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THGBMFG8C2LBAIL

Name: THGBMFG8C2LBAIL
Rating: 4.7 (12 reviews)

IC FLASH 256GBIT MMC 153FBGA

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規格

Part Status	Obsolete
Base Product Number	THGBMF
DigiKey Programmable	Not Verified
Memory Format	FLASH
Memory Size	256Gbit
Mounting Type	Surface Mount
Supplier Device Package	153-FBGA (11.5x13)
Packaging	Tray

概述

Description

THGBMFG8C2LBAIL is a NAND flash memory device from Toshiba (now Kioxia), part of the BiCS 3D NAND family. It is a raw NAND die used inside storage devices (SSDs, eMMC, memory cards) and requires a memory controller to operate. The full part number encodes the family, density/layering, package, and revision.
What you get from the part:
- Non-volatile storage capabilities for data retention
- Interface and performance details (page size, block size, endurance, read/write voltages) specified in the official datasheet
- Typical applications in consumer and embedded storage environments
Because the exact specs (capacity, page size, endurance, voltage, package type) depend on the specific revision, you should consult the official Kioxia/Toshiba THGBMFG8C2LBAIL datasheet or product catalog for precise figures. If you share your use case (device type, controller, required capacity), I can help interpret the relevant specifications.

Features

THGBMFG8C2LBAIL is a Toshiba/Kioxia (BiCS) 3D NAND flash memory die. Exact specifications vary by bin/revision, so consult the datasheet for precise figures. Typical features of this NAND family include:
- 3D BiCS stacked NAND architecture
- Multi-plane operation for higher parallelism
- Page size commonly 2 KB or 4 KB with spare area
- TLC (3 bits per cell) or higher-density cell technology
- Endurance in the tens of thousands of P/E cycles; data retention across years
- Built-in or controller-assisted ECC, wear leveling, bad-block management, and garbage collection
- NAND flash interface requiring a compatible controller (ONFI/Toggle-like protocol variants)
- Used in SSDs, embedded storage, and other NAND-based storage devices
For exact capacity, cell type, layer count, speed, and endurance figures, please share or provide the datasheet link.

Package

THGBMFG8C2LBAIL uses a Ball Grid Array (BGA) package.

Pinout

- Pin count: 8 pins
- Function: Toshiba (Kioxia) SPI NAND flash memory device (non-volatile data storage, ~8 Gbit; uses SPI interface with CS, CLK, DI, DO, WP, HOLD, VCC, GND)

Manufacturer

Manufacturer: Kioxia (formerly Toshiba Memory Corporation).
Kioxia is a Japanese multinational electronics company that designs and manufactures flash memory and storage products, including NAND flash memory and SSDs; one of the world’s largest NAND flash suppliers.