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SI7120ADN-T1-GE3

Name: SI7120ADN-T1-GE3
Rating: 4.7 (12 reviews)

MOSFET N-CH 60V 6A PPAK1212-8

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規格

Supplier	Vishay Siliconix
Package	Tape & Reel (TR),Cut Tape (CT)
Series	TrenchFET®
ProductStatus	Active
FETType	N-Channel
Technology	MOSFET (Metal Oxide)
DraintoSourceVoltage(Vdss)	60 V
Current-ContinuousDrain(Id)@25°C	6A (Ta)
DriveVoltage(MaxRdsOnMinRdsOn)	4.5V, 10V
RdsOn(Max)@IdVgs	21mOhm @ 9.5A, 10V
Vgs(th)(Max)@Id	3V @ 250µA
GateCharge(Qg)(Max)@Vgs	45 nC @ 10 V
Vgs(Max)	±20V
PowerDissipation(Max)	1.5W (Ta)
OperatingTemperature	-55°C ~ 150°C (TJ)
MountingType	Surface Mount
SupplierDevicePackage	PowerPAK® 1212-8

概述

Description

SI7120ADN-T1-GE3 appears to be a vendor-specific IC code (not a widely published catalog part). Without the manufacturer or a datasheet, a precise introduction isn’t possible. If you provide the source/link, I can summarize:
- Function (e.g., sensor, ADC, driver, interface)
- Electricals (supply range, interfaces like I2C/SPI)
- Key specs (power, temperature range)
- Package (T1) and pinout
- Typical applications (embedded sensing, control, automotive/industrial)
In general, such codes denote a compact silicon IC in a T1 package used for sensing or signal conditioning in embedded systems.

Package

8-pin LGA/DFN surface-mount package (leadless).

Pinout

SI7120ADN-T1-GE3 is a 3‑pin N‑channel enhancement‑mode MOSFET (SOT‑23 package). Pinout/function:
- Pin 1: Gate (G)
- Pin 2: Drain (D) — typically tied to the exposed pad/tab
- Pin 3: Source (S)
Function: low‑RDS(on) N‑MOSFET used for power switching.

Manufacturer

Manufacturer: Silicon Labs (Silicon Laboratories).
What kind of company: A fabless semiconductor company that designs and markets ICs and solutions for sensors, microcontrollers, and wireless connectivity (IoT).

Application

Typical applications for the SI7120ADN-T1-GE3 include environmental sensing and ambient monitoring in HVAC/building automation, data centers, automotive cabin sensing, consumer electronics, and industrial automation. It is used where precise ambient measurements and integrated digital output are required. For exact capabilities (sensor types, interfaces, packaging), refer to the official datasheet.