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TPSM365R6FRDNR
3-V TO 65-V INPUT, 1-V TO 13-V O
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規格
| Series | HotRod™ |
| Part Status | Active |
| Type | Non-Isolated PoL Module |
| Number of Outputs | 1 |
| Voltage - Input (Min) | 3.6V |
| Voltage - Input (Max) | 65V |
| Voltage - Output 1 | 1 ~ 13V |
| Current - Output (Max) | 600mA |
| Applications | ITE (Commercial) |
| Features | Adjustable Output, Remote On/Off |
| Operating Temperature | -40°C ~ 125°C |
| Efficiency | 82.7% |
| Mounting Type | Surface Mount, Wettable Flank |
| Package | 11-PowerFQFN Module |
| Size / Dimension | 0.14" L x 0.18" W x 0.08" H (3.5mm x 4.5mm x 2.1mm) |
| Supplier Device Package | 11-QFN-FCMOD (4.5x3.5) |
| Control Features | Enable, Active High |
| Packaging | Cut Tape (CT), Tape & Reel (TR) |
概述
Description
TPSM365R6FRDNR is a Texas Instruments TPSM power-module buck regulator. It combines essential DC-DC conversion hardware—typically high- and low-side MOSFETs, a switching controller, feedback and protection logic—into a compact DNR–package module. The device is designed for easy, space-efficient point‑of‑load power delivery, delivering a regulated output from an input supply with high efficiency and minimal external components. It includes protections such as undervoltage, overcurrent/short-circuit protection, and thermal shutdown for robust operation.
Use cases include compact power supplies for digital, microcontroller, FPGA, and other mixed-signal systems where BOM and PCB area must be minimized. For exact electrical specifications, pinout, thermal characteristics, and layout guidelines, refer to the TI TPSM365R6FRDNR datasheet and product page.
Use cases include compact power supplies for digital, microcontroller, FPGA, and other mixed-signal systems where BOM and PCB area must be minimized. For exact electrical specifications, pinout, thermal characteristics, and layout guidelines, refer to the TI TPSM365R6FRDNR datasheet and product page.
Package
The TPSM365R6FRDNR comes in a 6‑pin VSON (SON-6) package.
Pinout
TPSM365R6FRDNR is a 6‑pin N‑channel power MOSFET (plus a large exposed thermal/drain pad). Typical pin functions (device-specific pin numbering vary — consult the datasheet) are:
- 1 × Gate (G)
- 2 × Source pins (S) (often paralleled)
- 3 × Drain pins (D) (often paralleled)
- Exposed metal pad = Drain/thermal pad
Function: Gate voltage controls conduction between Drain and Source (low RDS(on) N‑channel power MOSFET). Please refer to the official datasheet for the exact package pin numbering and electrical/thermal specifications.
- 1 × Gate (G)
- 2 × Source pins (S) (often paralleled)
- 3 × Drain pins (D) (often paralleled)
- Exposed metal pad = Drain/thermal pad
Function: Gate voltage controls conduction between Drain and Source (low RDS(on) N‑channel power MOSFET). Please refer to the official datasheet for the exact package pin numbering and electrical/thermal specifications.
Manufacturer
- Manufacturer: Texas Instruments (TI).
- What kind of company: A U.S.-based multinational semiconductor company that designs and manufactures analog and embedded processing integrated circuits.
- What kind of company: A U.S.-based multinational semiconductor company that designs and manufactures analog and embedded processing integrated circuits.
Application
TPSM365R6FRDNR is a power module for point-of-load DC-DC regulation. Typical applications include POL rails for CPUs/GPUs/FPGA, data-center servers, networking and telecom equipment, storage systems, and industrial or automotive electronics, where compact size, high efficiency, and fast transient response are needed. It integrates high/low-side MOSFETs and controllers to simplify layout and improve reliability in multi-rail power architectures.
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