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THGAF8G8T23BAIL
IC FLASH 32GBIT UFS 153WFBGA
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規格
| Series | Consumer UFS |
| Part Status | Last Time Buy |
| DigiKey Programmable | Not Verified |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NAND |
| Memory Size | 32Gbit |
| Memory Organization | 4G x 8 |
| Memory Interface | UFS |
| Voltage - Supply | 2.7V ~ 3.6V |
| Operating Temperature | -25°C ~ 85°C (TC) |
| Mounting Type | Surface Mount |
| Package / Case | 153-WFBGA |
| Supplier Device Package | 153-WFBGA (11.5x13) |
| Base Product Number | THGAF8 |
概述
Description
"THGAF8G8T23BAIL" appears to be a placeholder or a code that doesn't correspond to any widely recognized topic, concept, or product as of my last update in October 2023. If this is a new concept, product, or identifier introduced after that date, it may not be in my current database. To provide a concise introduction, please clarify the context or field it relates to, such as technology, finance, science, etc. Alternatively, if it's a fictional or hypothetical term, additional context would be beneficial to provide a relevant summary.
Package
The THGAF8G8T23BAIL is a part number for a NAND flash memory chip from Toshiba (now Kioxia). It typically refers to a BGA (Ball Grid Array) package type, which is a common packaging for such memory chips, allowing for efficient surface mounting on printed circuit boards.
Pinout
The THGAF8G8T23BAIL is a NAND flash memory chip produced by Toshiba (now Kioxia). This specific part number refers to an e-MMC (embedded MultiMediaCard) device, which integrates NAND flash memory with a controller.
1. Pin Count: Typically, e-MMC chips like the THGAF8G8T23BAIL have a BGA (Ball Grid Array) package with a pin count ranging from 100 to 153 balls, depending on the specific version and configuration. However, the exact pin count for this specific model is not commonly disclosed in brief product descriptions, so consulting the official datasheet or reference manual from Toshiba/Kioxia is necessary for precision.
2. Function: The function of the THGAF8G8T23BAIL is to provide non-volatile storage for electronic devices. It manages data read and write processes and includes features like wear leveling, error correction, and bad block management. It is used in a variety of applications, including smartphones, tablets, and other consumer electronics that require reliable, high-density storage solutions.
For precise and detailed technical specifications, referring to the manufacturer's datasheet is recommended.
1. Pin Count: Typically, e-MMC chips like the THGAF8G8T23BAIL have a BGA (Ball Grid Array) package with a pin count ranging from 100 to 153 balls, depending on the specific version and configuration. However, the exact pin count for this specific model is not commonly disclosed in brief product descriptions, so consulting the official datasheet or reference manual from Toshiba/Kioxia is necessary for precision.
2. Function: The function of the THGAF8G8T23BAIL is to provide non-volatile storage for electronic devices. It manages data read and write processes and includes features like wear leveling, error correction, and bad block management. It is used in a variety of applications, including smartphones, tablets, and other consumer electronics that require reliable, high-density storage solutions.
For precise and detailed technical specifications, referring to the manufacturer's datasheet is recommended.
Manufacturer
The THGAF8G8T23BAIL is a NAND flash memory product manufactured by Kioxia Corporation. Kioxia is a Japanese company specializing in the production of flash memory and solid-state drives (SSDs). It was formerly known as Toshiba Memory Corporation before rebranding in 2019. Kioxia focuses on the development, production, and sale of memory products and semiconductor solutions, making it a significant player in the data storage industry.
Equivalent
The THGAF8G8T23BAIL is a specific NAND flash memory chip by Kioxia (formerly Toshiba). Equivalent products would generally be similar NAND flash memory chips from other major manufacturers like Samsung, Micron, or SK Hynix. These may include models such as Samsung's 3D V-NAND, Micron's 3D NAND, or SK Hynix's 3D NAND chips of similar capacity and performance specifications. Always check technical datasheets for exact compatibility.
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