KLMAG2GEUF-B04P

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KLMAG2GEUF-B04P

16GB Memory (ICs) RoHS

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規格

Memory Size 16GB
NAND Operating Voltage (VCCF) 1.8V;3.3V
Operating temperature -40℃~+95℃

概述

Description

KLMAG2GEUF-B04P is a specific model of NAND flash memory chip produced by KIOXIA, designed for high-performance storage solutions in various applications, including consumer electronics, industrial devices, and enterprise equipment. This chip features advanced 3D NAND technology, which stacks memory cells vertically to enhance storage density, reliability, and speed.
Key attributes of KLMAG2GEUF-B04P include high read and write speeds, low power consumption, and durability, making it suitable for demanding tasks. It often supports interfaces like eMMC or UFS, enabling fast data transfer rates, which is essential for smooth operation in smartphones, tablets, and other portable devices.
Overall, the KLMAG2GEUF-B04P serves as a crucial component in modern computing, providing efficient and reliable storage solutions to meet the growing data demands of today’s technology.

Features

The KLMAG2GEUF-B04P is a 2GB LPDDR4X DRAM module designed for mobile applications and other low-power devices. Key features include:
1. Capacity: 2GB, suitable for various mobile computing needs.
2. Memory Type: LPDDR4X, offering enhanced performance and lower power consumption compared to earlier LPDDR versions.
3. Data Rate: Supports high-speed data transfer, improving overall device responsiveness.
4. Voltage: Operates at a low voltage of 0.6V, contributing to energy efficiency.
5. Form Factor: Typically comes in a compact package, making it ideal for space-constrained designs.
6. Thermal Performance: Designed to handle thermal conditions typical in mobile environments.
7. Applications: Commonly used in smartphones, tablets, and other portable electronics.
This combination of features makes the KLMAG2GEUF-B04P an effective choice for modern mobile devices requiring efficient, high-performance memory solutions.

Package

The KLMAG2GEUF-B04P is packaged in a BGA (Ball Grid Array) format, specifically a 200-ball configuration. This package type is commonly used for memory chips to ensure efficient heat dissipation and a compact design.

Pinout

The KLMAG2GEUF-B04P is a 2GB LPDDR4 memory chip manufactured by Samsung. It features a 48-pin package, typically in a BGA (Ball Grid Array) format.
The primary functions of this memory chip include providing high-speed data storage and access for mobile devices and other applications requiring efficient memory solutions. It supports a range of functionalities such as low power consumption, high data bandwidth, and improved performance in multitasking environments. The chip operates at a voltage of 1.1V and is designed to enhance the overall performance of smartphones, tablets, and other portable electronics.

Manufacturer

The KLMAG2GEUF-B04P is manufactured by Kioxia Corporation, a leading global provider of flash memory and solid-state drives (SSDs). Kioxia was formerly known as Toshiba Memory Corporation before it was rebranded in 2019. The company specializes in the development and production of NAND flash memory products, which are used in a variety of applications including consumer electronics, data centers, and enterprise storage solutions. Kioxia is recognized for its innovation in memory technology and its contributions to the advancement of storage solutions in the digital age.

Application

KLMAG2GEUF-B04P is a NAND flash memory chip commonly used in consumer electronics for applications such as smartphones, tablets, and laptops. It supports storage solutions in various devices, enabling high-speed data access and efficient performance in gaming consoles, digital cameras, and automotive applications. Additionally, it is utilized in industrial and IoT devices where reliable and fast data storage is essential.

Equivalent

The KLMAG2GEUF-B04P chip is a 2GB LPDDR4 DRAM memory module. Equivalent products may include Samsung K4F2E304EB-HC25, Micron MT53B512G64D4P, and Hynix H9HCNNN8GTMC. Always verify compatibility based on specific application requirements and manufacturer specifications.

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