpose embedded/non‑board level applications such as motor control, data acquisition, and communications, with support for standard I/O standards and reconfigurability via the Vivado design flow. Useful for cost-sensitive projects that need mid-range logic, DSP, and memory capabilities in a compact package. Typical tooling: Xilinx Vivado, IP integration, and related design flows.
Features
XC7A100T-L1CSG324I features (concise):
- 28nm Artix-7 FPGA
- ~100K logic cells (LUTs/flip-flops with fast carry)
- 324-ball LFBGA package (CSG324) with substantial I/O
- -1 speed grade
- Low power, suitable for cost-sensitive, high-density designs
- On-chip memory: block RAM plus distributed RAM
- DSP slices for MAC/FFT-style arithmetic
- Flexible I/O banks supporting LVCMOS/LVDS and multiple voltage levels
- Clocking: PLLs/MMCM and clock management resources
- Reconfigurability: supports partial reconfiguration
- Rich internal fabric for high-density logic, routing, and DSP
Notes: exact I/O count and memory/bandwidth figures vary by configuration; this device is intended for compact, low-power, high-density FPGA implementations.
- 28nm Artix-7 FPGA
- ~100K logic cells (LUTs/flip-flops with fast carry)
- 324-ball LFBGA package (CSG324) with substantial I/O
- -1 speed grade
- Low power, suitable for cost-sensitive, high-density designs
- On-chip memory: block RAM plus distributed RAM
- DSP slices for MAC/FFT-style arithmetic
- Flexible I/O banks supporting LVCMOS/LVDS and multiple voltage levels
- Clocking: PLLs/MMCM and clock management resources
- Reconfigurability: supports partial reconfiguration
- Rich internal fabric for high-density logic, routing, and DSP
Notes: exact I/O count and memory/bandwidth figures vary by configuration; this device is intended for compact, low-power, high-density FPGA implementations.
Package
324-ball CSBGA package (CSG324) for the Artix-7 device.
Pinout
- Pin count: 324 pins (324-ball BGA, package CSG324)
- Function: Xilinx Artix-7 FPGA XC7A100T (100K logic cells) with configurable logic blocks, Block RAM, DSP slices, and I/O for general digital design.
- Function: Xilinx Artix-7 FPGA XC7A100T (100K logic cells) with configurable logic blocks, Block RAM, DSP slices, and I/O for general digital design.
Manufacturer
- Manufacturer: Xilinx, Inc.
- What kind of company: A multinational American semiconductor company that designs and sells programmable logic devices (FPGAs, SoCs). It is fabless and became a subsidiary of AMD in 2022.
- What kind of company: A multinational American semiconductor company that designs and sells programmable logic devices (FPGAs, SoCs). It is fabless and became a subsidiary of AMD in 2022.
Application
XC7A100T-L1CSG324I is an Artix-7 FPGA optimized for cost- and power-efficient, mid-range logic and DSP tasks. Typical applications include: automotive (sensor interfaces, display controllers, body electronics), industrial (motor control, machine vision, data acquisition, real-time control), communications (embedded transceivers, packet processing, switching), consumer/edge (image/video preprocessing, HDMI pipelines, sensor fusion), medical/instrumentation (DAQ, signal processing), aerospace/UAV sensing, and rapid prototyping/education.
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