圖片僅供參考
XC3S700A-4FTG256I
IC FPGA 161 I/O 256FTBGA
- 製造商
- 製造商。 部分 #XC3S700A-4FTG256I
- 包
- 資料表
- 有現貨的7992
100%原創; 新
24小時準備發貨
365天保修
RFQ&; 獲得更多折扣
規格
| Series | Spartan®-3A |
| Part Status | Obsolete |
| DigiKey Programmable | Not Verified |
| Number of Logic Elements/Cells | 13248 |
| Total RAM Bits | 368640 |
| Number of I/O | 161 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 256-LBGA |
| Supplier Device Package | 256-FTBGA (17x17) |
| Base Product Number | XC3S700 |
| Number of LABs/CLBs | 1472 |
| Number of Gates | 700000 |
概述
Description
The XC3S700A-4FTG256I is a field-programmable gate array (FPGA) from Xilinx's Spartan-3A family. It features 700,000 system gates, enabling designers to implement complex digital designs efficiently. With a 90 nm process technology, this FPGA offers a balance of high performance and low power consumption.
The device comes in a 256-ball FBG256 package, with a maximum operating frequency of up to 200 MHz. It has a wide array of programmable logic resources, including configurable logic blocks (CLBs), digital signal processing (DSP) slices, and embedded memory blocks, suitable for various applications such as automotive, industrial, and consumer electronics.
Key features include multiple I/O standards, built-in clock management, and a flexible interconnect architecture, allowing for easy integration into diverse system designs. The XC3S700A is ideal for prototyping, custom hardware acceleration, and educational purposes, showcasing Xilinx's commitment to providing cost-effective and versatile solutions for digital design challenges.
The device comes in a 256-ball FBG256 package, with a maximum operating frequency of up to 200 MHz. It has a wide array of programmable logic resources, including configurable logic blocks (CLBs), digital signal processing (DSP) slices, and embedded memory blocks, suitable for various applications such as automotive, industrial, and consumer electronics.
Key features include multiple I/O standards, built-in clock management, and a flexible interconnect architecture, allowing for easy integration into diverse system designs. The XC3S700A is ideal for prototyping, custom hardware acceleration, and educational purposes, showcasing Xilinx's commitment to providing cost-effective and versatile solutions for digital design challenges.
Features
The XC3S700A-4FTG256I is a Field Programmable Gate Array (FPGA) from Xilinx's Spartan-3A series. Key features include:
- Configurable Logic Blocks (CLBs): 700,000 system gates with around 88,000 logic cells.
- I/O Pins: 256 user-configurable I/O pins supporting various I/O standards, including LVTTL, LVCMOS, and PCI.
- Embedded Block RAM: Up to 36 Kbits of dual-port block RAM for data storage.
- DSP Slices: 24 dedicated DSP slices for high-performance digital signal processing.
- Speed Grade: -4 speed grade, allowing up to 100 MHz operation.
- Low Power Consumption: Designed for energy-efficient applications with low static and dynamic power requirements.
- Programmable Interconnect: Flexible routing architecture for customizable designs.
- JTAG Support: For easy programming and debugging.
This FPGA is ideal for applications in consumer electronics, automotive, and industrial automation where cost-effectiveness and performance are critical.
- Configurable Logic Blocks (CLBs): 700,000 system gates with around 88,000 logic cells.
- I/O Pins: 256 user-configurable I/O pins supporting various I/O standards, including LVTTL, LVCMOS, and PCI.
- Embedded Block RAM: Up to 36 Kbits of dual-port block RAM for data storage.
- DSP Slices: 24 dedicated DSP slices for high-performance digital signal processing.
- Speed Grade: -4 speed grade, allowing up to 100 MHz operation.
- Low Power Consumption: Designed for energy-efficient applications with low static and dynamic power requirements.
- Programmable Interconnect: Flexible routing architecture for customizable designs.
- JTAG Support: For easy programming and debugging.
This FPGA is ideal for applications in consumer electronics, automotive, and industrial automation where cost-effectiveness and performance are critical.
Package
The XC3S700A-4FTG256I is packaged in a Fine Pitch Ball Grid Array (FBGA) format, specifically with 256 balls. This type of packaging provides a compact design with improved thermal and electrical performance suitable for applications requiring high-density connections.
Pinout
The XC3S700A-4FTG256I is a Spartan-3A FPGA from Xilinx. It has a pin count of 256. The device features various I/O pins for digital logic interfacing, including support for LVTTL, LVCMOS, and other I/O standards. Additionally, it provides dedicated pins for configuration, power, and ground connections.
Key functionalities of the FPGA include implementation of digital logic circuits, signal processing, and custom hardware acceleration for various applications. The XC3S700A supports a range of programmable logic resources, including Look-Up Tables (LUTs), flip-flops, and multiplexers, enabling complex design implementations.
In summary, the XC3S700A-4FTG256I has 256 pins with functions that include general-purpose I/O, configuration, power, and ground.
Key functionalities of the FPGA include implementation of digital logic circuits, signal processing, and custom hardware acceleration for various applications. The XC3S700A supports a range of programmable logic resources, including Look-Up Tables (LUTs), flip-flops, and multiplexers, enabling complex design implementations.
In summary, the XC3S700A-4FTG256I has 256 pins with functions that include general-purpose I/O, configuration, power, and ground.
Manufacturer
The XC3S700A-4FTG256I is manufactured by Xilinx, Inc., a prominent company in the field of programmable logic devices. Founded in 1984, Xilinx specializes in the design and production of field-programmable gate arrays (FPGAs), complex programmable logic devices (CPLDs), and other programmable system-on-chip (SoC) solutions. The company is known for its innovative software tools and hardware solutions that empower engineers to create custom digital circuits and systems for various applications, including telecommunications, automotive, industrial, and consumer electronics. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), further expanding AMD's portfolio in the semiconductor industry.
Application
The XC3S700A-4FTG256I is a Spartan-3 FPGA used in various applications, including digital signal processing, telecommunications, automotive systems, industrial automation, consumer electronics, and embedded systems. Its ability to handle complex logic operations and manage multiple I/O interfaces makes it suitable for real-time processing tasks, control applications, and prototyping for hardware designs.
Equivalent
The XC3S700A-4FTG256I is a Spartan-3 FPGA from Xilinx. Equivalent products include the XC3S700A-4FGG256I (different package), as well as FPGAs from competing brands like the Intel Cyclone III EP3C40 or Lattice ECP3. For specific applications, consider performance, I/O requirements, and power consumption when selecting an equivalent.
船舶
運輸管道我們
通過DHL、FedEx、TNT、UPS或您選擇的任何其他貨運代理提供全球運輸服務。
運費參攷(DHL/FedEx):
動態主要裝載: 運費從25美元到45美元(0.5公斤)不等,預計交貨時間為2-5個工作日。
聯邦快遞: 運費從25美元到40美元(0.5公斤)不等,預計交貨時間為3-7個工作日。
不斷電供應系統: 運費從25美元到45美元(0.5公斤)不等,預計交貨時間為3-7個工作日。
三硝基甲苯: 運費從25美元到65美元(0.5公斤)不等,預計交貨時間為3-7個工作日。
增强型短消息: 運費從30美元到50美元(0.5公斤)不等,預計交貨時間為7-15個工作日。
掛號: 運費為2-4美元(0.1公斤),預計交貨時間為5-20個工作日。
支付
Payment Methods
付款條件為100%預付。
現時,我們只接受以下付款方式:
1. 貝寶
2. 信用卡/借記卡
3. 電匯
類似的
-
MX25L3233FM1I-08Q
Macronix
-
MX25V1635FZNQ03
Macronix
-
MX25R3235FZNIL0
Macronix
-
MX30LF2G28AD-TI
Macronix
-
MX25L8035EM2I-10G
Macronix
-
MX25R6435FBDIL0
Macronix
-
MX25L25673GMI-10G
Macronix
-
MX25U25643GZNI00
Macronix
-
MX25V1635FM2I
Macronix
-
MX25U3232FZBI02
Macronix
-
MX25L6433FM2I-08G
Macronix
-
MX25L12835FZ2I-10..
Macronix