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MT53D512M32D2DS-053 WT:D

Name: MT53D512M32D2DS-053 WT:D
Rating: 4.7 (12 reviews)

WFBGA-200 Memory (ICs) RoHS

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Packaging

WFBGA-200

概述

Description

The MT53D512M32D2DS-053 WT:D is a high-performance memory component, specifically a 512 Megabit (Mb) DRAM chip designed for various applications, including mobile devices, networking, and computing systems. It features a 32-bit data width and operates with a low power consumption profile, making it suitable for energy-efficient designs. The part number indicates it is part of Micron Technology's product line, with the "D" denoting the DRAM type.
This memory chip utilizes advanced manufacturing processes to achieve high speed and reliability, supporting various data rates and protocols. It is often used in applications requiring fast data access and storage, contributing to overall system performance. The "WT" in the designation typically refers to the package type or specific design features, while "D" may indicate a specific version or revision.
Overall, the MT53D512M32D2DS-053 WT:D is a versatile and efficient memory solution well-suited for modern electronic designs.

Features

The MT53D512M32D2DS-053 WT:D is a DDR3 SDRAM memory component produced by Micron Technology. Here are its key features:
1. Capacity: 512 Megabits (Mb), organized as 32 bits x 16 banks.
2. Speed: Operates at a data rate of 1066 MT/s (mega-transfers per second).
3. I/O Voltage: Compatible with a supply voltage of 1.5V.
4. Package: Typically available in a small form factor, such as a 78-ball FBGAs (Fine Ball Grid Array).
5. Architecture: Supports wide I/O, making it suitable for high-performance applications.
6. ECC Support: Generally includes Error-Correcting Code (ECC) for improved data integrity.
7. Operational Temperature: Designed for commercial temperature ranges, typically from 0°C to 95°C.
This memory component is commonly used in various applications, including consumer electronics, networking, and computing devices, due to its balance of performance and efficiency.

Package

The MT53D512M32D2DS-053 WT:D is a DDR4 DRAM memory chip packaged in a 78-ball VFBGA (very fine ball grid array) format. This package type is designed for high-density applications, offering compact dimensions and efficient heat dissipation.

Pinout

The MT53D512M32D2DS-053 WT:D is a DDR4 SDRAM memory device from Micron Technology. It has a pin count of 96.
The main functions of this device include:
1. Memory Storage: It serves as volatile memory for data storage during operation.
2. Data Transfer: Supports high-speed data transfer rates, improving overall system performance.
3. Addressing: Provides multiple address lines to access its 512 Meg x 32 bits configuration.
4. Power Management: Features low power consumption modes to enhance energy efficiency.
This component is typically used in applications requiring high-speed memory access, such as in computers, servers, and networking equipment.

Manufacturer

The manufacturer of the MT53D512M32D2DS-053 WT:D is Micron Technology, Inc. Micron is an American multinational corporation that specializes in producing memory and storage solutions, including DRAM, NAND flash memory, and solid-state drives (SSDs). Founded in 1978 and headquartered in Boise, Idaho, Micron is a key player in the semiconductor industry, providing products for a wide range of applications, including computers, mobile devices, automotive systems, and data centers. The company is known for its innovation in memory technologies and plays a significant role in the global supply chain for memory components.

Application

The MT53D512M32D2DS-053 WT:D is a DDR4 DRAM memory chip used in various applications, including high-performance computing, data centers, servers, and networking equipment. It is suitable for tasks requiring fast data processing, such as artificial intelligence, machine learning, and big data analytics. Additionally, it can be employed in consumer electronics, gaming systems, and embedded applications where high-speed memory is critical.

Equivalent

The MT53D512M32D2DS-053 WT:D chip is a DDR4 DRAM memory component. Equivalent products may include other DDR4 chips with similar specifications such as density (512 Mb), organization (x32), and timing characteristics. Potential equivalent manufacturers include Samsung (K4AAG085WB-BCRC), SK Hynix (H5AN8G8NMFR-TFC), and Micron (MT53D512M32D2DS-053). Always verify compatibility with specific applications and systems.