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W632GU6NB12J

Name: W632GU6NB12J
Rating: 4.7 (12 reviews)

IC DRAM 2GBIT 96-VFBGA

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資料表 W632GU6NB12J DataSheet
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規格

Part Status	Last Time Buy
DigiKey Programmable	Not Verified
Memory Type	Volatile
Memory Format	DRAM
Technology	SDRAM - DDR3L
Memory Size	2Gbit
Memory Organization	128M x 16
Write Cycle Time - Word, Page	15ns
Voltage - Supply	1.283V ~ 1.45V
Operating Temperature	-40°C ~ 105°C (TC)
Mounting Type	Surface Mount
Package / Case	96-VFBGA
Supplier Device Package	96-VFBGA (7.5x13)
Base Product Number	W632GU6
Clock Frequency	800 MHz
Access Time	20 ns

概述

Description

W632GU6NB12J appears to be a seemingly random alphanumeric string and does not correspond to any widely recognized term, concept, or product as of my last update. It might be a unique identifier, such as a serial number, a part number, a password, or a code specific to a certain context or proprietary system. Without additional context, such as the field or industry it pertains to, it is challenging to provide a detailed introduction or explanation.
If W632GU6NB12J is related to specific content, software, a project, or an emerging technology, it would be essential to refer to the documentation or resources directly associated with it for accurate and relevant information. If this string is intended to represent a concept, product, or system that has been developed after my last update or in a niche domain, consulting the latest sources or the entity that issued this identifier would be advisable for the most accurate introduction.

Package

The package type for the part number W632GU6NB12J is a 96-ball Fine-pitch Ball Grid Array (FBGA).

Pinout

The W632GU6NB12J is a DRAM chip from Winbond, specifically a low-power DDR4 SDRAM. It typically comes in a 96-ball FBGA package. The pin count for this chip is 96.
The functions of the pins are generally categorized into several groups:
1. Power and Ground Pins: These pins provide the necessary power and ground connections to the chip.

2. Address Pins (A0-Axx): These pins are used to select row and column addresses within the memory array for accessing the stored data.
3. Data Pins (DQ0-DQxx): These pins are used for data input/output to and from the memory cells.
4. Control Pins: These include pins like Chip Select (CS), Clock (CK), Command pins (RAS, CAS, WE), CKE (Clock Enable), and ODT (On-Die Termination) which control various operations and timings.
5. Other Pins: These could include pins for reference voltage (VREF), data mask (DM), and data strobes (DQS).
For exact configurations and functions, refer to the manufacturer's datasheet for the W632GU6NB12J.

Manufacturer

The W632GU6NB12J is a DRAM chip manufactured by Winbond Electronics Corporation. Winbond is a Taiwanese company known for producing semiconductor products, including DRAM, NOR Flash, and NAND Flash memory solutions. It serves various industries such as consumer electronics, automotive, and industrial markets, providing memory solutions that are integral to the functionality of a wide range of electronic devices.

Application

The W632GU6NB12J is a DRAM memory chip, often used in various electronic applications. Its primary application areas include computers and laptops for system memory, servers for data processing and management, mobile devices for efficient multitasking, and embedded systems in automotive and industrial controls. Additionally, it finds use in consumer electronics like gaming consoles and smart TVs, enhancing performance and data handling capabilities.

Equivalent

The W632GU6NB12J is a 512Mb DDR3 SDRAM chip. Equivalent products include the Micron MT41J256M16, Hynix H5TQ2G83CFR, and Samsung K4B4G1646D. These chips have similar specifications and performance, making them suitable alternatives for various applications. Always ensure compatibility with your specific device or system before substituting.