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THGBMTG5D1LBAIL

Name: THGBMTG5D1LBAIL
Rating: 4.7 (12 reviews)

IC FLASH 32GBIT EMMC 153WFBGA

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製造商。部分 #THGBMTG5D1LBAIL
包 FBGA-153
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Package	Tray
ProductStatus	Active

概述

Description

THGBMTG5D1LBAIL is a specific model of NAND flash memory produced by Toshiba, commonly used in various electronic devices for data storage. It features a compact design, optimized for high-speed data transfer and reliability, making it suitable for applications in smartphones, tablets, and other consumer electronics. The designation typically includes information about the product's capacity, interface, and other technical specifications.
This NAND flash memory utilizes advanced technology to achieve improved performance and endurance, addressing the increasing demand for efficient storage solutions. It operates on a non-volatile basis, meaning it retains data even when powered off, which is crucial for preserving user data and application performance.
Overall, THGBMTG5D1LBAIL represents a significant component in modern digital storage, playing a vital role in enhancing the user experience in various devices.

Features

The THGBMTG5D1LBAIL is a NAND flash memory chip produced by Toshiba. It typically features:
1. Type: Multi-Level Cell (MLC) NAND flash technology.
2. Capacity: Generally available in capacities around 64GB.
3. Interface: Supports a serial interface, commonly using SPI (Serial Peripheral Interface) for easy integration.
4. Performance: Offers fast read and write speeds suitable for various applications, including consumer electronics and industrial devices.
5. Endurance: Designed for high endurance, supporting numerous program/erase cycles, making it suitable for applications requiring durability.
6. Form Factor: Compact design, making it suitable for space-constrained environments.
7. Power Efficiency: Low power consumption, enhancing battery life in portable devices.
This chip is often used in smartphones, tablets, and embedded systems, providing reliable storage solutions for data-intensive applications.

Package

The THGBMTG5D1LBAIL is a NAND flash memory chip packaged in a 48-ball Fine-Pitch Ball Grid Array (FBGA) format. This compact packaging is designed for efficient space utilization and thermal management in electronic devices.

Pinout

The THGBMTG5D1LBAIL is a NAND flash memory device manufactured by Toshiba. It typically features a pin count of 48 pins. The primary function of this chip is to provide non-volatile storage for data in various applications, such as smartphones, tablets, and other consumer electronics. It uses a multi-level cell (MLC) architecture, allowing for the storage of multiple bits per cell, which enhances data density and storage capacity while maintaining performance. The device supports standard interfaces for data communication, enabling easy integration into various systems.

Manufacturer

The THGBMTG5D1LBAIL is a NAND flash memory chip manufactured by Toshiba, which is now part of Kioxia Holdings Corporation. Kioxia, established as a spin-off from Toshiba Memory Corporation, specializes in the development and production of flash memory and solid-state drives (SSDs). The company is known for its innovative memory solutions and serves various sectors, including consumer electronics, data centers, and mobile devices. Kioxia plays a significant role in the global semiconductor market, focusing on high-density memory solutions to support the growing demand for data storage and processing.

Application

THGBMTG5D1LBAIL is a NAND flash memory chip commonly used in consumer electronics such as smartphones, tablets, and laptops. Its application areas include data storage for operating systems, application software, multimedia files, and other digital content. Additionally, it is utilized in embedded systems, automotive electronics, and industrial devices for reliable, high-speed data retention and retrieval.

Equivalent

The THGBMTG5D1LBAIL chip, a NAND flash memory device, has equivalent products including the Toshiba THGBM5D1LBAIL, Micron MT29F1G01ABAEAWP, and Samsung K9GAG08U0M. Always verify compatibility based on specifications like density, package type, and interface before substitution.