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XC3S400A-5FGG320C
IC FPGA 251 I/O 320FBGA
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規格
| Series | Spartan®-3A |
| Part Status | Obsolete |
| DigiKey Programmable | Not Verified |
| Total RAM Bits | 368640 |
| Number of I/O | 251 |
| Number of Gates | 400000 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package / Case | 320-BGA |
| Supplier Device Package | 320-FBGA (19x19) |
| Base Product Number | XC3S400 |
| Number of Logic Elements/Cells | 8064 |
| Number of LABs/CLBs | 896 |
概述
Description
The XC3S400A-5FGG320C is a Field Programmable Gate Array (FPGA) from Xilinx's Spartan-3A series. It features 400,000 system gates and is designed for cost-sensitive applications requiring high performance and flexibility. With a 5-speed grade, it operates at a maximum clock frequency of 100 MHz. The device is housed in a 320-pin Fine Pitch Ball Grid Array (FBGA) package, supporting various I/O standards.
Key features include 576 configurable logic blocks (CLBs), 4,608 flip-flops, and extensive routing resources. The XC3S400A also supports embedded block RAM (BRAM) for efficient data storage, and it offers digital signal processing (DSP) slices for performing complex mathematical computations.
Its architecture is highly suitable for applications in communications, automotive, and consumer electronics, providing low power consumption and high performance. The XC3S400A can be configured using the Xilinx ISE design suite, enabling designers to implement custom hardware solutions efficiently. Overall, it is a versatile choice for engineers looking to balance performance, cost, and power in their designs.
Key features include 576 configurable logic blocks (CLBs), 4,608 flip-flops, and extensive routing resources. The XC3S400A also supports embedded block RAM (BRAM) for efficient data storage, and it offers digital signal processing (DSP) slices for performing complex mathematical computations.
Its architecture is highly suitable for applications in communications, automotive, and consumer electronics, providing low power consumption and high performance. The XC3S400A can be configured using the Xilinx ISE design suite, enabling designers to implement custom hardware solutions efficiently. Overall, it is a versatile choice for engineers looking to balance performance, cost, and power in their designs.
Features
The XC3S400A-5FGG320C is a Field Programmable Gate Array (FPGA) from Xilinx's Spartan-3A series. Key features include:
1. Logic Cells: Offers approximately 400,000 system gates with 2,016 logic slices, each containing four 6-input LUTs and flip-flops.
2. I/O Pins: Up to 208 I/O pins configurable for various signal standards, supporting both single-ended and differential signaling.
3. Embedded Memory: Supports up to 12 Kbits of block RAM (with various configurations).
4. DSP Slices: Contains dedicated DSP slices for high-performance arithmetic operations.
5. Configuration: Supports multiple configuration methods, including JTAG and serial configuration.
6. Power: Operates at a nominal voltage of 1.2V for core and 3.3V for I/O, optimized for power efficiency.
7. Performance: Capable of achieving high-performance designs with a maximum clock speed up to 200 MHz.
8. Packages: Available in a 320-ball fine-pitch BGA package, enhancing the device’s compactness and thermal management.
This FPGA is ideal for applications in communications, automotive, and industrial control systems.
1. Logic Cells: Offers approximately 400,000 system gates with 2,016 logic slices, each containing four 6-input LUTs and flip-flops.
2. I/O Pins: Up to 208 I/O pins configurable for various signal standards, supporting both single-ended and differential signaling.
3. Embedded Memory: Supports up to 12 Kbits of block RAM (with various configurations).
4. DSP Slices: Contains dedicated DSP slices for high-performance arithmetic operations.
5. Configuration: Supports multiple configuration methods, including JTAG and serial configuration.
6. Power: Operates at a nominal voltage of 1.2V for core and 3.3V for I/O, optimized for power efficiency.
7. Performance: Capable of achieving high-performance designs with a maximum clock speed up to 200 MHz.
8. Packages: Available in a 320-ball fine-pitch BGA package, enhancing the device’s compactness and thermal management.
This FPGA is ideal for applications in communications, automotive, and industrial control systems.
Package
The XC3S400A-5FGG320C is packaged in a Fine Pitch Ball Grid Array (FBGA) format, specifically with 320 balls. This package type provides efficient thermal performance and high pin density, suitable for compact designs in FPGA applications.
Pinout
The XC3S400A-5FGG320C is a Spartan-3 FPGA from Xilinx. It features a pin count of 320. The device is designed for various applications, including digital signal processing, communications, and embedded processing.
The pin functions include general-purpose I/O (GPIO) pins, dedicated configuration pins, power supply pins, ground pins, and optional clock inputs. It supports various I/O standards, allowing for flexibility in interfacing with other components. The FPGA architecture enables users to implement custom logic designs, and the device provides internal resources such as configurable logic blocks (CLBs), digital signal processing (DSP) slices, and block RAM (BRAM) for efficient data handling and processing.
Overall, the XC3S400A-5FGG320C is suitable for applications requiring moderate logic capacity and performance in a compact form factor.
The pin functions include general-purpose I/O (GPIO) pins, dedicated configuration pins, power supply pins, ground pins, and optional clock inputs. It supports various I/O standards, allowing for flexibility in interfacing with other components. The FPGA architecture enables users to implement custom logic designs, and the device provides internal resources such as configurable logic blocks (CLBs), digital signal processing (DSP) slices, and block RAM (BRAM) for efficient data handling and processing.
Overall, the XC3S400A-5FGG320C is suitable for applications requiring moderate logic capacity and performance in a compact form factor.
Manufacturer
The manufacturer of the XC3S400A-5FGG320C is Xilinx, Inc. Xilinx is a leading technology company that specializes in the design and production of field-programmable gate arrays (FPGAs), programmable system-on-chips (SoCs), and other related technologies. Founded in 1984, Xilinx pioneered the FPGA market and is known for its innovative solutions that enable designers to create customizable hardware for various applications, including telecommunications, automotive, industrial, and consumer electronics. The company focuses on providing high-performance, flexible, and scalable solutions that meet the evolving needs of engineers and developers in the digital design space. In 2020, Xilinx was acquired by Advanced Micro Devices (AMD), further expanding its capabilities in the semiconductor industry.
Application
The XC3S400A-5FGG320C is a Spartan-3 FPGA from Xilinx, commonly used in various applications including digital signal processing, telecommunications, automotive systems, industrial automation, and consumer electronics. Its versatility allows for custom logic implementation, prototyping, and hardware acceleration in embedded systems, often benefiting applications requiring high-speed data processing and real-time computation.
Equivalent
The XC3S400A-5FGG320C is a Spartan-3 FPGA from Xilinx. Equivalent products include the XC3S200A and XC3S1000 models, which offer varying logic resources and features within the Spartan-3 family. For newer alternatives, consider the Artix-7 series (e.g., XC7A100T) or lower-end devices from the Xilinx UltraScale or UltraScale+ families, depending on specific requirements like I/O count, performance, and power consumption. Always verify compatibility for your specific application.
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