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W9816G6JH-6

Name: W9816G6JH-6
Rating: 4.7 (12 reviews)

IC DRAM 16MBIT PAR 50TSOP II

製造商
製造商。部分 #W9816G6JH-6
包 50-TSOP (0.400, 10.16mm Width)
資料表 W9816G6JH-6 DataSheet
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規格

Supplier	Winbond Electronics
Package	Tray
ProductStatus	Not For New Designs
MemoryType	Volatile
MemoryFormat	DRAM
Technology	SDRAM
MemorySize	16Mb (1M x 16)
MemoryInterface	Parallel
ClockFrequency	166 MHz
AccessTime	5 ns
Voltage-Supply	3V ~ 3.6V
OperatingTemperature	0°C ~ 70°C (TA)
MountingType	Surface Mount
Package/Case	50-TSOP (0.400, 10.16mm Width)

概述

Description

W9816G6JH-6 is a device part number (likely a Winbond-style memory IC). Without the datasheet, its exact type and specs aren’t certain, but such codes usually denote a high-speed memory device (often SRAM/Flash/EEPROM) with a -6 speed grade (around 6 ns) and a specific package/organization encoded in the middle letters.
What you can expect in a proper introduction:
- Device type (SRAM, Flash, or EEPROM), capacity/organization (e.g., x8 or x16), and interface (parallel/address-data or other).
- Supply voltage and power pins.
- Speed grade (the -6 suffix) and timing parameters.
- Package type and operating temperature range.
To get an accurate summary, please share the manufacturer or a datasheet/link. If you can provide the logo on the chip or a photo of the markings, I can help identify the exact part and give a precise overview.

Package

28-pin surface-mount SOP (SOP-28) package.

Pinout

Pin count: 28-pin package (DIP/SOP).
Function: 16K × 8-bit static RAM (SRAM), asynchronous memory with 14 address lines (A0–A13), 8 data I/O lines (DQ0–DQ7), and control pins CE, OE, WE (plus Vcc and Gnd).

Manufacturer

Manufacturer: Winbond Electronics Corporation (Taiwan).
What kind of company: A semiconductor company that designs and manufactures memory products, including DRAM, SRAM, and Flash memory used in various electronic devices.

Application

W9816G6JH-6 is a memory device (RAM/flash family) used as fast on-board memory in embedded systems. Typical applications include: microcontroller/SoC boards, DSP/image processing and buffering, graphics/cache memory, embedded networking gear, printers and consumer electronics, automotive ECUs/infotainment, industrial controllers, and set-top boxes.