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XC3S200AN-4FTG256C
IC FPGA 195 I/O 256FTBGA
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- 製造商。 部分 #XC3S200AN-4FTG256C
- 包 BGA-256
- 資料表
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規格
| Package | Tray |
| Series | Spartan®-3AN |
| ProductStatus | Active |
| NumberofLABs/CLBs | 448 |
| NumberofLogicElements/Cells | 4032 |
| TotalRAMBits | 294912 |
| NumberofI/O | 195 |
| NumberofGates | 200000 |
| Voltage-Supply | 1.14V ~ 1.26V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 85°C (TJ) |
| Package/Case | 256-LBGA |
概述
Description
The XC3S200AN-4FTG256C is a field-programmable gate array (FPGA) from Xilinx's Spartan-3A series. It features 200,000 system gates and is designed for cost-sensitive applications requiring moderate performance. The device operates at a maximum clock frequency of 200 MHz and is built on a 90 nm process technology, offering improved performance and lower power consumption.
This FPGA comes in a fine-pitch ball grid array (FBGA) package with 256 pins, facilitating high-density interconnections. It supports various I/O standards, making it versatile for different applications. The XC3S200AN includes dedicated digital signal processing (DSP) slices, block RAM, and a rich set of configurable logic blocks, allowing for efficient implementation of complex algorithms and functions.
Ideal for applications in communications, automotive, and consumer electronics, the XC3S200AN-4FTG256C enables rapid prototyping and iterative design due to its reprogrammable nature. It is supported by Xilinx's design tools, including Vivado and ISE, which facilitate easy design entry, simulation, and debugging.
This FPGA comes in a fine-pitch ball grid array (FBGA) package with 256 pins, facilitating high-density interconnections. It supports various I/O standards, making it versatile for different applications. The XC3S200AN includes dedicated digital signal processing (DSP) slices, block RAM, and a rich set of configurable logic blocks, allowing for efficient implementation of complex algorithms and functions.
Ideal for applications in communications, automotive, and consumer electronics, the XC3S200AN-4FTG256C enables rapid prototyping and iterative design due to its reprogrammable nature. It is supported by Xilinx's design tools, including Vivado and ISE, which facilitate easy design entry, simulation, and debugging.
Features
The XC3S200AN-4FTG256C is a Spartan-3A FPGA from Xilinx, designed for cost-sensitive applications. Key features include:
- Logic Cells: 200,000 system gates with 1,440 logic cells, enabling complex designs.
- I/O Pins: 256 I/O pins with support for various I/O standards, including LVTTL, LVCMOS, and others.
- Memory: Up to 128 Kbits of block RAM, allowing for efficient data storage and manipulation.
- DSP Slices: Supports digital signal processing with dedicated DSP slices for high-performance applications.
- Clock Management: Integrated clock management with PLLs to manage clock frequencies and distribution.
- Configuration: Supports JTAG, SPI, and BPI Flash configurations for flexible programming options.
- Power Consumption: Low power consumption, making it suitable for battery-operated devices.
- Development Tools: Compatible with Xilinx ISE Design Suite for design and simulation.
This FPGA is ideal for applications in communications, automotive, consumer electronics, and industrial automation, where cost and performance are critical.
- Logic Cells: 200,000 system gates with 1,440 logic cells, enabling complex designs.
- I/O Pins: 256 I/O pins with support for various I/O standards, including LVTTL, LVCMOS, and others.
- Memory: Up to 128 Kbits of block RAM, allowing for efficient data storage and manipulation.
- DSP Slices: Supports digital signal processing with dedicated DSP slices for high-performance applications.
- Clock Management: Integrated clock management with PLLs to manage clock frequencies and distribution.
- Configuration: Supports JTAG, SPI, and BPI Flash configurations for flexible programming options.
- Power Consumption: Low power consumption, making it suitable for battery-operated devices.
- Development Tools: Compatible with Xilinx ISE Design Suite for design and simulation.
This FPGA is ideal for applications in communications, automotive, consumer electronics, and industrial automation, where cost and performance are critical.
Package
The XC3S200AN-4FTG256C is packaged in a Fine-Pitch Ball Grid Array (FBGA) format with 256 balls. This type of package is designed for compactness and efficient thermal performance, making it suitable for high-density applications.
Pinout
The XC3S200AN-4FTG256C is a Field Programmable Gate Array (FPGA) from Xilinx's Spartan-3A series. It has a pin count of 256.
The primary functions of the XC3S200AN include digital logic implementation, signal processing, and interfacing with various I/O standards. It supports a range of features such as:
- 200,000 system gates
- 1,536 logic cells
- 100 I/O pins, with support for various voltage levels and standards
- On-chip block RAM
- Digital Signal Processing (DSP) slices
The device is typically used in applications such as communications, automotive, industrial control, and more. The "4" in the designation indicates the speed grade, while "FTG" denotes the package type (Fine Pitch Ball Grid Array).
The primary functions of the XC3S200AN include digital logic implementation, signal processing, and interfacing with various I/O standards. It supports a range of features such as:
- 200,000 system gates
- 1,536 logic cells
- 100 I/O pins, with support for various voltage levels and standards
- On-chip block RAM
- Digital Signal Processing (DSP) slices
The device is typically used in applications such as communications, automotive, industrial control, and more. The "4" in the designation indicates the speed grade, while "FTG" denotes the package type (Fine Pitch Ball Grid Array).
Manufacturer
The manufacturer of the XC3S200AN-4FTG256C is Xilinx, Inc. Xilinx is a semiconductor company that specializes in the design and production of programmable logic devices, including Field Programmable Gate Arrays (FPGAs), Complex Programmable Logic Devices (CPLDs), and software development tools. Established in 1984, Xilinx is known for pioneering the FPGA technology, allowing engineers to create custom hardware solutions for a wide range of applications, including telecommunications, automotive, aerospace, industrial, and consumer electronics. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), further expanding its capabilities in the semiconductor industry.
Application
The XC3S200AN-4FTG256C is a Spartan-3A FPGA from Xilinx, commonly used in applications such as digital signal processing, embedded systems, industrial automation, automotive electronics, telecommunications, and consumer electronics. Its versatility allows for custom logic implementations, prototyping, and hardware acceleration in various projects, making it suitable for both low-power and high-performance designs.
Equivalent
The XC3S200AN-4FTG256C is a Spartan-3A FPGA from Xilinx. Equivalent products include the XC3S200-4FTG256, which is the standard version without the extended temperature range. For similar performance and functionality, consider the Lattice ECP3 series or Intel’s Cyclone III FPGAs. Always verify specific requirements and configurations to ensure compatibility.
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