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MTFC256GBEAXHF-WT
IC FLASH 2TBIT UFS 153VFBGA
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規格
| Part Status | Obsolete |
| Base Product Number | MTFC256 |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NAND (SLC) |
| Memory Size | 2Tbit |
| Memory Organization | 256G x 8 |
| Memory Interface | UFS 4.0 |
| Operating Temperature | -25°C ~ 85°C |
| Mounting Type | Surface Mount |
| Package | 153-WFBGA |
| Supplier Device Package | 153-WFBGA (11x13) |
| Packaging | Tray |
概述
Description
MTFC256GBEAXHF-WT is a model designation for a 256 GB NAND flash storage device used in embedded/SSD applications. It’s a component, not a standalone drive, and its exact specs depend on the vendor and revision. To know precise details, see the vendor’s datasheet.
Key points to look for:
- Capacity: 256 GB (usable capacity varies by format)
- Memory type: NAND flash (type and organization depend on vendor)
- Interface/form factor: PCIe/NVMe, SATA, eMMC, USB, or other; check the datasheet for the exact form factor (e.g., M.2, 2.5", BGA)
- Endurance and reliability: TBW or P/E cycles, ECC, bad-block management
- Performance: sequential read/write speeds and random IOPS (vendor-specific)
- Features: wear leveling, TRIM/SMART support, error correction, MTBF
Use cases: embedded systems, consumer/enterprise storage, automotive or industrial applications. For exact specs, obtain the specific vendor’s datasheet for MTFC256GBEAXHF-WT.
Key points to look for:
- Capacity: 256 GB (usable capacity varies by format)
- Memory type: NAND flash (type and organization depend on vendor)
- Interface/form factor: PCIe/NVMe, SATA, eMMC, USB, or other; check the datasheet for the exact form factor (e.g., M.2, 2.5", BGA)
- Endurance and reliability: TBW or P/E cycles, ECC, bad-block management
- Performance: sequential read/write speeds and random IOPS (vendor-specific)
- Features: wear leveling, TRIM/SMART support, error correction, MTBF
Use cases: embedded systems, consumer/enterprise storage, automotive or industrial applications. For exact specs, obtain the specific vendor’s datasheet for MTFC256GBEAXHF-WT.
Package
Package type: BGA (Ball Grid Array). For exact ball count and package dimensions, refer to the vendor’s datasheet.
Pinout
I can’t verify the pin count or exact function from public sources for MTFC256GBEAXHF-WT. This part appears to be a 256 GB NAND flash device, but the precise package pin count and interface depend on the manufacturer’s datasheet. Please provide the manufacturer or a datasheet link (or search for “MTFC256GBEAXHF-WT datasheet”) to confirm pin count and function.
Manufacturer
- Manufacturer: Micron Technology, Inc.
- What kind of company: An American multinational memory and storage semiconductor company that designs and manufactures DRAM, NAND flash, and related storage solutions for data centers, consumer devices, and automotive applications.
- What kind of company: An American multinational memory and storage semiconductor company that designs and manufactures DRAM, NAND flash, and related storage solutions for data centers, consumer devices, and automotive applications.
Application
MTFC256GBEAXHF-WT is a high‑density embedded flash memory. Potential application areas include:
- Automotive: infotainment, telematics, instrument clusters
- Industrial/rugged embedded: controllers, gateways, edge computing
- Consumer electronics: tablets, cameras, wearables
- Networking/storage: routers, NAS, set‑top boxes
- Medical devices: monitoring and imaging equipment
- Enterprise/embedded servers and boot/storage
Note: check the datasheet for temperature range, endurance, and interface specifics.
- Automotive: infotainment, telematics, instrument clusters
- Industrial/rugged embedded: controllers, gateways, edge computing
- Consumer electronics: tablets, cameras, wearables
- Networking/storage: routers, NAS, set‑top boxes
- Medical devices: monitoring and imaging equipment
- Enterprise/embedded servers and boot/storage
Note: check the datasheet for temperature range, endurance, and interface specifics.
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