LTC4311ISC6

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LTC4311ISC6

IC POWER MANAGEMENT

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規格

Supplier Analog Devices Inc.
Package Tube
ProductStatus Obsolete
Type Accelerator
Applications I²C
Input 2-Wire Bus
Output 2-Wire Bus
DataRate(Max) 400kHz
NumberofChannels 1
Voltage-Supply 1.6V ~ 5.5V
Current-Supply 200µA
OperatingTemperature -40°C ~ 85°C
MountingType Surface Mount
Package/Case 6-TSSOP, SC-88, SOT-363

概述

Description

LTC4311ISC6 is a bidirectional I2C/SMBus level translator from Linear Technology (now Analog Devices). It lets two I2C buses run at different supply voltages and automatically translates signals between them without extra control lines. The A-side and B-side each use their own supply rails (VCCA and VCCB) with external pull-ups, and the device preserves the I2C open-drain nature while preventing back-powering if one side is unpowered. It supports standard I2C speeds and is ideal for connecting a microcontroller on one voltage domain to I2C peripherals on another (e.g., 3.3 V to 5 V). The ISC6 suffix denotes a specific package/temperature variant (an 8-pin package, RoHS-compliant). For exact electrical specs (voltage ranges, current limits, pull-up values), refer to the LTC4311 datasheet.

Package

It comes in a 6‑pin SC‑70 package (SC‑70‑6) surface‑mount.

Pinout

- Pin count: 6 pins (SC-70-6 package).
- Function: An I2C-controlled high-side power switch / hot-swap controller with current limiting and fault/status reporting to protect and sequence a supply to a load.

Manufacturer

Manufacturer: Analog Devices, Inc. (ADI). The LTC prefix originally comes from Linear Technology, which was acquired by ADI in 2017. ADI is a global American semiconductor company that designs and manufactures analog, mixed-signal, and DSP integrated circuits for automotive, industrial, communications, consumer, and other markets.

Application

Application areas of LTC4311ISC6:
- Hot‑swap/power management for I2C devices and backplanes
- I2C bus protection and isolation to contain faults
- Inrush current control and controlled power‑up/power‑down sequencing
- Fault containment for modular industrial, telecom and automotive systems
- Backplane/daughter‑card power management in multi‑board systems

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