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S9S08SG4E2MTJ
IC MCU 8BIT 4KB FLASH 20TSSOP
- 製造商
- 製造商。 部分 #S9S08SG4E2MTJ
- 包 20-TSSOP (0.173, 4.40mm Width)
- 資料表 S9S08SG4E2MTJ DataSheet
- 有現貨的2166
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規格
| Supplier | NXP USA Inc. |
| Package | Tube |
| Series | S08 |
| ProductStatus | Active |
| CoreProcessor | S08 |
| CoreSize | 8-Bit |
| Speed | 40MHz |
| Connectivity | I²C, LINbus, SCI, SPI |
| Peripherals | LVD, POR, PWM, WDT |
| NumberofI/O | 16 |
| ProgramMemorySize | 4KB (4K x 8) |
| ProgramMemoryType | FLASH |
| RAMSize | 256 x 8 |
| Voltage-Supply(Vcc/Vdd) | 2.7V ~ 5.5V |
| DataConverters | A/D 12x10b |
| OscillatorType | Internal |
| OperatingTemperature | -40°C ~ 125°C (TA) |
| MountingType | Surface Mount |
| Package/Case | 20-TSSOP (0.173, 4.40mm Width) |
概述
Description
Introduction to S9S08SG4E2MTJ
- It is an NXP Freescale 8-bit microcontroller in the S9S08SG4 family.
- Core: S08 (8-bit, Harvard architecture) designed for low-power embedded control.
- Memory and peripherals: integrated Flash and RAM (sizes vary by variant) plus common MCU peripherals such as ADC, comparators, PWM/timers, UART/SPI/I2C, and watchdog; supports low-voltage detection and basic debug.
- Packaging/temperature: the MTJ suffix encodes the package type and temperature grade (E2 indicates a specific package/extended temperature variant); check the datasheet for exact details.
- Typical uses: automotive control modules, sensors, and small control applications in industrial/consumer devices that require a compact, low-power MCU.
- For precise specs (flash, RAM, pins, clock options, peripheral list), consult the S9S08SG4E2MTJ datasheet.
- It is an NXP Freescale 8-bit microcontroller in the S9S08SG4 family.
- Core: S08 (8-bit, Harvard architecture) designed for low-power embedded control.
- Memory and peripherals: integrated Flash and RAM (sizes vary by variant) plus common MCU peripherals such as ADC, comparators, PWM/timers, UART/SPI/I2C, and watchdog; supports low-voltage detection and basic debug.
- Packaging/temperature: the MTJ suffix encodes the package type and temperature grade (E2 indicates a specific package/extended temperature variant); check the datasheet for exact details.
- Typical uses: automotive control modules, sensors, and small control applications in industrial/consumer devices that require a compact, low-power MCU.
- For precise specs (flash, RAM, pins, clock options, peripheral list), consult the S9S08SG4E2MTJ datasheet.
Features
S9S08SG4E2MTJ features (concise):
- 8-bit HCS08 CPU core with 16-bit address space
- On-chip Flash program memory; RAM for data (sizes vary by exact device variant)
- Optional on-chip EEPROM data memory (variant dependent)
- Analog peripherals: ADC (often 8–12-bit) with multiple channels; analog comparator
- Timers and PWM: multiple 8/16-bit timers; PWM channels
- Serial communications: SCI/UART, SPI; I2C (and sometimes LIN, depending on variant)
- Real-time features: watchdog timer, timer interrupt sources, reset options, BOR/POR
- Clocking: internal oscillator with optional external clock/crystal support
- Low-power modes for energy efficiency
- Debug/Programming: Background Debug Module (BDM) interface for in-system debugging
- Package/availability: MTJ code indicates compact packaging suitable for embedded/automotive applications
Note: exact memory sizes and peripheral options vary by specific device revision; consult the datasheet for precise specs.
- 8-bit HCS08 CPU core with 16-bit address space
- On-chip Flash program memory; RAM for data (sizes vary by exact device variant)
- Optional on-chip EEPROM data memory (variant dependent)
- Analog peripherals: ADC (often 8–12-bit) with multiple channels; analog comparator
- Timers and PWM: multiple 8/16-bit timers; PWM channels
- Serial communications: SCI/UART, SPI; I2C (and sometimes LIN, depending on variant)
- Real-time features: watchdog timer, timer interrupt sources, reset options, BOR/POR
- Clocking: internal oscillator with optional external clock/crystal support
- Low-power modes for energy efficiency
- Debug/Programming: Background Debug Module (BDM) interface for in-system debugging
- Package/availability: MTJ code indicates compact packaging suitable for embedded/automotive applications
Note: exact memory sizes and peripheral options vary by specific device revision; consult the datasheet for precise specs.
Package
The S9S08SG4E2MTJ comes in a 20-pin SOIC (Small Outline Integrated Circuit) package.
Pinout
- Pin count: 40 pins (LQFP 40, MTJ package)
- Function: NXP S9S08SG4E2MTJ is an 8-bit HCS08 microcontroller with on-chip flash and RAM and integrated peripherals (serial interfaces such as SCI/SPI/I2C, ADC, timers, GPIO) for embedded control applications.
- Function: NXP S9S08SG4E2MTJ is an 8-bit HCS08 microcontroller with on-chip flash and RAM and integrated peripherals (serial interfaces such as SCI/SPI/I2C, ADC, timers, GPIO) for embedded control applications.
Manufacturer
- Manufacturer: NXP Semiconductors.
- What kind of company: A Dutch multinational semiconductor company that designs and manufactures embedded processors, microcontrollers, and other integrated circuits for automotive, industrial, and consumer applications.
- What kind of company: A Dutch multinational semiconductor company that designs and manufactures embedded processors, microcontrollers, and other integrated circuits for automotive, industrial, and consumer applications.
Application
Typical applications for the S9S08SG4E2MTJ include:
- Automotive body electronics (lighting, door/comfort modules)
- Industrial and building automation (sensors, small controllers)
- Consumer electronics and home appliances (control panels, thermostats, remotes)
- Power management and battery-powered devices (low-power operation)
- Motor control interfaces (PWM/digital driver signaling)
- General sensor interfacing and data acquisition (ADC, UART/SPI/I2C)
- Automotive body electronics (lighting, door/comfort modules)
- Industrial and building automation (sensors, small controllers)
- Consumer electronics and home appliances (control panels, thermostats, remotes)
- Power management and battery-powered devices (low-power operation)
- Motor control interfaces (PWM/digital driver signaling)
- General sensor interfacing and data acquisition (ADC, UART/SPI/I2C)
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