XC2VP70-6FF1704I

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XC2VP70-6FF1704I

IC FPGA 996 I/O 1704FCBGA

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規格

Supplier AMD Xilinx
Package Tray
Series Virtex®-II Pro
ProductStatus Obsolete
NumberofLABs/CLBs 8272
NumberofLogicElements/Cells 74448
TotalRAMBits 6045696
NumberofI/O 996
Voltage-Supply 1.425V ~ 1.575V
MountingType Surface Mount
OperatingTemperature -40°C ~ 100°C (TJ)
Package/Case 1704-BBGA, FCBGA

概述

Description

XC2VP70-6FF1704I is a Xilinx Virtex-2 Pro FPGA device. It sits in the Virtex-2 Pro family, offering FPGA fabric with an embedded PowerPC 405 hard processor core on many devices, plus DSP slices and block RAM for embedded systems.
Key points
- Logic capacity: about 70K logic cells (70K-class device).
- Speed grade: -6 (faster timing within the device family).
- Package: FF1704 flip-chip BGA with 1,704 balls (FF1704).
- Temperature grade: I indicates industrial temperature range.
- Features: FPGA fabric, embedded hard processor core (PowerPC 405) on select variants, plus memory blocks, DSP resources, and high-density I/O.
Typical use
- Embedded control and processing, telecom, signal processing, and data-path applications requiring both programmable logic and a hard CPU core.
For exact I/O counts, RAM, DSP, and timing specs, consult the Xilinx datasheet for XC2VP70-6FF1704I.

Features

Here are the key features of XC2VP70-6FF1704I (Virtex-2 Pro, on-chip PowerPC 405 core):
- Family and density: Virtex-2 Pro FPGA with ~70K logic cells
- On-chip processor: Integrated PowerPC 405 hard processor core
- Memory: On-chip block RAM plus distributed RAM resources
- DSP resources: Logic/DSP resources suitable for signal processing
- I/O and packaging: High-density I/O in the FF1704 (1704-ball) BGA package
- Clocking: Flexible clock management with PLL/DLL resources for multiple clock domains
- Performance: Speed grade -6 (device timing/throughput characteristics per grade)
- Temperature/grade: Industrial temperature range (I-grade)
- Configuration: Standard FPGA configuration and peripheral interfaces compatible with Xilinx tools
- General: Reconfigurable logic, routing resources, and standard I/O standards support
Note: For exact numbers (e.g., exact RAM capacity, DSP counts, I/O counts, and supported I/O standards), please refer to the official datasheet.

Package

XC2VP70-6FF1704I uses a FineLine BGA package (FF1704) with 1,704 balls; the trailing I indicates RoHS-compliant industrial temperature range.

Pinout

- Pin count: 1704 pins (FF1704 package, BGA).
- Function: Xilinx XC2VP70 is a Virtex-2 Pro FPGA with ~70K logic cells and an on-chip PowerPC 405 processor for embedded processing.

Manufacturer

- Manufacturer: Xilinx, Inc. (now part of AMD)
- What kind of company: A semiconductor company that designs and manufactures programmable logic devices, including FPGAs and CPLDs, as well as related ICs and system-on-a-chip solutions.

Application

Typical applications for XC2VP70-6FF1704I (Vertex-2 Pro FPGA):
- High-performance DSP and signal processing
- Telecom/datacom datapaths and packet processing
- Embedded processing acceleration and CPU offload
- Video/vision and image processing
- Instrumentation, data acquisition and test equipment
- Aerospace/defense and automotive networking and control
- Prototyping, emulation and ASIC replacement

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