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W25N512GWEIR
512MB SERIAL NAND FLASH, 1.8V
- 製造商
- 製造商。 部分 #W25N512GWEIR
- 包 8-WDFN Exposed Pad
- 資料表 W25N512GWEIR DataSheet
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規格
| Supplier | Winbond Electronics |
| Package | Tray |
| Series | SpiFlash® |
| ProductStatus | Active |
| MemoryType | Non-Volatile |
| MemoryFormat | FLASH |
| Technology | FLASH - NAND (SLC) |
| MemorySize | 512Mb (64M x 8) |
| MemoryInterface | SPI - Quad I/O |
| ClockFrequency | 104 MHz |
| WriteCycleTime-WordPage | 700µs |
| AccessTime | 7 ns |
| Voltage-Supply | 1.7V ~ 1.95V |
| OperatingTemperature | -40°C ~ 85°C (TA) |
| MountingType | Surface Mount |
| Package/Case | 8-WDFN Exposed Pad |
概述
Description
Winbond W25N512GWEIR is a 512-Mbit serial NAND flash memory (W25N family) used for embedded storage. Key points:
- Capacity: 512 Mbit (64 MB).
- Interface: SPI-compatible with optional dual/quad I/O for higher throughput.
- Organization: pages (typically 2 KB), blocks, with on-chip ECC and automatic bad-block management.
- Operations: standard NAND commands for read, program (load/execute), and block erase; includes features like copy-back, cache read, and power-down modes.
- Applications: firmware storage, data logging, and other embedded storage needs in microcontrollers and processors.
- Electrical/Env: operates at common NAND voltages with an industrial temperature range variant available; consult datasheet for exact voltage and temperature specs.
For precise timing, command set details, endurance, and electrical characteristics, refer to the Winbond W25N512GWEIR datasheet.
- Capacity: 512 Mbit (64 MB).
- Interface: SPI-compatible with optional dual/quad I/O for higher throughput.
- Organization: pages (typically 2 KB), blocks, with on-chip ECC and automatic bad-block management.
- Operations: standard NAND commands for read, program (load/execute), and block erase; includes features like copy-back, cache read, and power-down modes.
- Applications: firmware storage, data logging, and other embedded storage needs in microcontrollers and processors.
- Electrical/Env: operates at common NAND voltages with an industrial temperature range variant available; consult datasheet for exact voltage and temperature specs.
For precise timing, command set details, endurance, and electrical characteristics, refer to the Winbond W25N512GWEIR datasheet.
Features
W25N512GWEIR is a Winbond 512‑Gbit (64‑GB) 3D NAND Flash device. Key features typically include:
- 3D TLC NAND architecture
- Toggle DDR interface with ONFI compatibility
- Multi‑plane/multi‑die architecture for high throughput
- Built‑in ECC (BCH) with bad block management
- Wear leveling and read disturb protection
- Security features: OTP area, secure erase, and protection options
- Low‑power operation with a wide operating voltage range
- Industrial/extended temperature options available
Note: exact speeds (read/write), endurance, page/plane details, and voltage specs should be confirmed from the official datasheet for precise numbers.
- 3D TLC NAND architecture
- Toggle DDR interface with ONFI compatibility
- Multi‑plane/multi‑die architecture for high throughput
- Built‑in ECC (BCH) with bad block management
- Wear leveling and read disturb protection
- Security features: OTP area, secure erase, and protection options
- Low‑power operation with a wide operating voltage range
- Industrial/extended temperature options available
Note: exact speeds (read/write), endurance, page/plane details, and voltage specs should be confirmed from the official datasheet for precise numbers.
Package
W25N512GWEIR uses an 8-pin WSON package (WSON-8).
Pinout
- Pin count: 8 pins (8-pin package).
- Function: W25N512GWEIR is a serial (SPI) NAND flash memory with a capacity of 512 Gbit. Pins provide VCC, GND, Chip Select (CS#), Clock (CLK), Data In (DI/SI), Data Out (DO/SO), Write Protect (WP#), and Hold (HOLD#). It uses an SPI-like interface for command and data transfer.
- Function: W25N512GWEIR is a serial (SPI) NAND flash memory with a capacity of 512 Gbit. Pins provide VCC, GND, Chip Select (CS#), Clock (CLK), Data In (DI/SI), Data Out (DO/SO), Write Protect (WP#), and Hold (HOLD#). It uses an SPI-like interface for command and data transfer.
Manufacturer
- Manufacturer: Winbond Electronics Corp.
- What kind of company: A Taiwan-based semiconductor company that designs and manufactures memory products (NAND flash and DRAM), a leading global supplier of non-volatile memory solutions for various applications.
- What kind of company: A Taiwan-based semiconductor company that designs and manufactures memory products (NAND flash and DRAM), a leading global supplier of non-volatile memory solutions for various applications.
Application
Application areas for W25N512GWEIR (high-density 3D NAND flash):
- Client and enterprise SSDs (NVMe/SATA)
- Embedded storage in automotive, industrial and medical devices
- Digital cameras, video surveillance, broadcast equipment
- NAS and data-center appliances (caching/tiered storage)
- High-capacity removable/storage in consumer electronics
Note: Uses a controller with the raw NAND die.
- Client and enterprise SSDs (NVMe/SATA)
- Embedded storage in automotive, industrial and medical devices
- Digital cameras, video surveillance, broadcast equipment
- NAS and data-center appliances (caching/tiered storage)
- High-capacity removable/storage in consumer electronics
Note: Uses a controller with the raw NAND die.
Equivalent
Equivalents (512-Mbit Serial NAND, same interface):
- Macronix MX25LN51245G
- GigaDevice GD25NQ512
- ISSI IS25NQ512
Note: verify package, voltage (commonly 3.3V), page size, timing, and I/O mode (SPI/dual-quad) before substitution.
- Macronix MX25LN51245G
- GigaDevice GD25NQ512
- ISSI IS25NQ512
Note: verify package, voltage (commonly 3.3V), page size, timing, and I/O mode (SPI/dual-quad) before substitution.
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