圖片僅供參考
MT53E1G32D2NP-046 WT:B
DRAM LPDDR4 32Gbit 32 200/264 WFBGA 2 WT
- 製造商
- 製造商。 部分 #MT53E1G32D2NP-046 WT:B
- 包
- 資料表
- 有現貨的29940
100%原創; 新
24小時準備發貨
365天保修
RFQ&; 獲得更多折扣
規格
| Packaging | Tray |
| Standard Pack Qty | 1360 |
概述
Description
The MT53E1G32D2NP-046 WT:B is a specific model of DRAM (Dynamic Random-Access Memory) produced by Micron Technology. It falls under the category of Mobile DRAM, designed primarily for mobile devices such as smartphones, tablets, and laptops, where low power consumption and high performance are critical.
Key features include a memory capacity of 1GB, a data width of 32 bits, and it operates at a frequency of 1066 MT/s (Megatransfers per second). The designation "-046" typically indicates the manufacturing process or specific configuration, while "WT:B" may refer to the temperature range or specific testing requirements.
This DRAM component is ideal for applications requiring efficient memory solutions, benefiting from Micron's advanced memory technology. Overall, the MT53E1G32D2NP-046 WT:B is engineered for optimal performance and reliability in portable devices.
Key features include a memory capacity of 1GB, a data width of 32 bits, and it operates at a frequency of 1066 MT/s (Megatransfers per second). The designation "-046" typically indicates the manufacturing process or specific configuration, while "WT:B" may refer to the temperature range or specific testing requirements.
This DRAM component is ideal for applications requiring efficient memory solutions, benefiting from Micron's advanced memory technology. Overall, the MT53E1G32D2NP-046 WT:B is engineered for optimal performance and reliability in portable devices.
Features
The MT53E1G32D2NP-046 WT:B is a DDR3 SDRAM memory chip manufactured by Micron Technology. Here are its key features:
1. Capacity: 1 Gigabit (1G x 32).
2. Type: DDR3 SDRAM (Double Data Rate Synchronous Dynamic Random Access Memory).
3. Data Rate: Operates at a data rate of up to 1066 MT/s.
4. Organization: 1G x 32 configuration, allowing for high bandwidth and efficient data processing.
5. Operating Voltage: Typically operates at 1.5V, offering improved power efficiency compared to earlier DDR generations.
6. Package Type: Usually comes in a FBGA (Fine Ball Grid Array) package, facilitating compact designs.
7. Temperature Range: Supports standard commercial temperature ranges, suitable for various applications.
This memory chip is often used in consumer electronics, networking hardware, and other applications requiring reliable, high-performance memory solutions.
1. Capacity: 1 Gigabit (1G x 32).
2. Type: DDR3 SDRAM (Double Data Rate Synchronous Dynamic Random Access Memory).
3. Data Rate: Operates at a data rate of up to 1066 MT/s.
4. Organization: 1G x 32 configuration, allowing for high bandwidth and efficient data processing.
5. Operating Voltage: Typically operates at 1.5V, offering improved power efficiency compared to earlier DDR generations.
6. Package Type: Usually comes in a FBGA (Fine Ball Grid Array) package, facilitating compact designs.
7. Temperature Range: Supports standard commercial temperature ranges, suitable for various applications.
This memory chip is often used in consumer electronics, networking hardware, and other applications requiring reliable, high-performance memory solutions.
Package
The MT53E1G32D2NP-046 WT:B is a DRAM component packaged in a small FBGA (Fine Ball Grid Array) format, specifically designed for mobile and computing applications to provide high-density memory solutions.
Pinout
The MT53E1G32D2NP-046 WT:B is a 1GB DDR3 SDRAM memory device, specifically a DDR3L SDRAM. It typically features a 78-pin ball grid array (BGA) package.
The primary functions of the pins include:
1. Data Pins: For data input/output, typically 32 data bits wide.
2. Address Pins: To select memory addresses.
3. Control Pins: For controlling memory operations, including chip select (CS), write enable (WE), and clock (CK).
4. Power Pins: For supplying power (VDD, VSS).
5. Ball and Signal Types: Specific pins for differential clock signals, write/read commands, and mode registers.
This chip operates at a voltage of 1.35V (DDR3L) and is designed for low power consumption while providing high performance suitable for various applications. For detailed functionality, please refer to the specific datasheet from Micron Technology.
The primary functions of the pins include:
1. Data Pins: For data input/output, typically 32 data bits wide.
2. Address Pins: To select memory addresses.
3. Control Pins: For controlling memory operations, including chip select (CS), write enable (WE), and clock (CK).
4. Power Pins: For supplying power (VDD, VSS).
5. Ball and Signal Types: Specific pins for differential clock signals, write/read commands, and mode registers.
This chip operates at a voltage of 1.35V (DDR3L) and is designed for low power consumption while providing high performance suitable for various applications. For detailed functionality, please refer to the specific datasheet from Micron Technology.
Manufacturer
The MT53E1G32D2NP-046 WT:B is manufactured by Micron Technology, Inc. Micron is a global leader in the semiconductor industry, specializing in memory and storage solutions, including DRAM, NAND flash memory, and solid-state drives (SSDs). Founded in 1978 and headquartered in Boise, Idaho, Micron serves a diverse array of markets, including computing, mobile, automotive, and enterprise applications. The company is known for its innovation and technological advancements in memory products, contributing significantly to various sectors such as consumer electronics, data centers, and industrial applications. Micron is publicly traded and plays a crucial role in the development of memory technologies that enable modern computing and data storage solutions.
Application
The MT53E1G32D2NP-046 WT:B is a DRAM memory chip from Micron Technology, typically used in mobile devices, automotive applications, and IoT devices. Its low power consumption and high-speed performance make it suitable for applications requiring efficient data processing, such as smartphones, tablets, and embedded systems. Additionally, it can be utilized in edge computing scenarios where space and power efficiency are critical.
Equivalent
The MT53E1G32D2NP-046 WT:B is a DRAM memory chip from Micron Technology, specifically a DDR4 SDRAM. Equivalent products may include other DDR4 memory chips with similar specifications, such as those from Samsung (K4AAG085WB), SK Hynix (H5AN8G6NCJR), or other Micron models like MT53E1G32D2P. Ensure compatibility with the specific application and configuration requirements, including speed, capacity, and organization.
船舶
運輸管道我們
通過DHL、FedEx、TNT、UPS或您選擇的任何其他貨運代理提供全球運輸服務。
運費參攷(DHL/FedEx):
動態主要裝載: 運費從25美元到45美元(0.5公斤)不等,預計交貨時間為2-5個工作日。
聯邦快遞: 運費從25美元到40美元(0.5公斤)不等,預計交貨時間為3-7個工作日。
不斷電供應系統: 運費從25美元到45美元(0.5公斤)不等,預計交貨時間為3-7個工作日。
三硝基甲苯: 運費從25美元到65美元(0.5公斤)不等,預計交貨時間為3-7個工作日。
增强型短消息: 運費從30美元到50美元(0.5公斤)不等,預計交貨時間為7-15個工作日。
掛號: 運費為2-4美元(0.1公斤),預計交貨時間為5-20個工作日。
支付
Payment Methods
付款條件為100%預付。
現時,我們只接受以下付款方式:
1. 貝寶
2. 信用卡/借記卡
3. 電匯
類似的
-
MX25L3233FM1I-08Q
Macronix
-
MX25V1635FZNQ03
Macronix
-
MX29F400CBTI-70G
Macronix
-
MX25V4035FZUI
Macronix
-
MX25R3235FZNIL0
Macronix
-
MX25V16066M2I02
Macronix
-
MX25L25673GMI-08G
Macronix
-
MX25L25673GMI-10G
Macronix
-
MX25L2006EM1I-12G
Macronix
-
MX25L6433FM2I-08G
Macronix
-
MX29F040CQI-70G
Macronix
-
MX25L25645GXDI-08..
Macronix