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THGBMFG7C2LBAIL
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規格
| Manufacturer | JLCPCB Assembly |
| Package | BGA |
概述
Description
The THGBMFG7C2LBAIL is a model number for a specific type of NAND flash memory product manufactured by Kioxia, previously known as Toshiba Memory. This component typically serves as a key storage solution in various electronic devices, offering reliable and high-capacity data storage. The product is often used in smartphones, tablets, and other consumer electronics, providing essential non-volatile memory necessary for device functionality.
As part of Kioxia's BiCS FLASH™ lineup, the THGBMFG7C2LBAIL incorporates advanced 3D flash memory technology, which stacks memory cells vertically to increase storage density without increasing the physical footprint. This results in higher performance, improved power efficiency, and enhanced reliability compared to traditional 2D NAND flash memory solutions.
The product's specifications, such as storage capacity, performance characteristics, and power requirements, are designed to meet the demands of modern electronic devices, contributing to faster data processing and energy-efficient operation.
As part of Kioxia's BiCS FLASH™ lineup, the THGBMFG7C2LBAIL incorporates advanced 3D flash memory technology, which stacks memory cells vertically to increase storage density without increasing the physical footprint. This results in higher performance, improved power efficiency, and enhanced reliability compared to traditional 2D NAND flash memory solutions.
The product's specifications, such as storage capacity, performance characteristics, and power requirements, are designed to meet the demands of modern electronic devices, contributing to faster data processing and energy-efficient operation.
Features
The THGBMFG7C2LBAIL is a NAND flash memory chip, likely part of Toshiba's lineup, utilized in various electronic devices for data storage. Here are its key features:
1. Type: It is a NAND flash memory, known for non-volatile storage, meaning it retains data without power.
2. Capacity: The specific capacity isn't detailed in the part number, but chips in this series typically range from several gigabytes to terabytes.
3. Technology: Likely based on Toshiba's advanced 3D NAND technology, offering high density and reliability.
4. Applications: Commonly used in smartphones, tablets, SSDs, and other consumer electronics due to its compact size and efficient storage capabilities.
5. Interface: Uses a standard interface that facilitates easy integration into devices and systems.
6. Performance: Designed to offer fast read/write speeds, crucial for quick data access and storage efficiency in consumer devices.
7. Durability: Built to withstand numerous write/erase cycles, enhancing the lifespan of the memory in intensive applications.
For detailed specifications, consulting the manufacturer's datasheet or product documentation is recommended.
1. Type: It is a NAND flash memory, known for non-volatile storage, meaning it retains data without power.
2. Capacity: The specific capacity isn't detailed in the part number, but chips in this series typically range from several gigabytes to terabytes.
3. Technology: Likely based on Toshiba's advanced 3D NAND technology, offering high density and reliability.
4. Applications: Commonly used in smartphones, tablets, SSDs, and other consumer electronics due to its compact size and efficient storage capabilities.
5. Interface: Uses a standard interface that facilitates easy integration into devices and systems.
6. Performance: Designed to offer fast read/write speeds, crucial for quick data access and storage efficiency in consumer devices.
7. Durability: Built to withstand numerous write/erase cycles, enhancing the lifespan of the memory in intensive applications.
For detailed specifications, consulting the manufacturer's datasheet or product documentation is recommended.
Package
The THGBMFG7C2LBAIL is a package type for Toshiba's e-MMC NAND flash memory. It typically indicates a specific configuration and capacity of the memory module, often used in mobile devices and embedded systems for storage solutions. The package type provides information about the physical and electrical characteristics of the module.
Pinout
The THGBMFG7C2LBAIL is a NAND flash memory chip produced by Toshiba (now Kioxia). It is a type of eMMC (embedded MultiMediaCard) storage module, commonly used in smartphones, tablets, and other portable electronic devices.
The THGBMFG7C2LBAIL typically comes in a BGA (Ball Grid Array) package, which might have a pin count of 153. However, exact pin count and functions might vary depending on the specific configuration and version.
In general, eMMC devices like the THGBMFG7C2LBAIL include pins for power supply, ground, data transfer, command, clock, and reset functions. Key signals often include:
- VCC and VCCQ: Power supply for the core and I/O respectively.
- GND: Ground.
- CMD: Command line for sending instructions.
- CLK: Clock signal for data synchronization.
- DAT0-DAT7: Data bus lines for input/output operations.
- RST_n: Reset signal.
For precise pin count and functions, refer to the specific datasheet or technical documentation for the THGBMFG7C2LBAIL.
The THGBMFG7C2LBAIL typically comes in a BGA (Ball Grid Array) package, which might have a pin count of 153. However, exact pin count and functions might vary depending on the specific configuration and version.
In general, eMMC devices like the THGBMFG7C2LBAIL include pins for power supply, ground, data transfer, command, clock, and reset functions. Key signals often include:
- VCC and VCCQ: Power supply for the core and I/O respectively.
- GND: Ground.
- CMD: Command line for sending instructions.
- CLK: Clock signal for data synchronization.
- DAT0-DAT7: Data bus lines for input/output operations.
- RST_n: Reset signal.
For precise pin count and functions, refer to the specific datasheet or technical documentation for the THGBMFG7C2LBAIL.
Manufacturer
The THGBMFG7C2LBAIL is a product manufactured by Kioxia Corporation. Kioxia is a Japanese company that specializes in the development, production, and sale of flash memory and solid-state storage solutions. Established in 2019, Kioxia was formerly known as Toshiba Memory Corporation before it was spun off from Toshiba Corporation. The company is recognized as one of the leading flash memory manufacturers globally, providing a wide range of storage products for personal, enterprise, and data center applications.
Application
The THGBMFG7C2LBAIL is a type of NAND flash memory, commonly used in various electronic devices. Its primary application areas include smartphones, tablets, digital cameras, and other portable consumer electronics that require reliable data storage solutions. It can also be used in solid-state drives (SSDs) for laptops and PCs, as well as in embedded systems for IoT devices and industrial automation equipment. The high capacity and robust performance make it suitable for applications demanding efficient data processing and storage capabilities.
Equivalent
The THGBMFG7C2LBAIL chip is a NAND Flash Memory module from Kioxia (formerly Toshiba). Equivalent products would typically come from other major NAND memory manufacturers such as:
1. Samsung's V-NAND series
2. Micron's 3D NAND lineup
3. Western Digital/SanDisk's BiCS series
4. SK Hynix's 3D NAND offerings
Each offers similar storage capacities and performance metrics, suitable for applications like SSDs, smartphones, and other data storage devices. Ensure compatibility by checking the specific technical specifications.
1. Samsung's V-NAND series
2. Micron's 3D NAND lineup
3. Western Digital/SanDisk's BiCS series
4. SK Hynix's 3D NAND offerings
Each offers similar storage capacities and performance metrics, suitable for applications like SSDs, smartphones, and other data storage devices. Ensure compatibility by checking the specific technical specifications.
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