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S34ML04G200BHI003
IC FLASH 4GBIT PARALLEL 63BGA
- 製造商
- 製造商。 部分 #S34ML04G200BHI003
- 包 63-VFBGA
- 資料表
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規格
| Supplier | Flip Electronics |
| Package | Tape & Reel (TR) |
| Series | ML-2 |
| ProductStatus | Obsolete |
| MemoryType | Non-Volatile |
| MemoryFormat | FLASH |
| Technology | FLASH - NAND |
| MemorySize | 4Gb (512M x 8) |
| MemoryInterface | Parallel |
| WriteCycleTime-WordPage | 25ns |
| Voltage-Supply | 2.7V ~ 3.6V |
| OperatingTemperature | -40°C ~ 85°C (TA) |
| MountingType | Surface Mount |
| Package/Case | 63-VFBGA |
概述
Description
S34ML04G200BHI003 is a 4-Gbit parallel NAND flash memory in the Spansion (now Cypress) S34ML family. It provides non-volatile storage for embedded systems via an 8-bit data bus and a standard NAND command/address interface.
Key points
- Density: 4 Gbit (roughly 512 MB); parallel x8 data bus
- Interface: parallel NAND with CE, CLE, ALE, WE#, RE#, R/B# signals
- Layout: typical page/block organization per ONFi-style NAND (exact page size and block size vary by device variant; check the datasheet)
- Operations: supports page program, block erase, random read; multi-plane operation available for higher throughput
- Electrical: nominal 3.3V operation (2.7–3.6V common range); industrial-grade variants exist
- Usage: requires a host controller with ECC and wear-leveling/bad-block management handled in software/firmware
Note: exact page/block sizes, timing, and voltage ranges are specified in the official datasheet. If you want, I can summarize the key timing parameters from the datasheet.
Key points
- Density: 4 Gbit (roughly 512 MB); parallel x8 data bus
- Interface: parallel NAND with CE, CLE, ALE, WE#, RE#, R/B# signals
- Layout: typical page/block organization per ONFi-style NAND (exact page size and block size vary by device variant; check the datasheet)
- Operations: supports page program, block erase, random read; multi-plane operation available for higher throughput
- Electrical: nominal 3.3V operation (2.7–3.6V common range); industrial-grade variants exist
- Usage: requires a host controller with ECC and wear-leveling/bad-block management handled in software/firmware
Note: exact page/block sizes, timing, and voltage ranges are specified in the official datasheet. If you want, I can summarize the key timing parameters from the datasheet.
Features
Here are the key features of S34ML04G200BHI003 (Spansion/Cypress 4 Gbit MLC NAND):
- 4 Gbit (512 MB) multi-level cell (MLC) NAND flash memory
- ONFI-compliant parallel interface with a data bus (x8)
- Page size: 2 KB data + 64 B OOB; Block size: 128 pages
- Built-in bad block management; wear leveling support via controller
- Typical endurance: ~3k–5k program/erase cycles; data retention ~10 years
- Operating voltage: standard NAND I/O around 3.3V (and related supply ranges per device variant)
- Temperature range: industrial grade options (commonly -40°C to 85°C)
- Various packaging options (e.g., TSOP, BGA) depending on version
- ECC/reliability: ECC is typically handled by the host/controller (On-die ECC may be present on some variants)
Note: Exact voltage ranges, temperature grades, and packaging depend on the specific device revision. Please refer to the official datasheet for precise specifications.
- 4 Gbit (512 MB) multi-level cell (MLC) NAND flash memory
- ONFI-compliant parallel interface with a data bus (x8)
- Page size: 2 KB data + 64 B OOB; Block size: 128 pages
- Built-in bad block management; wear leveling support via controller
- Typical endurance: ~3k–5k program/erase cycles; data retention ~10 years
- Operating voltage: standard NAND I/O around 3.3V (and related supply ranges per device variant)
- Temperature range: industrial grade options (commonly -40°C to 85°C)
- Various packaging options (e.g., TSOP, BGA) depending on version
- ECC/reliability: ECC is typically handled by the host/controller (On-die ECC may be present on some variants)
Note: Exact voltage ranges, temperature grades, and packaging depend on the specific device revision. Please refer to the official datasheet for precise specifications.
Package
8-pin SOIC (SOP-8) package.
Pinout
Pin count: 8 pins.
Function: S34ML04G200BHI003 is a 4 Gbit SPI/NAND flash memory (serial NAND) with multi-I/O data lines (IO0–IO3). Pinout includes CS#, CLK, WP#, HOLD#, VCC, and GND in addition to the IO lines. Used as non-volatile storage.
Function: S34ML04G200BHI003 is a 4 Gbit SPI/NAND flash memory (serial NAND) with multi-I/O data lines (IO0–IO3). Pinout includes CS#, CLK, WP#, HOLD#, VCC, and GND in addition to the IO lines. Used as non-volatile storage.
Manufacturer
- Manufacturer: Spansion (Spansion LLC), now Cypress Semiconductor, a subsidiary of Infineon Technologies.
- What kind of company: A semiconductor company that designs and manufactures flash memory (NOR/NAND) and embedded memory solutions for electronics.
- What kind of company: A semiconductor company that designs and manufactures flash memory (NOR/NAND) and embedded memory solutions for electronics.
Application
S34ML04G200BHI003 is a 4Gbit serial NAND flash. Typical applications include:
- Embedded systems: boot firmware and code storage for MCUs/SoCs
- Automotive: ECUs, infotainment, dash displays, telematics
- Industrial/networking: controllers, data logging, firmware storage
- Consumer electronics: cameras, set-top boxes, wearables, tablets
- IoT/edge devices: sensors, gateways, smart home devices
- Portable storage: embedded memory in USB/storage devices
- Embedded systems: boot firmware and code storage for MCUs/SoCs
- Automotive: ECUs, infotainment, dash displays, telematics
- Industrial/networking: controllers, data logging, firmware storage
- Consumer electronics: cameras, set-top boxes, wearables, tablets
- IoT/edge devices: sensors, gateways, smart home devices
- Portable storage: embedded memory in USB/storage devices
Equivalent
I can fetch exact cross-references, but I need specs. Do you want me to search now? Please confirm and provide: package type (e.g., SOIC8), operating voltage (1.8/3.3V), and memory size (likely 4Gbit) so I can return a concise equivalence list from Cypress/Spansion, Macronix, Winbond, Micron, etc.
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