S29GL064S70BHI030

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S29GL064S70BHI030

IC FLASH 64MBIT PARALLEL 48FBGA

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規格

Supplier Cypress Semiconductor Corp
Package Tray
Series GL-S
ProductStatus Active
MemoryType Non-Volatile
MemoryFormat FLASH
Technology FLASH - NOR
MemorySize 64Mb (8M x 8, 4M x 16)
MemoryInterface Parallel
WriteCycleTime-WordPage 60ns
AccessTime 70 ns
Voltage-Supply 2.7V ~ 3.6V
OperatingTemperature -40°C ~ 85°C (TA)
MountingType Surface Mount
Package/Case 48-VFBGA

概述

Description

Short introduction to S29GL064S70BHI030
- It is a 64‑Megabit NOR Flash memory from Spansion/Cypress, offered with a parallel (x8) data interface.
- Organizes as 8 M × 8 (64 Mbit total); designed to store firmware and boot code for embedded systems.
- Key specs (typical): fast random Read with about 70 ns access time; operates from a single 2.7–3.6 V supply (3.0 V family); supports standard NOR flash operations.
- Memory operations: Read, Page Program, Sector/Block Erase, and Chip Erase; uses a conventional command set; supports ready/busy signaling.
- Block/sector erase granularity (typical blocks in the 64 KB–256 KB range) and byte/word programming within pages.
- The suffix “BHI030” denotes a specific packaging/temperature/version variant; exact package type and operating temp range should be confirmed from the datasheet.
- Common uses: host firmware storage, boot ROMs, and other code storage in embedded controllers. Requires a flash controller or microcontroller with NOR flash timing and command support.

Features

Here are the typical features of the S29GL064S70BHI030 (Spansion/S29GL series) – concise:
- Density: 64 Mbit NOR Flash (8 Mbyte total)
- Architecture: MirrorBit NOR Flash
- Speed: 70 ns read access
- Voltage: 2.7–3.6 V operation (industrial grade variant)
- Bus width: x8 data bus
- Memory organization: NOR flash with sector/block erase capabilities
- Random access read and asynchronous operation
- Erase/Program: sector and block erase with programmed/verified writes
- Power modes: normal, deep power-down; low-power standby
- Reliability features: software/hardware protection, block protection mechanisms
- Temperature range: -40°C to +85°C (industrial)
- Additional capabilities: suspend/resume during program/erase cycles
Note: exact sector sizes, block structure, endurance (erase/program cycles), and packaging details vary by revision. Please refer to the official datasheet for precise specifications.

Package

BGA package (ball-grid-array).

Pinout

- Pin count: 48 pins (TSOP-II package).
- Function: 64-Mbit NOR flash memory (8 MBytes) with 70 ns access, parallel interface (A0–A22, DQ0–DQ7, /CE, /OE, /WE, etc.) for read/erase/program operations.

Manufacturer

- Manufacturer: Spansion Inc. (a flash memory maker; now part of Cypress Semiconductor, which was later acquired by Infineon Technologies).
- Company type: A global semiconductor company that designs and manufactures memory ICs (NOR flash).

Application

Applications of S29GL064S70BHI030 include:
- Boot flash and program memory for microcontrollers/SoCs
- Firmware storage and field updates
- Automotive ECUs and ADAS systems
- Industrial controls ( PLCs, robotics, sensors)
- Networking/telecom equipment (routers, switches)
- Consumer electronics (set‑top boxes, TVs, cameras)
- Data logging and other embedded non-volatile storage

Equivalent

Equivalents (64-Mbit NOR, 3.0V, ~70ns) from major vendors:
- Macronix MX29GL064E
- Winbond W29GL064G
- Spansion/Cypress S29GL064S70 (same family; use cross-reference for exact packaging)
Note: verify package pinout, voltage, and timing; use the vendor’s cross-reference tool to confirm exact substitute.

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