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W25Q128BVEIG

Name: W25Q128BVEIG
Rating: 4.7 (12 reviews)

IC FLASH 128MBIT SPI/QUAD 8WSON

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規格

Series	SpiFlash®
Part Status	Obsolete
Base Product Number	W25Q128
DigiKey Programmable	Not Verified
Memory Type	Non-Volatile
Memory Format	FLASH
Technology	FLASH - NOR
Memory Size	128Mbit
Memory Organization	16M x 8
Memory Interface	SPI - Quad I/O
Clock Frequency	104 MHz
Write Cycle Time - Word, Page	50µs, 3ms
Voltage - Supply	2.7V ~ 3.6V
Operating Temperature	-40°C ~ 85°C (TA)
Mounting Type	Surface Mount
Package	8-WDFN Exposed Pad
Supplier Device Package	8-WSON (8x6)
Packaging	Tube

概述

Description

W25Q128BVEIG is Winbond’s 128‑Mbit serial flash memory in an 8‑pin package. It stores firmware and data for embedded systems and is accessed via SPI.
Key specs (typical):
- Supply voltage: 2.7–3.6 V (3.3 V nominal)
- Capacity: 128 Mbit (16 MBytes)
- Interfaces: Standard SPI, plus Dual I/O and Quad I/O (QPI) up to about 100+ MHz
- Organization: 256‑byte pages; supports page programming
- Erase: sector and larger blocks (high/low‑level erase commands)
- Features: fast read, deep power‑down, hardware write protection (WP/HOLD), security registers, XIP/memory‑mapped access
Package/grading:
- 8‑pin package; RoHS compliant (suffix VEIG encodes package/grade options in Winbond’s line)
Typical uses:
- Firmware/BIOS storage, boot ROMs, code storage for MCUs/FPGA, data logging, and other non‑volatile storage in embedded systems.
Bottom line: high‑density, low‑power SPI flash enabling fast, persistent code/data storage with flexible I/O modes.

Features

Key features of W25Q128BVEIG:
- 128 Mbit serial flash (16 MB) with SPI-compatible interface
- Supports Standard SPI, Dual I/O, Quad I/O and QPI for high-speed data transfer
- Supply voltage: 2.7–3.6 V (3.3 V typical)
- Clock: up to 104 MHz (SPI); high-speed modes via Quad/QPI
- Page program: 256 bytes
- Erase structure: 4 KB sectors; 64 KB blocks; chip erase
- Endurance: ~100,000 program/erase cycles; data retention ~20 years
- Low-power modes: Deep Power-Down and standby
- Temperature: industrial range typically -40 °C to +85 °C
- Package: 8-pin small-outline (BVEIG variant), lead-free/RoHS-compliant
- Security/protection: hardware write-protect (WP#), HOLD# and status registers
Applications: code storage, firmware updates, boot devices and other embedded storage needs.

Package

An 8-pin SOP (SOIC-8) package.

Pinout

- Pin count: 8 pins (8-pin SOIC/SOP package)
- Function: Winbond W25Q128BVEIG is a 128‑Mbit serial SPI flash memory. Pins: CS, CLK, DI (MOSI), DO (MISO), WP#, HOLD#, VCC, GND. It provides standard SPI flash operations (Read/Fast Read, Page Program, sector/block/chip Erase) for firmware/storage.

Manufacturer

- Manufacturer: Winbond Electronics Corp.
- What kind of company: A Taiwan-based semiconductor company that designs and manufactures memory ICs (notably NOR flash and DRAM) for global electronics manufacturers.

Application

Application areas of W25Q128BVEIG:
- Firmware storage and boot ROM for microcontrollers/SoCs via SPI
- Code and data storage for embedded systems (industrial, consumer, automotive)
- Firmware updates and calibration/configuration data
- Data logging and look-up tables
- External memory for IoT modules, wearables, digital cameras, USB devices and other embedded electronics needing high-density SPI flash

Equivalent

Equivalent 128-Mbit SPI flash parts (same 3.3V, 8-pin package, SPI interface):
- Macronix MX25L12845G / MX25L12833F
- Gigadevice GD25Q128C
- Spansion/Cypress S25FL128S
- ISSI IS25LP128A
- Microchip 25Q128FV
(Source: cross-reference of 128Mbit serial flash devices; pinout/ timing may vary slightly—verify in datasheets.)