LSM6DSV16BXTR

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LSM6DSV16BXTR

INEMO INERTIAL MODULE: 3D ACCELE

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規格

Part Status Active
Sensor Type Accelerometer, Gyroscope, Temperature, 6 Axis
Output Type I2C, I3C, SPI
Operating Temperature -40°C ~ 85°C
Package / Case 14-WFLGA
Supplier Device Package 14-LGA (2.5x3)
Mounting Type Surface Mount

概述

Description

The LSM6DSV16BXTR is a 3-axis accelerometer and 3-axis gyroscope sensor developed by STMicroelectronics, designed for various applications including wearable devices, smartphones, and IoT systems. This sensor integrates both motion and orientation detection, featuring advanced functionalities like machine learning, which enables real-time data processing and context awareness.
Key features include a wide range of selectable output data rates, low power consumption, and high accuracy, making it suitable for applications requiring precise motion tracking. The device supports digital interfaces like I2C and SPI, facilitating easy integration into various systems.
Additionally, the LSM6DSV16BXTR comes with built-in algorithms for activities recognition and sensor fusion, enhancing the capability of devices to interpret user actions. Its compact design and robust performance make it ideal for modern applications in fitness tracking, gaming, and augmented reality. Overall, the LSM6DSV16BXTR is a versatile sensor that combines advanced motion sensing with energy efficiency, catering to the growing demands of smart technology.

Package

The LSM6DSV16BXTR is packaged in a LGA (Land Grid Array) format, specifically a 16-pin LGA package. This compact packaging is designed for surface mounting on PCBs, facilitating integration in various applications, particularly in mobile and IoT devices.

Pinout

The LSM6DSV16BXTR is a system-in-package (SiP) inertial measurement unit (IMU) that combines a 3-axis accelerometer and a 3-axis gyroscope. It has a total of 14 pins, each serving various functions:
1. VDD: Power supply.
2. GND: Ground.
3. SDA: I2C data line.
4. SCL: I2C clock line.
5. CS: Chip select for SPI interface.
6. MISO: Master In Slave Out for SPI.
7. MOSI: Master Out Slave In for SPI.
8. SCK: SPI clock.
9. INT1: Interrupt output 1.
10. INT2: Interrupt output 2.
11. FILT: Filter function for the accelerometer.
12. VIO: I/O voltage supply.
13. VDDIO: I/O power supply.
14. N/C: Not connected.
The LSM6DSV16BXTR is designed for applications requiring motion sensing with low power consumption, such as wearable devices, smartphones, and IoT applications.

Manufacturer

The LSM6DSV16BXTR is manufactured by STMicroelectronics, a global semiconductor company. STMicroelectronics specializes in a broad range of technologies, including microcontrollers, sensors, power management, and automotive solutions. The company is known for its innovative products and solutions that cater to various industries, including automotive, industrial, telecommunications, and consumer electronics. STMicroelectronics is headquartered in Geneva, Switzerland, and is recognized for its commitment to sustainability and advanced manufacturing practices. The LSM6DSV16BXTR is a 3D accelerometer and 3D gyroscope, often used in applications such as motion tracking, wearable devices, and IoT solutions.

Application

The LSM6DSV16BXTR is a 6-axis MEMS inertial sensor combining a 3-axis accelerometer and a 3-axis gyroscope. It is used in various applications, including fitness tracking, health monitoring, augmented and virtual reality, robotics, automotive systems, and industrial automation. Its features enable motion detection, orientation sensing, and activity recognition, making it suitable for consumer electronics, wearable devices, and smart home applications.

Equivalent

The LSM6DSV16BXTR chip is part of STMicroelectronics' 6-axis IMU family. Equivalent products include the LSM6DS3, LSM6DS3H, and LSM6DSL, which also provide 3-axis accelerometer and 3-axis gyroscope functionalities. For similar performance, consider the InvenSense MPU-6050 or Bosch BNO055, although they may have different features and specifications. Always check specific datasheets for compatibility and requirements.

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