MCIMX6Y1DVM05AB

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MCIMX6Y1DVM05AB

I.MX6ULL ROM PERF ENHAN

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規格

Supplier NXP USA Inc.
Package Tray
Series i.MX6
ProductStatus Active
CoreProcessor ARM® Cortex®-A7
NumberofCores/BusWidth 1 Core, 32-Bit
Speed 528MHz
Co-Processors/DSP Multimedia; NEON™ MPE
RAMControllers LPDDR2, DDR3, DDR3L
GraphicsAcceleration No
Display&InterfaceControllers Electrophoretic, LCD
Ethernet 10/100Mbps (2)
USB USB 2.0 OTG + PHY (2)
Voltage-I/O 1.8V, 2.8V, 3.3V
OperatingTemperature 0°C ~ 95°C (TJ)
SecurityFeatures A-HAB, ARM TZ, CSU, SJC, SNVS
Package/Case 289-LFBGA

概述

Description

MCIMX6Y1DVM05AB is an NXP i.MX6Y1 Development Vehicle Module (DVM) used to evaluate and prototype on the i.MX6Y1 platform. It’s a compact, ready-to-use board that exposes common interfaces (USB, Ethernet, display/camera options, serial console, GPIO) and includes onboard memory and power management. It supports Linux and Android development with NXP BSPs and can boot from microSD or eMMC. The module is aimed at rapid prototyping for industrial, automotive, and consumer applications, allowing developers to assess performance, peripherals, and software stacks on the i.MX6Y1 before committing to a custom design. For exact specifications, consult the official product brief and user guide/revision AB documentation.

Features

MCIMX6Y1DVM05AB is an NXP i.MX 6Y1 development module. Key features typically include:
- SoC: i.MX 6Y1 family (ARM Cortex-A9), up to around 1 GHz
- Graphics/Media: integrated 2D/3D graphics accelerator and hardware video decode/encode
- Memory/Storage: supports DDR3/LPDDR2 RAM, expandable storage via eMMC/NAND and microSD
- I/O Interfaces: USB 2.0 (OTG/Host), Ethernet, CAN, UART, SPI, I2C, GPIOs
- Display/Camera: HDMI and/or MIPI-CSI/DSI for displays and cameras
- Security: hardware crypto accelerators
- Software: Linux, Android, and RTOS support
- Power/Environment: on-board PMIC, 5V input, suitable for development use (industrial temp range variants available)
Note: exact RAM size, storage capacity, and available interfaces can vary by revision. For precise specs, refer to the official NXP datasheet and the module’s user guide.

Package

Package type: Ball Grid Array (BGA) package for the i.MX6Y1 CPU on the MCIMX6Y1DVM05AB module.

Pinout

- Pin count: 400 pins
- Function: i.MX 6Y1 Development Vehicle Module (DVM) – a development/evaluation module for the i.MX6Y1 SoC that exposes the processor’s power, memory and major I/O interfaces (HDMI/Display, USB, Ethernet, camera/display interfaces, etc.).

Manufacturer

- Manufacturer: NXP Semiconductors (NXP).
- Company type: A global Dutch semiconductor company that designs and manufactures embedded processors, microcontrollers, and other IC solutions (e.g., i.MX processors) for automotive, industrial, and consumer electronics.

Application

MCIMX6Y1DVM05AB is an i.MX6-based development module suitable for multimedia-rich embedded systems. Common application areas include: automotive infotainment and instrument clusters; industrial automation, HMI panels, and gateways; digital signage and media players; consumer electronics such as set-top boxes; networking/industrial gateways and routers; medical devices and portable healthcare equipment; smart home/IoT hubs; and robotics and drones requiring multimedia and GPU/accelerator capabilities.

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