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W25X64VSFIG
IC FLASH 64MBIT SPI 75MHZ 16SOIC
- 製造商
- 製造商。 部分 #W25X64VSFIG
- 包 16-SOIC (0.295", 7.50mm Width)
- 資料表
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規格
| Package | Tube |
| Series | SpiFlash® |
| ProductStatus | Obsolete |
| MemoryType | Non-Volatile |
| MemoryFormat | FLASH |
| Technology | FLASH |
| MemorySize | 64Mb (8M x 8) |
| MemoryInterface | SPI |
| ClockFrequency | 75 MHz |
| WriteCycleTime-WordPage | 3ms |
| Voltage-Supply | 2.7V ~ 3.6V |
| OperatingTemperature | -40°C ~ 85°C (TA) |
| MountingType | Surface Mount |
| Package/Case | 16-SOIC (0.295, 7.50mm Width) |
概述
Description
W25X64VSFIG is a Winbond 64M-bit serial flash memory (8 MB) that uses a standard SPI interface. It’s intended for firmware storage, code updates, and data logging in embedded systems.
Key points:
- Capacity: 64 Mbit (8 MB)
- Interface: SPI, with standard commands (READ, FAST READ, PAGE PROGRAM, SECTOR ERASE, BLOCK ERASE, CHIP ERASE, WREN, etc.)
- Organization: 256-byte page size; 4 KB sectors; 64 KB blocks
- Voltage: typically 2.7–3.6 V
- Speed: supports fast read modes up to high MHz ranges (consult datasheet for exact max)
- Features: write enable/disable, busy/status registers, deep power-down, hold, hardware write protection
- Endurance/retention: typical program/erase cycles in the 100k+ range; long data retention per datasheet
- Package: 8-pin (specific package variant indicated by the VSFIG suffix)
Use cases: firmware storage, boot devices, field updates, and small data logging. For exact timing, command set, and pinout, refer to the Winbond W25X64VSFIG datasheet.
Key points:
- Capacity: 64 Mbit (8 MB)
- Interface: SPI, with standard commands (READ, FAST READ, PAGE PROGRAM, SECTOR ERASE, BLOCK ERASE, CHIP ERASE, WREN, etc.)
- Organization: 256-byte page size; 4 KB sectors; 64 KB blocks
- Voltage: typically 2.7–3.6 V
- Speed: supports fast read modes up to high MHz ranges (consult datasheet for exact max)
- Features: write enable/disable, busy/status registers, deep power-down, hold, hardware write protection
- Endurance/retention: typical program/erase cycles in the 100k+ range; long data retention per datasheet
- Package: 8-pin (specific package variant indicated by the VSFIG suffix)
Use cases: firmware storage, boot devices, field updates, and small data logging. For exact timing, command set, and pinout, refer to the Winbond W25X64VSFIG datasheet.
Features
Winbond W25X64VSFIG features (concise):
- 64 Mbit (8 MB) serial flash memory
- SPI-compatible interface (standard SPI; supports fast/read modes)
- Page program size: 256 bytes
- Erase architecture: 4 KB sectors; 64 KB blocks; full-chip erase
- Erase/Program suspend and resume
- Ready/Busy (WIP) and Write Enable (WEL) status bits
- Deep power-down mode for low current
- Data retention around 20 years
- Endurance ~100,000 erase cycles per sector
- Operating voltage: typically 2.7–3.6V
- Temperature ranges: -40 to +85°C (commercial) or -40 to +125°C (industrial)
- Package: 8-pin SOIC/SOP (typical for W25X64 variants)
Applications: code/storage memory for microcontrollers, embedded systems, boot ROM, and data logging.
- 64 Mbit (8 MB) serial flash memory
- SPI-compatible interface (standard SPI; supports fast/read modes)
- Page program size: 256 bytes
- Erase architecture: 4 KB sectors; 64 KB blocks; full-chip erase
- Erase/Program suspend and resume
- Ready/Busy (WIP) and Write Enable (WEL) status bits
- Deep power-down mode for low current
- Data retention around 20 years
- Endurance ~100,000 erase cycles per sector
- Operating voltage: typically 2.7–3.6V
- Temperature ranges: -40 to +85°C (commercial) or -40 to +125°C (industrial)
- Package: 8-pin SOIC/SOP (typical for W25X64 variants)
Applications: code/storage memory for microcontrollers, embedded systems, boot ROM, and data logging.
Package
8-pin SOP (SOIC-8) package.
Pinout
Pin count: 8 pins (SOP-8).
Function: 64‑Mbit serial SPI flash memory. Pins (1–8): CS# (chip select), DO/SO (data out), WP# (write protect), GND, DI/SI (data in), SCK (clock), HOLD#, VCC.
Function: 64‑Mbit serial SPI flash memory. Pins (1–8): CS# (chip select), DO/SO (data out), WP# (write protect), GND, DI/SI (data in), SCK (clock), HOLD#, VCC.
Manufacturer
- Manufacturer: Winbond Electronics Corporation (Winbond).
- What kind of company: A Taiwan-based semiconductor company that designs and manufactures memory ICs (NOR/NAND flash, DRAM) and other integrated circuits for global electronics applications.
- What kind of company: A Taiwan-based semiconductor company that designs and manufactures memory ICs (NOR/NAND flash, DRAM) and other integrated circuits for global electronics applications.
Application
- Boot/firmware storage and updates for MCUs/SoCs
- Program code, assets, and UI fonts/icons
- Data logging and configuration storage
- Storage for consumer electronics (set-top boxes, TVs, printers, cameras)
- Networking gear (routers, gateways)
- IoT and industrial embedded systems needing compact flash
- Program code, assets, and UI fonts/icons
- Data logging and configuration storage
- Storage for consumer electronics (set-top boxes, TVs, printers, cameras)
- Networking gear (routers, gateways)
- IoT and industrial embedded systems needing compact flash
Equivalent
Equivalent 64Mbit SPI NOR Flash parts include:
- Winbond W25Q64FV
- Macronix MX25L6406E / MX25L64F
- Spansion S25FL064K (S25FL064P)
- Micron N25Q64A11ESE
- Gigadevice GD25Q64C
- ISSI IS25LP064A
Note: voltage, timing, and package differ; check datasheets for exact cross-reference.
- Winbond W25Q64FV
- Macronix MX25L6406E / MX25L64F
- Spansion S25FL064K (S25FL064P)
- Micron N25Q64A11ESE
- Gigadevice GD25Q64C
- ISSI IS25LP064A
Note: voltage, timing, and package differ; check datasheets for exact cross-reference.
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