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LFE3-70EA-8FN1156I
IC FPGA 490 I/O 1156FBGA
- 製造商
- 製造商。 部分 #LFE3-70EA-8FN1156I
- 包 BBGA-1156
- 資料表 LFE3-70EA-8FN1156I DataSheet
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規格
| Package | Tray |
| Series | ECP3 |
| ProductStatus | Active |
| NumberofLABs/CLBs | 8375 |
| NumberofLogicElements/Cells | 67000 |
| TotalRAMBits | 4526080 |
| NumberofI/O | 490 |
| Voltage-Supply | 1.14V ~ 1.26V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 1156-BBGA |
概述
Description
LFE3-70EA-8FN1156I is a mid-to-high density FPGA from Lattice Semiconductor’s LFE3 family. The “70EA” denotes roughly 70K logic elements, making it suitable for complex digital logic, DSP, and interface-briding tasks. It comes in a FineLine BGA package with 1,156 pins (FN1156). The “-8” is the speed grade (fast), and the “I” indicates industrial temperature range (-40°C to 85°C).
Key resources typically include configurable logic, multiple I/O banks, embedded memory blocks, DSP slices, and clock-management/cPLL resources, enabling high-throughput, mixed-signal designs.
Design flow: use Lattice Radiant or Diamond design software, leverage the IP catalog, and configure/compile for programming via JTAG or flash.
Typical use cases: automotive/industrial controllers, data-path accelerators, custom high-speed interfaces, and prototyping.
Note: For exact resource counts (LEs, RAM, I/O, transceivers) and package specifics, consult the official datasheet for this exact revision.
Key resources typically include configurable logic, multiple I/O banks, embedded memory blocks, DSP slices, and clock-management/cPLL resources, enabling high-throughput, mixed-signal designs.
Design flow: use Lattice Radiant or Diamond design software, leverage the IP catalog, and configure/compile for programming via JTAG or flash.
Typical use cases: automotive/industrial controllers, data-path accelerators, custom high-speed interfaces, and prototyping.
Note: For exact resource counts (LEs, RAM, I/O, transceivers) and package specifics, consult the official datasheet for this exact revision.
Features
LFE3-70EA-8FN1156I features (concise):
- High-density LFE3 FPGA in FN1156 package (1156-ball BGA)
- Approximately 70k logic elements (LEs)
- Large I/O capability across multiple banks; supports LVTTL/LVCMOS and differential I/O (LVDS)
- On-chip memory: block RAM plus distributed RAM
- DSP/multiplier blocks for signal processing
- Rich clocking: multiple PLLs and robust clock management
- High-speed SERDES for data interfaces
- Power/temperature range: suitable for -40°C to 85°C environments
- Supported by Lattice tools: Radiant and Diamond (IP cores available)
- Applications: video, communications, embedded control, test/measurement
Note: exact specifications (LE count, RAM size, I/O counts) can vary by revision; consult the datasheet for precise figures.
- High-density LFE3 FPGA in FN1156 package (1156-ball BGA)
- Approximately 70k logic elements (LEs)
- Large I/O capability across multiple banks; supports LVTTL/LVCMOS and differential I/O (LVDS)
- On-chip memory: block RAM plus distributed RAM
- DSP/multiplier blocks for signal processing
- Rich clocking: multiple PLLs and robust clock management
- High-speed SERDES for data interfaces
- Power/temperature range: suitable for -40°C to 85°C environments
- Supported by Lattice tools: Radiant and Diamond (IP cores available)
- Applications: video, communications, embedded control, test/measurement
Note: exact specifications (LE count, RAM size, I/O counts) can vary by revision; consult the datasheet for precise figures.
Package
FineLine BGA (FN) package, 1156-ball.
Pinout
- Pin count: 1156 pins
- Function: Lattice LFE3 FPGA (70K logic-element device) in a FN1156 package (Fine-PGA/FPGA part).
- Function: Lattice LFE3 FPGA (70K logic-element device) in a FN1156 package (Fine-PGA/FPGA part).
Manufacturer
- Manufacturer: Lattice Semiconductor Corporation.
- What kind of company: A fabless semiconductor company that designs and sells programmable logic devices (FPGAs and CPLDs) and related software/IP.
- What kind of company: A fabless semiconductor company that designs and sells programmable logic devices (FPGAs and CPLDs) and related software/IP.
Application
Possible application areas for LFE3-70EA-8FN1156I include:
- High-speed serial interfaces and protocol bridging (SERDES)
- Video and image processing (HD/SDI, HDMI, camera interfaces)
- DSP and embedded control systems
- Industrial automation and machine vision (sensors, data acquisition)
- Automotive and consumer electronics (sensor processing, infotainment interfaces)
- High-speed serial interfaces and protocol bridging (SERDES)
- Video and image processing (HD/SDI, HDMI, camera interfaces)
- DSP and embedded control systems
- Industrial automation and machine vision (sensors, data acquisition)
- Automotive and consumer electronics (sensor processing, infotainment interfaces)
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