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TRF372017IRGZR
RF MODULATOR 300MHZ-4.8GHZ 48QFN
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規格
| Supplier | Texas Instruments,Rochester Electronics, LLC |
| Package | Tape & Reel (TR),Bulk |
| ProductStatus | Active |
| Function | Upconverter |
| LOFrequency | 300MHz ~ 4.8GHz |
| RFFrequency | 300MHz ~ 4.8GHz |
| P1dB | 12dBm |
| NoiseFloor | -153dBm/Hz |
| OutputPower | 3dBm |
| Current-Supply | 200 mA |
| Voltage-Supply | 3V ~ 3.6V, 4.5V ~ 5.5V |
| TestFrequency | 2.7GHz |
概述
Description
TRF372017IRGZR is a Texas Instruments RF transceiver IC (part of the TRF372017 family). It is a highly integrated, low‑power wireless transceiver designed for ISM-band applications. The device combines RF front‑end, a frequency synthesizer, and baseband/modem functionality with a host MCU interface (SPI) in a compact RoHS‑compliant package (IRGZR). Typical features include programmable TX power and RX sensitivity, flexible modulation options, and a crystal-based frequency reference. It generally requires an external crystal/resonator and standard passive components. Common applications are remote controls, wireless sensors, home automation, IoT, and asset tracking. For exact specifications—supported bands, data rates, interfaces, and development tools—consult the TI datasheet and design resources.
Features
Here are the key features commonly associated with the TRF372017IRGZR:
- 2.4 GHz ISM-band RF transceiver with integrated PLL/VCO and RF front-end
- Fully integrated RF chain: LNA, mixer, IF, and baseband/demodulator
- Programmable frequency synthesizer (fractional-N PLL) for flexible tuning in 2.4 GHz range
- Modulation support: GFSK/FSK and OOK/ASK (as supported by the device)
- Digital control via a simple SPI (or similar) interface with register map
- On-chip RSSI, optional temperature sensor, and basic packet handling
- Low-power operation with multiple power modes and wake-up options
- Small 28-pin QFN package (IRGZR) suitable for compact designs
- Compatible with TI design resources and reference designs for rapid prototyping
Note: For exact electrical specs (voltage, current, data rates, tuning range, supported modulation modes), refer to the official datasheet.
- 2.4 GHz ISM-band RF transceiver with integrated PLL/VCO and RF front-end
- Fully integrated RF chain: LNA, mixer, IF, and baseband/demodulator
- Programmable frequency synthesizer (fractional-N PLL) for flexible tuning in 2.4 GHz range
- Modulation support: GFSK/FSK and OOK/ASK (as supported by the device)
- Digital control via a simple SPI (or similar) interface with register map
- On-chip RSSI, optional temperature sensor, and basic packet handling
- Low-power operation with multiple power modes and wake-up options
- Small 28-pin QFN package (IRGZR) suitable for compact designs
- Compatible with TI design resources and reference designs for rapid prototyping
Note: For exact electrical specs (voltage, current, data rates, tuning range, supported modulation modes), refer to the official datasheet.
Package
QFN (Quad Flat No-Lead) package, typically 32 pins in a 5x5 mm footprint (RoHS/lead-free).
Pinout
Pin count: 40 pins (QFN-40).
Function: TI TRF372017IRGZR is a highly integrated RF transceiver IC with an onboard PLL/synthesizer, including RF front-end (LNA, mixers), transmitter/receiver paths, VCO, and digital interface for wireless applications.
Function: TI TRF372017IRGZR is a highly integrated RF transceiver IC with an onboard PLL/synthesizer, including RF front-end (LNA, mixers), transmitter/receiver paths, VCO, and digital interface for wireless applications.
Manufacturer
Texas Instruments (TI). TI is an American multinational semiconductor company that designs and manufactures analog, mixed-signal, and digital integrated circuits, including RF transceivers and other TI RF products.
Application
TRF372017IRGZR is TI’s RF front-end/transceiver IC for wireless ISM-band applications. Typical use areas include Bluetooth Low Energy and Zigbee/Thread networks, 2.4 GHz RF links, sub-1 GHz ISM links, wireless sensors and IoT devices, smart‑home and wearables, remote controls, and industrial automation/asset tracking.
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