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MT41K128M16HA-15E:D
IC DRAM 2GBIT PARALLEL 96FBGA
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- 包 96-TFBGA
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規格
| Supplier | Micron Technology Inc. |
| Package | Tray |
| ProductStatus | Obsolete |
| MemoryType | Volatile |
| MemoryFormat | DRAM |
| Technology | SDRAM - DDR3L |
| MemorySize | 2Gb (128M x 16) |
| MemoryInterface | Parallel |
| ClockFrequency | 667 MHz |
| AccessTime | 13.5 ns |
| Voltage-Supply | 1.283V ~ 1.45V |
| OperatingTemperature | 0°C ~ 95°C (TC) |
| MountingType | Surface Mount |
| Package/Case | 96-TFBGA |
概述
Description
MT41K128M16HA-15E:D is Micron’s DDR3 SDRAM device. It is a high-density memory die with:
- Capacity/organization: 2 Gb total, 128M x 16 (16-bit wide data bus)
- Banks: x8/x16 DDR3 typically uses 8 banks
- Interface/voltage: DDR3 signaling, roughly 1.5V supply
- Performance: speed grade -15E indicates a specific timing/speed spec within the DDR3 family (exact data rate depends on the system’s memory controller); the suffix encodes voltage, timing, and temp/packaging details
- Use: common as a component in memory modules (DIMMs/SODIMMs) or embedded memory subsystems
For precise electrical characteristics, timings, operating temperature range, and maximum frequency, consult the Micron MT41K128M16HA-15E:D datasheet.
- Capacity/organization: 2 Gb total, 128M x 16 (16-bit wide data bus)
- Banks: x8/x16 DDR3 typically uses 8 banks
- Interface/voltage: DDR3 signaling, roughly 1.5V supply
- Performance: speed grade -15E indicates a specific timing/speed spec within the DDR3 family (exact data rate depends on the system’s memory controller); the suffix encodes voltage, timing, and temp/packaging details
- Use: common as a component in memory modules (DIMMs/SODIMMs) or embedded memory subsystems
For precise electrical characteristics, timings, operating temperature range, and maximum frequency, consult the Micron MT41K128M16HA-15E:D datasheet.
Features
MT41K128M16HA-15E:D is a Micron DDR3 SDRAM device. Key features:
- Density/organization: 2 Gb per device (128M x 16)
- Banks: 8-bank DDR3
- Interface: DDR3 with 8n prefetch; synchronous with CK signals
- I/O and power: VDD/VDDQ = 1.5 V (standard DDR3); unbuffered, non-ECC
- Speed grade: -15E (logo indicates performance bin; actual data rate depends on system)
- Performance: supports high-speed DDR3 operation (typical module designs achieve ~1066–1600 MT/s depending on grade and board)
- On-die features: ZQ calibration, On-Die Termination (ODT), DLL
- Refresh/power: PASR (partial array refresh), standard self-refresh, deep power-down options
- Packaging: standard DDR3 device package (used in memory modules and boards)
- Applications: selectable for desktop/server DIMMs and other systems needing a 2 Gb DDR3 die
Note: Exact speed (MT/s), voltage tolerances, and packaging variants depend on the specific lot and board design; consult the datasheet for precise values.
- Density/organization: 2 Gb per device (128M x 16)
- Banks: 8-bank DDR3
- Interface: DDR3 with 8n prefetch; synchronous with CK signals
- I/O and power: VDD/VDDQ = 1.5 V (standard DDR3); unbuffered, non-ECC
- Speed grade: -15E (logo indicates performance bin; actual data rate depends on system)
- Performance: supports high-speed DDR3 operation (typical module designs achieve ~1066–1600 MT/s depending on grade and board)
- On-die features: ZQ calibration, On-Die Termination (ODT), DLL
- Refresh/power: PASR (partial array refresh), standard self-refresh, deep power-down options
- Packaging: standard DDR3 device package (used in memory modules and boards)
- Applications: selectable for desktop/server DIMMs and other systems needing a 2 Gb DDR3 die
Note: Exact speed (MT/s), voltage tolerances, and packaging variants depend on the specific lot and board design; consult the datasheet for precise values.
Package
Fine-pitch FBGA (Fine-pitch Ball Grid Array), 96-ball package.
Pinout
- Pin count: 96 pins (96-ball FBGA package).
- Function: Micron MT41K128M16HA-15E:D is a DDR3 SDRAM device, 2 Gb total capacity, organized as 128M × 16 (i.e., 16-bit data width) for use as system memory.
- Function: Micron MT41K128M16HA-15E:D is a DDR3 SDRAM device, 2 Gb total capacity, organized as 128M × 16 (i.e., 16-bit data width) for use as system memory.
Manufacturer
- Manufacturer: Micron Technology, Inc.
- About the company: An American multinational semiconductor company and one of the world’s leading memory manufacturers, designing and producing DRAM, NAND Flash and other memory devices. Headquartered in Boise, Idaho; publicly traded on NASDAQ (ticker MU).
- About the company: An American multinational semiconductor company and one of the world’s leading memory manufacturers, designing and producing DRAM, NAND Flash and other memory devices. Headquartered in Boise, Idaho; publicly traded on NASDAQ (ticker MU).
Application
- Main system memory for desktops, laptops (DIMMs/SO-DIMMs) and servers/workstations.
- OEM memory components for embedded/industrial applications and telecom/networking equipment requiring high-density DDR3 DRAM.
- OEM memory components for embedded/industrial applications and telecom/networking equipment requiring high-density DDR3 DRAM.
Equivalent
MT41K128M16HA-15E:D is a Micron 2 Gb DDR3L SDRAM (128M × 16) at DDR3-1333, 1.35 V. Equivalents are other vendors’ 2 Gb DDR3L ×16 devices with the same speed/voltage (e.g., from Samsung, SK hynix, Nanya). Exact replacement part numbers depend on packaging and revision; use a cross-reference (Micron tool or supplier DB) to match PN, package, and timing.
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