XC5VLX85-1FFG676C

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XC5VLX85-1FFG676C

IC FPGA 440 I/O 676FCBGA

  • 製造商
  • 製造商。 部分 #XC5VLX85-1FFG676C
  • 包 676-BBGA, FCBGA
  • 資料表
  • 有現貨的3397

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規格

Supplier AMD Xilinx
Package Tray
Series Virtex®-5 LX
ProductStatus Active
NumberofLABs/CLBs 6480
NumberofLogicElements/Cells 82944
TotalRAMBits 3538944
NumberofI/O 440
Voltage-Supply 0.95V ~ 1.05V
MountingType Surface Mount
OperatingTemperature 0°C ~ 85°C (TJ)
Package/Case 676-BBGA, FCBGA

概述

Description

XC5VLX85-1FFG676C is a Xilinx Virtex-5 LX FPGA. It is a mid-to-high‑end 65 nm device designed for high‑performance logic, DSP, and embedded memory in a compact package. Key points:
- Package: 676‑pin FFG676, flip‑chip ball-grid array
- Temperature: Commercial (C) range
- Speed grade: -1 (fastest in the LX85 family)
- Resources (high level): thousands of configurable logic cells, DSP slices (DSP48E), block RAM, and multiple I/O banks with support for high‑speed I/O
- Serial I/O: capability for high‑speed transceivers; suitable for telecom, video processing, networking, and custom accelerator designs
- Tools: typically developed with Xilinx ISE Design Suite (legacy) and associated flow tools
In short, XC5VLX85-1FFG676C is a mid/high‑end Virtex‑5 FPGA option for complex, DSP‑heavy, I/O‑rich designs in a 676‑pin package.

Features

XC5VLX85-1FFG676C features (concise):
- Virtex-5 LX architecture with ~85k logic cells
- Speed grade -1 (fastest)
- 676‑pin FineLine BGA package (FFG676C)
- Multi-bank I/O with support for common LVTTL/LVCMOS and differential I/O standards
- On‑chip memory: Block RAM plus distributed RAM
- DSP capabilities: DSP slices for high‑speed MAC operations
- Clock management: PLLs and clock‑definition resources for multiple domains
- Flexible fabric for routing, LUTs, and logic reuse
- Configuration/JTAG for programming and debugging
- Power/area efficiency features typical of Virtex‑5 devices
Note: exact RAM/DSP counts and available I/O specifics vary by device variant; consult the datasheet for precise numbers.

Package

XC5VLX85-1FFG676C uses an FFG676 package—a Fine-Pitch Flip-Chip Ball Grid Array with 676 balls; temperature grade Commercial (C).

Pinout

- Pin count: 676 pins (FFG676 package)
- Function: Xilinx Virtex‑5 LX family FPGA (XC5VLX85) – a programmable logic device with DSP slices, Block RAM, configurable I/O and high-speed transceivers for digital designs.

Manufacturer

- Manufacturer: Xilinx, Inc. (now part of AMD)
- What kind of company: A semiconductor company specializing in programmable logic devices, primarily FPGAs and related design software.

Application

Typical applications for XC5VLX85-1FFG676C:
- High-performance DSP and signal-processing accelerators
- High-speed networking and telecom equipment (PCIe, Gigabit Ethernet, Serial RapidIO, SONET/SDH)
- Radar/sonar, wireless infrastructure and base stations
- Video, image processing and medical imaging
- Industrial control, data acquisition, and aerospace/defense systems
- Test & measurement and embedded processing platforms

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