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S29GL032N90TFI020
IC FLASH 32MBIT PARALLEL 56TSOP
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- 製造商。 部分 #S29GL032N90TFI020
- 包 TSOP-56
- 資料表 S29GL032N90TFI020 DataSheet
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規格
| Package | Bulk,Tray |
| Series | GL-N |
| ProductStatus | Discontinued at Digi-Key |
| MemoryType | Non-Volatile |
| MemoryFormat | FLASH |
| Technology | FLASH - NOR |
| MemorySize | 32Mb (4M x 8, 2M x 16) |
| MemoryInterface | Parallel |
| WriteCycleTime-WordPage | 90ns |
| AccessTime | 90 ns |
| Voltage-Supply | 2.7V ~ 3.6V |
| OperatingTemperature | -40°C ~ 85°C (TA) |
| MountingType | Surface Mount |
| Package/Case | 56-TFSOP (0.724, 18.40mm Width) |
概述
Description
S29GL032N90TFI020 is a 32‑Mbit NOR flash memory device (4 MB) from the S29GL family (Spansion/Cypress). Key points:
- Data bus: x16 (16‑bit I/O)
- Speed: 90 ns random access time
- Supply: single-supply operation (typical 2.7–3.6 V)
- Architecture: NOR flash with sector/chip erase; supports standard read/program/erase sequences via the Spansion command set
- Endurance/retention: erase cycles in the typical NOR range; data retention many years
- Features: ready/busy indicator, software/hardware protection options, optional security features
- Packaging/variant: TF I020 denotes a specific packaging/temperature variant; pin count and exact temperature range depend on the variant—consult the datasheet for pinout and environmental specs
Use: ideal for firmware/code storage and boot memory in embedded systems. For exact block sizes, timings, and package details, refer to the S29GL032N90TFI020 datasheet.
- Data bus: x16 (16‑bit I/O)
- Speed: 90 ns random access time
- Supply: single-supply operation (typical 2.7–3.6 V)
- Architecture: NOR flash with sector/chip erase; supports standard read/program/erase sequences via the Spansion command set
- Endurance/retention: erase cycles in the typical NOR range; data retention many years
- Features: ready/busy indicator, software/hardware protection options, optional security features
- Packaging/variant: TF I020 denotes a specific packaging/temperature variant; pin count and exact temperature range depend on the variant—consult the datasheet for pinout and environmental specs
Use: ideal for firmware/code storage and boot memory in embedded systems. For exact block sizes, timings, and package details, refer to the S29GL032N90TFI020 datasheet.
Features
Key features of S29GL032N90TFI020:
- 32 Mbit NOR flash memory (4 MB)
- 90 ns random access time
- 3.0 V single-supply operation (I/O typically 2.7–3.6 V)
- 20-pin TSOP packaging (TFI020)
- Uniform sector erase architecture (e.g., sectors ~64 KB; chip erase optional)
- Page program up to 256 bytes; supports random and sequential reads
- Read/write command set with Ready/Busy (R/B#) status and erase/program state machine
- In-system programmable with block protection (BP) features
- Endurance ~100k erase/program cycles per sector; data retention ~20 years
- Low-power standby mode; suitable for embedded/consumer applications
- Temperature range: commercial options (-40 to 85°C) (industrial options may vary)
Note: exact sector sizes and temperature ranges may vary by revision; consult the datasheet for precise specs.
- 32 Mbit NOR flash memory (4 MB)
- 90 ns random access time
- 3.0 V single-supply operation (I/O typically 2.7–3.6 V)
- 20-pin TSOP packaging (TFI020)
- Uniform sector erase architecture (e.g., sectors ~64 KB; chip erase optional)
- Page program up to 256 bytes; supports random and sequential reads
- Read/write command set with Ready/Busy (R/B#) status and erase/program state machine
- In-system programmable with block protection (BP) features
- Endurance ~100k erase/program cycles per sector; data retention ~20 years
- Low-power standby mode; suitable for embedded/consumer applications
- Temperature range: commercial options (-40 to 85°C) (industrial options may vary)
Note: exact sector sizes and temperature ranges may vary by revision; consult the datasheet for precise specs.
Package
An 8-pin TSOP (Thin Small Outline Package) – the TFI version.
Pinout
Pin count: 48 pins (TSOP II package, S29GL032N90TFI020).
Function: 32-Mbit NOR flash memory with a parallel interface (non-volatile storage for firmware/code). Provides address lines (A0–A21), 8-bit data I/O (DQ0–DQ7), control signals (CE#, OE#, WE#, R/B#), and power/GND pins (Vcc, Vccq, GND).
Function: 32-Mbit NOR flash memory with a parallel interface (non-volatile storage for firmware/code). Provides address lines (A0–A21), 8-bit data I/O (DQ0–DQ7), control signals (CE#, OE#, WE#, R/B#), and power/GND pins (Vcc, Vccq, GND).
Manufacturer
Manufacturer: Spansion Inc. Spansion is a semiconductor company that specializes in non-volatile memory, particularly NOR flash memory. It originated as a joint venture between AMD and Fujitsu and has since become part of Cypress Semiconductor (now under Infineon Technologies).
Application
S29GL032N90TFI020 is a 32‑Mbit NOR flash memory. Applications include:
- Boot firmware storage and XIP (in embedded systems)
- Automotive ECUs and other automotive electronics
- Industrial controllers and PLCs
- Networking/communication devices (routers, switches)
- Consumer electronics (set‑top boxes, TVs, digital cameras)
- Medical devices and other embedded systems needing reliable firmware updates and random‑access code storage.
- Boot firmware storage and XIP (in embedded systems)
- Automotive ECUs and other automotive electronics
- Industrial controllers and PLCs
- Networking/communication devices (routers, switches)
- Consumer electronics (set‑top boxes, TVs, digital cameras)
- Medical devices and other embedded systems needing reliable firmware updates and random‑access code storage.
Equivalent
Equivalent parts (32-Mbit NOR, 90 ns, 3V, parallel interface) include:
- Winbond W29GL032N
- Macronix MX29GL032CN (and MX29GL032DN)
- ISSI IS29GL032N90
Check package type and temperature rating; cross-reference via DigiKey/Mouser to confirm exact matches for TFI020 packaging.
- Winbond W29GL032N
- Macronix MX29GL032CN (and MX29GL032DN)
- ISSI IS29GL032N90
Check package type and temperature rating; cross-reference via DigiKey/Mouser to confirm exact matches for TFI020 packaging.
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