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MK26FN2M0CAC18R

Name: MK26FN2M0CAC18R
Rating: 4.7 (12 reviews)

IC MCU 32BIT 2MB FLASH 169WLCSP

製造商
製造商。部分 #MK26FN2M0CAC18R
包 169-UFBGA, WLCSP
資料表
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規格

Supplier	NXP USA Inc.
Package	Tape & Reel (TR),Cut Tape (CT)
Series	Kinetis K20
ProductStatus	Active
CoreProcessor	ARM® Cortex®-M4
CoreSize	32-Bit Single-Core
Speed	180MHz
Connectivity	CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals	DMA, I²S, LVD, POR, PWM, WDT
NumberofI/O	116
ProgramMemorySize	2MB (2M x 8)
ProgramMemoryType	FLASH
RAMSize	256K x 8
Voltage-Supply(Vcc/Vdd)	1.71V ~ 3.6V
DataConverters	A/D 5x12b, 6x16b; D/A 2x12b
OscillatorType	Internal
OperatingTemperature	-40°C ~ 85°C (TA)
MountingType	Surface Mount
Package/Case	169-UFBGA, WLCSP

概述

Description

MK26FN2M0CAC18R is an NXP Freescale Kinetis microcontroller from the MK26FN2M0 family. It uses a 32‑bit ARM Cortex‑M0+ core and is designed for cost‑ and power‑constrained embedded applications. The MK26FN2M0 family provides scalable memory and a rich peripheral set, including GPIO, timers, ADCs and DACs, and serial interfaces (UART/SPI/I2C); USB support is available on selected variants. It also features a DMA controller, flexible clocking, and multiple low‑power modes. Debug and development are supported via standard SWD/JTAG interfaces. The CAC18R suffix identifies a specific package and temperature rating; exact dimensions, pin count, voltage range, and performance are defined in the datasheet. Typical applications include motor control, sensing and data acquisition, consumer and industrial control, and portable devices. For precise specs—clock speed, Flash/RAM sizes, peripheral counts—refer to the official MK26FN2M0CAC18R datasheet and reference manual.

Features

Here are the typical features of MK26FN2M0CAC18R (Kinetis K26/M0+ family):
- CPU: 32-bit ARM Cortex-M0+ core, up to about 48 MHz
- Memory: on-chip Flash up to 256 KB; RAM up to 64 KB (variant-dependent)
- USB: USB Full-Speed (12 Mbps) capable
- Serial interfaces: UART/USART, I2C, SPI
- Analog: 12-bit ADC with multiple channels
- Timers/PWM: FlexTimer modules and general-purpose timers
- DMA: EDMA for peripheral data transfers
- Clocking: flexible clock system with PLL/FLL and multiple sources
- Power: low-power modes and power-management features
- Debug/Programming: on-chip debug (SWD/JTAG)
- Boot/Protection: boot ROM monitor, security/option bits
- Peripherals: event system for routing between peripherals
- Packages: multiple package options (e.g., LQFP, CF, BGA variants)
Note: exact memory sizes, peripheral counts, and package options vary by specific device variant within the MK26FN2M0CAC family.

Package

LQFP package (low-profile quad flat package), 176 pins, 18x18 mm body (CAC18R).

Pinout

- Pin count: 144-pin LQFP
- Function: NXP Kinetis MK26FN2M0CAC18R is a 32-bit ARM Cortex-M0+ microcontroller with on-chip Flash and RAM and integrated peripherals for embedded control.

Manufacturer

Manufacturer: NXP Semiconductors. It is a Dutch multinational semiconductor company that designs and manufactures microcontrollers, processors, sensors, security ICs and other integrated circuits for automotive, industrial, consumer, and communications applications.

Application

MK26FN2M0CAC18R is a 32-bit ARM Cortex-M0+ MCU intended for cost- and power-efficient embedded systems. Typical applications include USB-enabled peripherals and hubs; industrial automation and sensing; motor control and drive electronics; consumer electronics and wearables; automotive body electronics; IoT edge devices and smart meters; and data acquisition/HMI.