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XC3S1600E-5FGG320C
IC FPGA 250 I/O 320FBGA
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規格
| Series | Spartan®-3E |
| Part Status | Obsolete |
| DigiKey Programmable | Not Verified |
| Total RAM Bits | 663552 |
| Number of I/O | 250 |
| Number of Gates | 1600000 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package / Case | 320-BGA |
| Supplier Device Package | 320-FBGA (19x19) |
| Base Product Number | XC3S1600 |
| Number of Logic Elements/Cells | 33192 |
| Number of LABs/CLBs | 3688 |
概述
Description
The XC3S1600E-5FGG320C is a field-programmable gate array (FPGA) from Xilinx's Spartan-3E series. It is designed for cost-sensitive applications that require significant logic resources and flexibility. The device features around 1.6 million system gates, 576 configurable logic blocks (CLBs), and up to 1,440 Kbits of block RAM, providing a robust platform for implementing various digital circuits.
This FPGA operates at a maximum clock frequency of 200 MHz and supports multiple I/O standards, making it suitable for various interfacing needs. The "5" in its designation indicates the speed grade, with lower numbers representing faster operation. The 320-pin Fine Pitch Ball Grid Array (FBGA) package offers a compact footprint for space-constrained designs.
Applications of the XC3S1600E include digital signal processing, industrial automation, communications, and consumer electronics. Its combination of reprogrammability, scalability, and performance makes it a popular choice for developers seeking to implement custom hardware solutions without the need for ASIC fabrication.
This FPGA operates at a maximum clock frequency of 200 MHz and supports multiple I/O standards, making it suitable for various interfacing needs. The "5" in its designation indicates the speed grade, with lower numbers representing faster operation. The 320-pin Fine Pitch Ball Grid Array (FBGA) package offers a compact footprint for space-constrained designs.
Applications of the XC3S1600E include digital signal processing, industrial automation, communications, and consumer electronics. Its combination of reprogrammability, scalability, and performance makes it a popular choice for developers seeking to implement custom hardware solutions without the need for ASIC fabrication.
Features
The XC3S1600E-5FGG320C is a Spartan-3E FPGA from Xilinx, designed for low-cost, high-performance applications. Key features include:
1. Logic Cells: 1,600 logic cells for implementing complex logic functions.
2. Configurable I/O: Up to 88 I/O pins with support for various voltage standards.
3. Embedded Memory: 16 Kbit of block RAM for data storage and buffering.
4. Digital Signal Processing (DSP): Features 12 dedicated DSP slices for efficient signal processing tasks.
5. Clock Management: Provides multiple clock management resources, including phase-locked loops (PLLs).
6. Low Power Consumption: Designed for energy-efficient operation, making it suitable for battery-powered applications.
7. Development Tools: Compatible with Xilinx ISE Design Suite for design entry, simulation, and implementation.
8. Package: Available in a 320-pin fine-pitch BGA (FGG) package.
This FPGA is ideal for a range of applications, including communications, automotive, and industrial control systems, offering flexibility and scalability in design.
1. Logic Cells: 1,600 logic cells for implementing complex logic functions.
2. Configurable I/O: Up to 88 I/O pins with support for various voltage standards.
3. Embedded Memory: 16 Kbit of block RAM for data storage and buffering.
4. Digital Signal Processing (DSP): Features 12 dedicated DSP slices for efficient signal processing tasks.
5. Clock Management: Provides multiple clock management resources, including phase-locked loops (PLLs).
6. Low Power Consumption: Designed for energy-efficient operation, making it suitable for battery-powered applications.
7. Development Tools: Compatible with Xilinx ISE Design Suite for design entry, simulation, and implementation.
8. Package: Available in a 320-pin fine-pitch BGA (FGG) package.
This FPGA is ideal for a range of applications, including communications, automotive, and industrial control systems, offering flexibility and scalability in design.
Package
The XC3S1600E-5FGG320C is packaged in a Fine-Pitch Ball Grid Array (FBGA) format, specifically featuring a 320-ball configuration. This package type is designed for high-density applications and provides excellent thermal and electrical performance.
Pinout
The XC3S1600E-5FGG320C is part of the Xilinx Spartan-3E FPGA family. It has a pin count of 320.
The primary functions of the pins include:
1. User I/O: General-purpose input/output pins for interfacing with external devices.
2. Configuration Pins: Pins used for device configuration and setup (e.g., TMS, TDI, TCK).
3. Power Supply Pins: Pins for supplying power (VCC, GND).
4. Clock Pins: Dedicated pins for clock inputs.
5. JTAG Pins: For in-circuit debugging and programming.
This FPGA is designed for various applications, including digital signal processing, embedded systems, and communication systems, providing flexibility in design and implementation.
The primary functions of the pins include:
1. User I/O: General-purpose input/output pins for interfacing with external devices.
2. Configuration Pins: Pins used for device configuration and setup (e.g., TMS, TDI, TCK).
3. Power Supply Pins: Pins for supplying power (VCC, GND).
4. Clock Pins: Dedicated pins for clock inputs.
5. JTAG Pins: For in-circuit debugging and programming.
This FPGA is designed for various applications, including digital signal processing, embedded systems, and communication systems, providing flexibility in design and implementation.
Manufacturer
The manufacturer of the XC3S1600E-5FGG320C is Xilinx, Inc. Xilinx is a semiconductor company known for its innovative programmable logic devices, including Field-Programmable Gate Arrays (FPGAs), Complex Programmable Logic Devices (CPLDs), and software development tools. Founded in 1984, Xilinx has been a leader in the industry, providing solutions for various applications such as telecommunications, automotive, aerospace, and data processing. The XC3S1600E is part of the Spartan-3E FPGA family, designed for cost-sensitive applications requiring a balance of performance and efficiency. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), expanding its capabilities in high-performance computing and integrated solutions.
Application
The XC3S1600E-5FGG320C is a Spartan-3E FPGA used in various application areas, including digital signal processing, telecommunications, automotive systems, industrial automation, consumer electronics, and medical devices. Its versatility allows for real-time data processing, custom logic implementations, and rapid prototyping, making it suitable for applications requiring low power consumption and high performance.
Equivalent
The XC3S1600E-5FGG320C is a Spartan-3E FPGA from Xilinx. Equivalent products include the Lattice ECP3-70, Altera Cyclone III EP3C16, and Microsemi SmartFusion2 M2S010. These alternatives offer similar performance, logic density, and applications in digital design.
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