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MC33662BLEFR2
IC TRANSCEIVER 1/1 8SOIC
- 製造商
- 製造商。 部分 #MC33662BLEFR2
- 包 8-SOIC (0.154, 3.90mm Width)
- 資料表 MC33662BLEFR2 DataSheet
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規格
| Supplier | NXP USA Inc. |
| Package | Tape & Reel (TR),Cut Tape (CT) |
| ProductStatus | Active |
| Type | Transceiver |
| Protocol | LINbus |
| NumberofDrivers/Receivers | 1/1 |
| DataRate | 20kbps |
| Voltage-Supply | 7V ~ 18V |
| OperatingTemperature | -40°C ~ 125°C |
| MountingType | Surface Mount |
| Package/Case | 8-SOIC (0.154, 3.90mm Width) |
概述
Description
MC33662BLEFR2 is an NXP/Freescale Bluetooth Low Energy (BLE) transceiver IC. It provides a 2.4 GHz BLE radio front-end and baseband that can work with an external host MCU over a serial interface (SPI/I2C) to run a BLE stack. The FR2 suffix indicates a specific package variant. It targets low-power, short-range wireless for automotive and consumer devices (wearables, sensors, remotes, gateways). You integrate the IC with a host MCU, supply rails per the datasheet, and implement BLE (GAP/GATT) via software or an accompanying stack. For exact electrical specs—voltage ranges, TX/RX current, sensitivity, data rate, timing, pinout, register map, power modes, and regulatory compliance—refer to the official MC33662BLEFR2 datasheet and reference designs from NXP/Freescale. Availability may vary since it’s an older-generation part.
Package
MC33662BLEFR2 comes in an 8‑pin SOIC (surface-mount) package. It’s RoHS compliant, with Tape & Reel packaging (the FR2 code).
Pinout
Pin count: 8 pins.
Function: High‑speed CAN transceiver. It interfaces a CAN controller to the CAN bus, providing CANH/CANL on the bus side and TXD/RXD on the controller side, along with power (Vcc/GND) and standby/enable control.
Function: High‑speed CAN transceiver. It interfaces a CAN controller to the CAN bus, providing CANH/CANL on the bus side and TXD/RXD on the controller side, along with power (Vcc/GND) and standby/enable control.
Manufacturer
Manufacturer: NXP Semiconductors (the Freescale Semiconductor lineage; NXP acquired Freescale in 2015).
What kind of company: A Dutch multinational semiconductor company that designs and manufactures microchips and embedded processing solutions for automotive, industrial, and consumer applications.
What kind of company: A Dutch multinational semiconductor company that designs and manufactures microchips and embedded processing solutions for automotive, industrial, and consumer applications.
Application
Possible application areas for MC33662BLEFR2 (BLE front-end module):
- Wearables and fitness sensors
- Wireless medical devices
- Smart home/building automation and BLE beacons
- Industrial IoT sensors and asset tracking
- Automotive applications (telematics, key fobs, sensor networks)
- Consumer electronics (remote controls, peripherals)
- Smart lighting and proximity sensing
(Note: Use cases depend on integration with host MCU and RF design.)
- Wearables and fitness sensors
- Wireless medical devices
- Smart home/building automation and BLE beacons
- Industrial IoT sensors and asset tracking
- Automotive applications (telematics, key fobs, sensor networks)
- Consumer electronics (remote controls, peripherals)
- Smart lighting and proximity sensing
(Note: Use cases depend on integration with host MCU and RF design.)
Equivalent
Equivalent parts (CAN transceivers) from major vendors include:
- NXP: TJA1040 / TJA1042 (and TJA1041)
- TI: SN65HVD230 / SN65HVD231 / SN65HVD232
- Microchip: MCP2551 / MCP2554
These offer similar CAN interface functionality (high-speed CAN, 5V logic, standby/wake features). Note: pinouts and electrical specs differ; always cross-check datasheets and package options for exact form factor (BLEFR2).
- NXP: TJA1040 / TJA1042 (and TJA1041)
- TI: SN65HVD230 / SN65HVD231 / SN65HVD232
- Microchip: MCP2551 / MCP2554
These offer similar CAN interface functionality (high-speed CAN, 5V logic, standby/wake features). Note: pinouts and electrical specs differ; always cross-check datasheets and package options for exact form factor (BLEFR2).
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